Claims
- 1. A process for synthesizing a trans-styrene-diene rubber which comprises a conjugated diolefin monomer and styrene monomer in the presence of a catalyst system which is comprised of (a) an organolithium compound, (b) a barium compound selected from the group consisting of (i) a barium salt of a di-alkylated cyclohexanol, and (ii) barium thymol, and (c) an organoaluminum compound.
- 2. A process for synthesizing trans-styrene-diene rubber which comprises polymerizing a conjugated diolefin monomer and styrene monomer in the presence of a catalyst system which is comprised of (a) an organolithium compound, (b) a barium compound selected from the group consisting of (i) a barium salt of a di-alkylated cyclohexanol, and (ii) barium thymol, (c) an organoaluminum compound, and (d) a lithium salt of a cyclic alcohol.
- 3. A process as specified in claim 1 wherein the polymerization temperature is within the range of about 20° C. to about 120° C.
- 4. A process as specified in claim 1 wherein the polymerization temperature is within the range of about 40° C. to about 100° C.
- 5. A process as specified in claim 1 wherein the polymerization temperature is within the range of about 60° C. to about 90° C.
- 6. A process as specified in claim 3 wherein the molar ratio of the organoaluminum compound to the organolithium compound is within the range of about 0.3:1 to about 8:1.
- 7. A process as specified in claim 6 wherein the molar ratio of the barium compound to the organoaluminum compound is within the range of about 0.1:1 to about 1.8:1.
- 8. A process as specified in claim 4 wherein the molar ratio of the organoaluminum compound to the organolithium compound is within the range of about 0.5:1 to about 5:1.
- 9. A process as specified in claim 8 wherein the molar ratio of the barium compound to the organolithium compound is within the range of about 0.15:1 to about 1.2:1.
- 10. A process as specified in claim 5 wherein the molar ratio of the organoaluminum compound to the organolithium compound is within the range of about 1.2:1 to about 2:1.
- 11. A process as specified in claim 10 wherein the molar ratio of the barium compound to the organolithium compound is within the range of about 0.2:1 to about 0.6:1.
- 12. A process as specified in claim 7 wherein the organolithium compound is an alkyl lithium compound.
- 13. A process as specified in claim 12 wherein the barium compound is a barium salt of a di-alkylated cyclohexanol.
- 14. A process as specified in claim 12 wherein the barium compound is barium mentholate.
- 15. A process as specified in claim 12 wherein the barium compound is barium thymolate.
- 16. A process as specified in claim 15 wherein the copolymerization is conducted in a hydrocarbon solvent.
- 17. A process as specified in claim 16 wherein the organolithium compound is an organomonolithium compound.
- 18. A process as specified in claim 17 wherein the copolymerization is conducted at a temperature which is within the range of about 40° C. to about 100° C.
- 19. A process as specified in claim 18 wherein the organomonolithium compound is utilized at a level which is within the range of 0.01 phm to 1 phm.
- 20. A process as specified in claim 1 wherein the cojugated diolefin monomer is 1,3-butadiene and wherein the trans-styrene-diene rubber is trans-styrene-butadiene rubber.
- 21. A process as specified in claim 1 wherein the cojugated diolefin monomer is isoprene and wherein the trans-styrene-diene rubber is trans-styrene-isoprene rubber.
- 22. A process as specified in claim 1 wherein the cojugated diolefin is a mixture of isoprene and 1,3-butadiene and wherein the trans-styrene-diene rubber is trans-styrene-isoprene-butadiene rubber.
- 23. A process as specified in claim 1 wherein the organoaluminum compound is selected from the group consisting of triethyl aluminum, tri-n-propyl aluminum, triisobutyl aluminum, trihexyl aluminum and diisobutyl aluminum hydride.
Parent Case Info
[0001] This is a continuation-in-part of U.S. patent application Ser. No. 09/730,257, filed Dec. 5, 2000, now pending, which claims the benefit of U.S. Provisional Application Serial No. 60/174,151, filed on Dec. 31, 1999.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60174151 |
Dec 1999 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09730257 |
Dec 2000 |
US |
Child |
10178493 |
Jun 2002 |
US |