Claims
- 1. Device for depositing a coating of an electronic conductor compound, comprising:
at least one depositing zone in which a deposit of an electronic conductor element may be formed on a substrate, said depositing zone being followed by at least one reaction zone separated from said depositing zone, said reaction zone comprising means for achieving implantation in the deposit of electronic conductor element of particles capable of reacting with the deposit of electronic conductor element to form an electronic conductor compound, and means for moving said substrate from said depositing zone to said reaction zone.
- 2. Device according to claim 1, characterized in that means are provided for applying, at least in the reaction zone, to the substrate a negative potential with regard to an anode installed in this zone facing the substrate.
- 3. Device according to claim 1, characterized in that the aforesaid depositing zone comprises a device allowing to create an evaporation, preferably in a vacuum, followed by a condensation of the element onto the substrate.
- 4. Device according to claim 2, characterized in that the aforesaid depositing zone comprises a device allowing to create an evaporation, preferably in a vacuum, followed by a condensation of the element onto the substrate.
- 5. Device according to claim 1, characterized in that the depositing zone comprises a target presenting a surface layer oriented toward the substrate and containing the element to be deposited onto the latter, means being provided for forming a deposit of this element from this target by cathode sputtering.
- 6. Device according to claim 2, characterized in that the depositing zone comprises a target presenting a surface layer oriented toward the substrate and containing the element to be deposited onto the latter, means being provided for forming a deposit of this element from this target by cathode sputtering.
- 7. Device according to claim 1, characterized in that it comprises, in the reaction zone, means permitting the ionization of gas particles which may be implanted into the deposit of the aforesaid electronic conductor element.
- 8. Device according to claim 2, characterized in that it comprises, in the reaction zone, means permitting the ionization of gas particles which may be implanted into the deposit of the aforesaid electronic conductor element.
Priority Claims (1)
Number |
Date |
Country |
Kind |
09600637 |
Jul 1996 |
BE |
|
Parent Case Info
[0001] This is a division of parent application Ser. No. 08/893,578, filed Jul. 11, 1997, which will issue as U.S. Pat. No. 6,171,659 on Jan. 9, 2001.
Divisions (1)
|
Number |
Date |
Country |
Parent |
08893578 |
Jul 1997 |
US |
Child |
09754401 |
Jan 2001 |
US |