Claims
- 1. A ring-shaped bonded magnet having a film layer made of a fine metal powder on the entire surface thereof, which is produced by a surface treating process comprising bringing a fine metal powder producing material into flowing contact with the surface of said ring-shaped bonded magnet, thereby adhering a fine metal powder produced from said fine metal powder producing material to the surface of said ring-shaped bonded magnet.
- 2. The ring-shaped bonded magnet according to claim 1, wherein said ring-shaped bonded magnet having the film layer made of the fine metal powder on the entire surface thereof has an L/D value equal to or larger than 1, wherein L represents a length of said magnet in a direction of a center axis of said magnet, and D represents an inside diameter of said magnet.
- 3. The ring-shaped bonded magnet having a plated film according to claim 1 or 2, which is produced by subjecting the ring-shaped bonded magnet having a film layer made of a fine metal powder on the entire surface thereof to an electroplating treatment.
- 4. A ring-shaped bonded magnet having a surface and comprising an outer layer consisting essentially of a fine metal powder on the entire surface thereof.
- 5. The ring-shaped bonded magnet according to claim 4, wherein said ring-shaped bonded magnet has an L/D value equal to or larger than 1, wherein L represents a length of said magnet in a direction of a center axis of said magnet, and D represents an inside diameter of said magnet.
- 6. A ring-shaped bonded magnet having a surface and comprising an outer layer consisting of a fine metal powder on the entire surface thereof.
- 7. The ring-shaped bonded magnet according to claim 6, wherein said ring-shaped bonded magnet has an L/D value equal to or larger than 1, wherein L represents a length of said magnet in a direction of a center axis of said magnet, and D represents an inside diameter of said magnet.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-51935 |
Feb 1999 |
JP |
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Parent Case Info
This is a divisional application Ser. No. 09/512,655, filed Feb. 24, 2000 now U.S. Pat. No. 6,355,313.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
3013892 |
Songas |
Dec 1961 |
A |
5360527 |
Ribitch |
Nov 1994 |
A |
5649362 |
Yamamoto et al. |
Jul 1997 |
A |
Foreign Referenced Citations (9)
Number |
Date |
Country |
1 024 506 |
Aug 2000 |
EP |
1 132 497 |
Sep 2001 |
EP |
3-87377 |
Apr 1991 |
JP |
07-302705 |
Nov 1995 |
JP |
11003811 |
Jan 1999 |
JP |
11-195515 |
Jul 1999 |
JP |
11-233324 |
Aug 1999 |
JP |
11-238641 |
Aug 1999 |
JP |
11-260614 |
Sep 1999 |
JP |