Claims
- 1. In a process for the electrolytic deposition of copper at a cathode from an electrolytic bath at an effective temperature by passing an electric current and a suitable current density through said bath between an anode and a cathode, the improvement wherein:
- the current flow is periodically reversed and has a forward pulse time of 2 to 9 seconds and a reverse pulse time of 0.1 to 0.45 seconds;
- the ratio of the metal-deposition current to the reverse current is between 10:1 and 1:1;
- the anode has the following composition:
- 98. 5 to 99.0% by weight copper
- 0.35 to 0.40% by weight nickel
- about 0.20% by weight arsenic
- about 0.15% by weight lead, and
- about 0.04% by weight antimony; and
- the bath is aqueous and consists essentially of:
- 40 to 48 g/l copper
- 150 to 200 g/l sulfuric acid
- 2 to 10 g/l arsenic; and
- 15 to 25 g/l nickel.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9732/75 |
Dec 1975 |
ATX |
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CROSS REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of Ser. No. 741,414 filed 12 Nov., 1976, now abandoned.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
2451341 |
Jernstedt |
Oct 1948 |
|
3535218 |
Brown et al. |
Oct 1970 |
|
3824162 |
Sakai et al. |
Jul 1974 |
|
3864227 |
Brytczuk et al. |
Feb 1975 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
741414 |
Nov 1976 |
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