Claims
- 1. A process for stabilizing organic additives in an electrolytic solution while electroplating copper, said process comprising the steps of:
- forming a protective film on a first surface of an anode, said first surface closer to a cathode than a second surface of said anode; and
- minimizing contact between said second surface and said electrolytic solution.
- 2. The process of claim 1, wherein the electrolytic solution is contained in a plating tank and the step of minimizing contact between said second surface and said electrolytic solution comprises disposing said anode in an anode housing such that said first surface is in contact with said electrolytic solution and said electrolytic solution is substantially prevented from flowing to said second surface.
- 3. The process of claim 2, wherein the step of disposing said anode within said anode housing comprises forming at least one groove in said anode housing and fitting said anode in said groove.
- 4. The process of claim 3, wherein said anode housing includes a sealing back plate which abuts against said second surface.
- 5. The process of claim 1, wherein said anode is a copper and phosphorous anode, and the step of forming the protective film comprises:
- dissolving chloride ions in said electrolytic solution; and
- passing current to said anode and through said electrolytic solution to form said protective film consisting of a cuprous chloride layer on said first surface.
- 6. The process of claim 1, wherein said electrolytic solution includes dissolved metal ions and said method further comprises, after the step of forming the protective film, passing a current to said anode and through said electrolytic solution to cause plating of metal on said cathode.
- 7. The process of claim 1 further comprising protecting said protective film from mechanical agitation.
- 8. The process of claim 1 further comprising providing an anode bag across the front of said first surface of said anode on which said protective film is formed.
Parent Case Info
This application is a divisional application of U.S. patent application Ser. No. 08/908,505, filed on Aug. 7, 1997, still pending.
US Referenced Citations (12)
Foreign Referenced Citations (1)
Number |
Date |
Country |
58-177488 |
Oct 1983 |
JPX |
Non-Patent Literature Citations (2)
Entry |
Lawrence J. Durney, Electroplating Engineering Handbook, 4th Edition, pp. 235-240 and pp. 660-662, 1984. month not available. |
William H. Safranek, "Acid Copper Electroplating and Electroforming," Modern Electroplating, 3rd Edition, pp. 182-203, 1974. month not available. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
908505 |
Aug 1997 |
|