Claims
- 1. A resin transfer molding process for preparing a matrix resin composite, comprising the steps of:
- (1) preparing a preform comprising a tackifier of a curable resin and two or more layers of reinforcing material by:
- (a) applying the tackifier to at least one layer of the reinforcing material,
- (b) compressing the layers of reinforcing material (i) at a first pressure greater than atmospheric pressure and (ii) then at a second pressure which is substantially higher than the first pressure to compact the tackified, reinforcing layers to a volume which is less than their volume in the matrix resin composite while subjecting the layers of tackified, reinforced material, during compression, to a temperature sufficient to melt and partially crosslink the tackifier at conditions such that at least one surface of each of the reinforcing layers is or will be, during the partial crosslinking, in direct contact with the tackifier,
- (c) reducing the pressure to a third pressure which is lower than the second pressure while cooling the partially crosslinked, tackifier, reinforcing material to a temperature sufficient to solidify the tackifier; and
- (2) contacting the preform with a matrix resin which is a curable resin the same or different than the tackifier under conditions such that the tackifier and matrix resins are cured, thereby forming the matrix resin composite.
- 2. The process of claim 1, wherein the matrix resin and the tackifier resin are substantially the same.
- 3. The process of claim 1, wherein the tackifier comprises a bismaleimide resin.
- 4. The process of claim 1 wherein the tackifier comprises an epoxy resin and a suitable curing agent.
- 5. The process of claim 1 wherein the first pressure is from about 5 to about 50 psig, the second pressure is from about 25 to about 500 psig, and the third pressure is from about 5 to about 50 psig.
- 6. The process of claim 1 wherein the third pressure is initially applied before the preform begins to cool and is maintained until the preform reaches a sufficiently low temperature to solidify the tackifier.
- 7. The process of claim 1 wherein the preforming temperature is from about 27.degree. to about 204.degree. C.
CROSS-REFERENCE TO RELATED APPLICATION
This is a continuation of application Ser. No. 08/330,899, filed Oct. 28, 1994, now abandoned.
US Referenced Citations (14)
Foreign Referenced Citations (4)
Number |
Date |
Country |
53-143665 |
Dec 1978 |
JPX |
56-163173 |
Dec 1981 |
JPX |
59-008374 |
Feb 1984 |
JPX |
2158471 |
Nov 1985 |
GBX |
Continuations (1)
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Number |
Date |
Country |
Parent |
330899 |
Oct 1994 |
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