Claims
- 1. A conductive coating material consisting of solution or dispersion in a solvent of
- (a) conductive fine particles obtained by pulverizing calcined particles having a specific surface area of less than 50 m.sup.2 /g prepared by hydrolyzing a hydrolyzable tin containing or indium containing compound in an aqueous solution while controlling the pH of said solution substantially constant within the range of 8-12, so that an aqueous sol containing colloidal particles may be formed, followed by separation, drying and calcination of the colloidal particles, and
- (b) a binder resin.
- 2. The coating material as set forth in claim 1 wherein the tin containing compound is potassium stannate or sodium stannate, and the indium containing compound is indium nitrate or indium sulfate.
- 3. The coating material as set forth in claim 1 wherein the temperature at which the hydrolysis is carried out is 30.degree.-90.degree. C.
- 4. The coating material as set forth in claim 1 wherein the proportion of (a) the conductive fine particles to (b) the binder resin is 40-90% by weight based on the total weight of (a) and (b).
- 5. The coating material as set forth in claim 1 wherein the conductive fine particles have an average particle diameter of between 0.05 and 0.4 .mu.m.
- 6. A substrate having on the surface thereof a transparent conductive coating formed from a conductive coating material comprising solution or dispersion in a solvent of
- (a) conductive fine particles obtained by pulverizing calcined particles having a specific surface area of less than 50 m.sup.2 /g prepared by hydrolyzing a hydrolyzable tin containing or indium containing compound in an aqueous solution while controlling the pH of said solution substantially constant within the range of 8-12, so that an aqueous sol containing colloidal particles may be formed, followed by separation, drying and calcination of the colloidal particles, and
- (b) a binder resin.
- 7. The substrate as set forth in claim 6 wherein the tin containing compound is potassium stannate or sodium stannate, and the indium containing compound is indium nitrate or indium sulfate.
- 8. The substrate as set forth in claim 6 wherein the temperature at which the hydrolysis is carried out is 30.degree.-90.degree. C.
- 9. The substrate as set forth in claim 6 wherein the proportion of (a) the conductive fine particles to (b) the binder resin is 40-95% by weight based on the total weight of (a) and (b).
- 10. The substrate as set forth in claim 6 wherein the conductive fine particles have an average particle diameter of between 0.05 and 0.4 .mu.m.
Priority Claims (3)
Number |
Date |
Country |
Kind |
61-50233 |
Mar 1986 |
JPX |
|
61-179607 |
Jul 1986 |
JPX |
|
61-305906 |
Dec 1986 |
JPX |
|
Parent Case Info
This application is a continuation of now abandoned application, Ser. No. 07/501,248 filed on Mar. 29, 1990, which in turn is a divisional of application Ser. No. 07/346,295, filed May 1, 1989, now U.S. Pat. No. 4,937,148 which in turn is a continuation of application Ser. No. 07/021,482, filed on Mar. 4, 1987, abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (5)
Number |
Date |
Country |
58-36925 |
Mar 1983 |
JPX |
60-46925 |
Mar 1985 |
JPX |
60-65724 |
Apr 1985 |
JPX |
61-9468 |
Jan 1986 |
JPX |
61-205624 |
Sep 1986 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Chem. Abstract 102: 118370y Hashimoto et al. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
346295 |
May 1989 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
501248 |
Mar 1990 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
21482 |
Mar 1987 |
|