Claims
- 1. A process for producing a high strength poly-m-phenylene isophthalamide fiber having a birefringence of from 0.18 to 0.22, a degree of crystallinity of from 45% to 55%, a crystalline size of from 35 to 45 angstroms, a tensile strength of 6.5 g/denier or more and a silk factor of 35 or more, comprising the steps of;
- extruding a dope solution of an m-phenylene isophthalamide polymer containing at least 95 molar % of recurring m-phenylene isophthalamide units and having an intrinsic viscosity ([.eta.]) of from 0.7 to 2.5, determined at a concentration of 0.5 g/100 ml in dehydrated N-methyl-2-pyrrolidone at a temperature of 30.degree. C., in an organic solvent through a spinneret having at least one spinning orifice, into a coagulating liquid to form at least one undrawn polymer filament;
- making a first adjustment of the content of the organic solvent in the undrawn filament to a level of from 15% to 30% based on the weight of the polymer in the filament;
- carrying out a first wet drawing of the first organic solvent content-adjusted undrawn filament at a draw ratio of from 1.1 to 1.5 in at least one aqueous wet drawing bath;
- making a second adjustment of the content of the organic solvent in the filament to a level of less than 15% based on the weight of the polymer in the filament;
- carrying out a second wet drawing of the second organic solvent content-adjusted filament at a draw ratio of 1.1 or more in at least one aqueous wet drawing bath;
- drying the second wet drawn filament; and
- dry drawing the dried filament to an extent such that the entire draw ratio in the first and second wet drawing and dry drawing operations is in the range of from 4.0 to 7.0.
- 2. The process as claimed in claim 1, wherein the organic solvent consists of at least one member selected from the group consisting of N-methyl-2-pyrrolidone, N,N-dimethylacetamide, and N,N-dimethylformamide.
- 3. The process as claimed in claim 1, wherein the first organic solvent content-adjusting operation is carried out, in at least one step, by bringing the filament into contact with at least one first aqueous washing liquid containing 10% to 40% by weight of the same organic solvent as that contained in the dope solution.
- 4. The process as claimed in claim 1, wherein the first organic content-adjusting operation is carried out at a temperature of from 20.degree. C. to 70.degree. C.
- 5. The process as claimed in claim 1, wherein the first wet drawing operation is carried out while the content of the organic solvent remaining in the filament is reduced to a level of not less than 15% based on the weight of the polymer in the filament.
- 6. The process as claimed in claim 1, wherein the first wet drawing operation is carried out at a temperature of from 50.degree. C. to 95.degree. C.
- 7. The process as claimed in claim 1, wherein the at least one aqueous drawing bath contains the same organic solvent as that contained in the dope solution in a concentration of 3 to 30% by weight.
- 8. The process as claimed in claim 1, wherein the first wet drawing operation is carried out in two steps, in a first aqueous wet drawing bath containing 10 to 30% by weight of the same organic solvent as that contained in the dope solution, at a draw ratio of 1.1 to 1.4 at a temperature of 50.degree. C. to 70.degree. C., and then in a second aqueous wet drawing bath containing the same organic solvent as that contained in the dope solution, in a concentration of 5% to 15% by weight but not more than that of the first aqueous wet drawing bath, at a draw ratio necessary to obtain the total draw ratio of 1.1 to 1.5, at a temperature of 70.degree. C. to 90.degree. C.
- 9. The process as claimed in claim 1, wherein the second organic solvent content-adjusting operation is carried out, in at least one step, by bringing the filament into contact with at least one second aqueous washing liquid.
- 10. The process as claimed in claim 1, wherein the second organic solvent content-adjusting operation is carried out at a temperature of 60.degree. C. to 100.degree. C.
- 11. The process as claimed in claim 1, wherein the second wet drawing operation is carried out at a draw ratio of 1.5 to 3.0.
- 12. The process as claimed in claim 1, wherein the second wet drawing operation is carried out while the organic solvent remaining in the filament is removed in the at least one aqueous wet drawing bath.
- 13. The process as claimed in claim 1, wherein the second wet drawing operation is carried out at a temperature of from 50.degree. C. to 95.degree. C.
- 14. The process as claimed in claim 1, wherein the dry drawing operation is carried out at a temperature of from 300.degree. C. to 400.degree. C.
- 15. The process as claimed in claim 1, wherein the dry drawing operation is carried out at a draw ratio of 1.5 to 2.5.
- 16. The process as claimed in claim 1, wherein the second wet drawing operation is followed by at least one final washing operation.
Priority Claims (1)
Number |
Date |
Country |
Kind |
60-276934 |
Dec 1985 |
JPX |
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Parent Case Info
This application is a division of application Ser. No. 937,341 filed Dec. 3, 1986 now abandoned.
US Referenced Citations (13)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0229395 |
Aug 1958 |
AUX |
1482822 |
Jun 1965 |
FRX |
Divisions (1)
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Number |
Date |
Country |
Parent |
937341 |
Dec 1986 |
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