Claims
- 1. A process for producing an anisotropic conductive film, which comprises:
- (1) a step in which fine through-holes are provided in only an insulating film of a laminated film comprising said insulating film and a conductive layer, or a conductive layer is laminated on an insulating film previously having fine through-holes therein);
- (2) a step in which said conductive layer positioned at the bottom of said through-holes is etched to form a rivet-like dent;
- (3) a step in which a metallic substance is filled in said fine through-holes and said rivet-like dent, and further deposited to form bump-like projections by plating; and
- (4) a step in which said conductive layer laminated on said insulating film is removed by chemical etching or electrolytic corrosion.
- 2. A process for producing an anisotropic conductive film, which comprises:
- (1) a step in which fine through-holes are provided in only an insulating film of a laminated film comprising said insulating film and a conductive layer, or a conductive layer is laminated on an insulating film previously having fine through-holes therein;
- (2) a step in which said conductive layer positioned at the bottom of said through-holes is etched to form a rivet-like dent;
- (3) a step in which a metallic substance is filled in said fine through-holes and said rivet-like dent by plating;
- (4) a step in which said conductive layer laminated on said insulating film is removed by chemical etching or electrolytic corrosion; and
- (5) a step in which said metallic substance is further deposited to form bunp-like projections by plating.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1-330052 |
Dec 1989 |
JPX |
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Parent Case Info
This is a divisional of application No. 07/629,897 filed Dec. 19. 1990, now U.S. Pat. No. 5,136,359.
US Referenced Citations (7)
Divisions (1)
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Number |
Date |
Country |
Parent |
629897 |
Dec 1990 |
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