Claims
- 1. An expansion valve comprising a closure member coupled to a displaceable wall separating a pressure chamber from a sensor chamber comprising at least part of a sensor system holding a charge for generating a temperature-dependent pressure, the closure member opening a passage between an inlet and an outlet of the expansion valve upon displacement of the wall into the pressure chamber, the valve further comprising a heater in thermal contact with the sensor system and a heat transfer path from the heated sensor system to a surface in fluid communication with liquid expanded refrigerant.
- 2. An expansion valve according to claim 1 in which said surface comprises a portion of an outlet of the expansion valve.
- 3. An expansion valve according to claim 1 in which said surface comprises at least a portion of said displaceable wall.
- 4. An expansion valve according to claim 1 in which said surface comprises a portion of a fluid circuit bypassing the expansion valve.
- 5. An expansion valve according to claim 1 in which said sensor system includes a sensor located at an outlet of the expansion valve, said heater being in thermal contact with said sensor.
- 6. An expansion valve according to claim 5 in which said heater is located beneath the sensor of said sensor system.
- 7. An expansion valve according to claim 1 in which said sensor chamber comprises said sensor system, and said heater is mounted on said sensor chamber.
Priority Claims (1)
Number |
Date |
Country |
Kind |
40 05 728 A1 |
Nov 1996 |
DEX |
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RELATED APPLICATION
This application is a division of U.S. patent application Ser. No. 08/971,784, filed Nov. 17, 1997, now U.S. Pat. No. 5,921,098.
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5148978 |
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5515695 |
Sakakibara et al. |
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Divisions (1)
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Number |
Date |
Country |
Parent |
971284 |
Nov 1997 |
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