Claims
- 1. A process for the electroless deposition of metal on a non-metallic surface, said process comprising the steps of:
- (a) pre-sensitizing the non-metallic surface to the electroless deposition of metal by contacting said non-metallic surface with a liquid medium comprising an admixture of a polar liquid, a halide, cupric ions and cuprous ions in a weight ratio of cuprous ions to cupric ions of at least 0.4:1;
- (b) Rinsing said contacted surface with an aqueous solution and forming an adherent water-insoluble derivative of said liquid medium adsorbed on said non-metallic surface;
- (c) treating said rinsed surface with an electroless metal deposition bath containing a reducing agent to render said insoluble derivative catalytic to the electroless deposition of metal; and
- (d) contacting said catalytically sensitive surface with an electroless metal deposition bath to form an electroless deposit of metal thereon.
- 2. A process according to claim 1, wherein said reducing agent includes at least one member selected from the group consisting of borohydrides, amine boranes and hydrazine hydrate.
- 3. A process according to claim 1, wherein said liquid medium also contains a stabilizer.
- 4. A process according to claim 1, wherein said liquid medium also contains a wetting agent.
Parent Case Info
This application is a continuation of application Ser. No. 796,809, filed May 13, 1977, now U.S. Pat. No. 4,199,623, as a continuation of application Ser. No. 520,355, filed Nov. 1, 1974, now abandoned, in turn, a continuation-in-part of application Ser. No. 407,555 filed Oct. 18, 1973 and application Ser. No. 270,861, filed July 11, 1972.
US Referenced Citations (11)
Related Publications (1)
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Date |
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270861 |
Jul 1972 |
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Continuations (2)
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Date |
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796809 |
May 1977 |
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Parent |
520355 |
Nov 1974 |
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Continuation in Parts (1)
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407555 |
Oct 1973 |
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