Claims
- 1. Process for reducing contaminating amounts of isopropyl alcohol from diisopropyl ether which process comprises
- contacting diisopropyl ether containing up to about 10% by weight of isopropyl alcohol in a contact zone at a temperature from about 10.degree. to about 30.degree. C. and a pressure from about 1 to about 3 atmospheres with a bed of strong acid type cation exchange resin, said resin being in the hydrogen ion form and having a surface area of at least about 40 square meters per gram, to sorb said alcohol,
- passing diisopropyl ether having reduced contaminant from said contact zone, and
- intermittently regenerating said resins with water to displace the isopropyl alcohol from the resin, followed by removal of said water from said resin at an elevated temperature up to about 80.degree. C.
- 2. Process as in claim 1, wherein said resin contains sulfonic acid groups.
- 3. Process as in claim 1, wherein said resin has a mean pore diameter in the range from about 40 to about 250 Angstroms.
- 4. Process as in claim 1, wherein said resin has a mean pore diameter in the range from about 40 to about 80 Angstroms.
- 5. Process as in claim 1 wherein said diisopropyl ether contains less than about 5% by weight of isopropyl alcohol.
- 6. Process as in claim 1 wherein said resin has a surface area of at least about 400 square meters per gram.
Parent Case Info
This application is a continuation-in-part application of our copending application Ser. No. 07/345,583 filed May 1, 1989, now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1459242 |
Dec 1976 |
GBX |
1574035 |
Sep 1980 |
GBX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
345583 |
May 1989 |
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