Claims
- 1. A process for reducing the pressure buildup in an automobile radiator which is comprised of a bottom section, a radiator header, a multiplicity of tubes communicating between said bottom section and said radiator header, and a heat expansion chamber disposed at least about 0.5 inches above said radiator header and connected to said radiator header by a conduit, comprising the steps of simultaneously:
- (a) flowing hot fluid at a temperature of at least about 200 degrees Fahrenheit through said multiplicity of tubes, wherein said hot fluid is a mixture of water and ethylene glycol;
- (b) preventing said hot fluid from flowing into said heat expansion chamber, wherein:
- 1. said heat expansion chamber is made from a material with a resistivity at 20 degrees Centigrade greater than about 6 microhms-centimeters, and
- 2. material within said heat expansion chamber has a resistivity at 20 degrees Centigrade of from about 6 to about 40 microhoms-centimeter; and
- (c) maintaining said hot fluid at a pressure of about 1.0 pound per square inch gauge or less.
- 2. The process as recited in claim 1, wherein said conduit has a substantially cylindrical shape.
- 3. The process as required in claim 2, wherein said conduit has an inner diameter of from about 0.1 to about 0.5 inches.
- 4. The process as recited in claim 1, wherein said heat expansion chamber has a substantially cylindrical shape.
- 5. The process as recited in claim 4, wherein the ratio of the diameter of said heat expansion chamber to its height is from about 0.8/1 to about 5.0/1.
- 6. The process as recited in claim 1, wherein said heat expansion chamber has a length of 14.5 inches, a height of 2.0 inches, and a width of 2.0 inches.
- 7. The process as recited in claim 1, wherein said heat expansion chamber has a volume which is from about 10 to about 20 percent of the volume of said hot fluid.
- 8. The process as recited in claim 1, wherein said heat expansion chamber is disposed at least 1.0 inches above said radiator header.
- 9. The process as recited in claim 8, wherein the bottom surface of said heat expansion chamber is substantially parallel to the top surface of said radiator header.
- 10. The process as recited in claim 1, wherein said heat expansion chamber is operatively connected to a pressure relief valve.
- 11. The process as recited in claim 10, wherein said pressure relief valve is connected to the top of said heat expansion chamber.
CROSS-REFERENCE TO RELATED PATENT APPLICATION
This application is a continuation-in-part of applicant's copending patent application U.S. Ser. No. 08/560,366, filed on Nov. 17, 1995, now abandoned.
US Referenced Citations (8)
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
560366 |
Nov 1995 |
|