Claims
- 1. A size-selective electrochemical process for preparing soluble transition metal colloids or bimetallic colloids, said metal colloids or bimetallic colloids being stabilized by solvents exclusively and having particle sizes ranging from 1 to 15 nm, said process comprising electrochemically reducing transition metal salts in the presence of a polar stabilizing solvent to form said metal colloids or bimetallic colloids.
- 2. The process according to claim 1, wherein said transition metal salts are electrochemically reduced at the cathode.
- 3. The process according to claim 2, wherein said transition metal salts are generated by electrochemical dissolution of a metal sacrificial anode.
- 4. The process according to claim 2, wherein two different metal salts are reduced at the cathode to form bimetallic colloids.
- 5. The process according to claim 4, wherein one of the two metal salts is generated by dissolution of a metal sacrificial anode.
- 6. The process according to claim 2, wherein different particle size distributions are obtained by utilizing different conducting salts.
- 7. The process according to claim 1, characterized by utilizing metals of groups IIIb, IVb, Vb, VIIb, VIII, Ib, IIb, IIIa, IVa or Va of the Periodic Table.
- 8. The process according to claim 1, characterized in that organic carbonates or urea derivatives are utilized as the polar solvent serving as a colloid stabilizer in the preparation of the metal colloid.
- 9. A process for the fixing of preformed metal clusters to supports, comprising coating solvent-stabilized metal colloids prepared according to claim 1 onto solid supports to form shell catalysts.
- 10. A process for the catalytic formation of C—C bonds, comprising conducting a Heck reaction in the presence of a catalyst, said catalyst comprising solvent-stabilized Pd colloids prepared according to claim 1.
- 11. A size-selective process for preparing soluble transition metal colloids or bimetallic colloids, said metal colloids or bimetallic colloids being stabilized by solvents exclusively and having particle sizes ranging from 1 to 15 nm, said process comprising reducing transition metal salts by heating said transition metal salts in the presence of a polar stabilizing solvent and an alcohol as a reductant to form said metal colloids or bimetallic colloids.
- 12. The process according to claim 11, wherein different particle size distributions are obtained by utilizing different alcohols as reductants.
- 13. The process according to claim 11, characterized by utilizing metals of groups IIIb, IVb, Vb, VIIb, VIII, Ib, IIb, IIIa, IVa or Va of the Periodic Table.
- 14. The process according to claim 11, characterized in that organic carbonates or urea derivatives are utilized as the polar solvent serving as a colloid stabilizer in the preparation of the metal colloid.
- 15. A process for the fixing of preformed metal clusters to supports, comprising coating solvent-stabilized metal colloids prepared according to claim 11 onto solid supports to form shell catalysts.
- 16. A process for the catalytic formation of C—C bonds, comprising conducting a Heck reaction in the presence of a catalyst, said catalyst comprising solvent-stabilized Pd colloids prepared according to claim 11.
Priority Claims (1)
Number |
Date |
Country |
Kind |
196 30 581 |
Jul 1996 |
DE |
|
Parent Case Info
This application is a 371 of PCT/EP97/03807 filed on Jul. 16, 1997.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
102e Date |
371c Date |
PCT/EP97/03807 |
|
WO |
00 |
1/25/1999 |
1/25/1999 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO98/04763 |
2/5/1998 |
WO |
A |
US Referenced Citations (6)
Foreign Referenced Citations (2)
Number |
Date |
Country |
347114 |
Dec 1989 |
EP |
672765 |
Sep 1995 |
EP |