The present invention refers to a process for the formation of dental prostheses.
Another object of the present invention is a process for making wafers and/or similar structures, in particular for the formation of dental prostheses and/or of support structures for dental prostheses, such as bridges and/or similar.
Another object of the present invention is a dental wafer and/or a similar structure for the formation of dental prostheses, in particular on material removal CNC centres and/or machines.
The present invention is suitable for being used in the field of dentistry and/or orthodontics and, in particular, it refers to dental prostheses intended to partially and/or totally replace the natural dental arches of patients and/or to support structures of such prostheses, like for example bridges and/or similar.
In detail, the present invention refers to dental wafers and/or to dental tablets and/or to similar structures, called in the field by the technical term “pre-forms” or “high-density pre-forms”, intended for apparatuses for the formation of dental prostheses that operate by removal of material, like for example pantographs or CNC CAD-CAM centres and/or machines.
Generally, dental wafers are monolithic elements of substantially disc-shaped configuration from which it is possible to obtain, by removal of material, dental prostheses, bridges and/or circular, semi-circular and/or arched structures.
Among the various dental wafers that can be found on the market there are wafers made of zirconium, polymethyl methacrylate (Pmma) and modelling wax and similar.
However, it should be noted that it is not possible to obtain or form a high-performance dental prosthesis, in other words having high mechanical strength, hardness, solidity and lightness, from the aforementioned wafers. The Applicant has found that the wafers spread on the market are made through materials that cannot give them high performance in relation to mechanical strength, hardness, solidity and lightness.
The main purpose of the present invention is to solve the problems encountered in the prior art.
A purpose of the present invention is to provide dental prostheses and/or support structures for dental prostheses having high mechanical strength.
A further purpose of the present invention is to propose dental prostheses and/or support structures for dental prostheses having high hardness.
Another purpose of the present invention is to provide a dental prosthesis and/or support structures for dental prostheses that is particularly solid.
A further purpose of the present invention is to propose a dental prosthesis and/or support structures for dental prostheses that is rather light.
Another purpose of the present invention is to provide dental wafers and/or similar structures from which it is possible to obtain, by removal of material, dental prostheses and/or support structures for dental prostheses having high mechanical strength, hardness, solidity and lightness.
The purposes specified above, and others still, are substantially accomplished by a process for the formation of dental prostheses and/or support structures for dental prostheses, a process for making wafers and/or similar structures, in particular for the formation of dental prostheses and/or support structures for dental prostheses, such as bridges and/or similar, as well as a dental wafer and/or a similar structure for the formation of dental prostheses, in particular on material removal CNC centres and/or machines, as expressed and described in the following claims.
Now follows, as an example, the description of a preferred, but not exclusive embodiment of a process for the formation of dental prostheses and/or support structures for dental prostheses, of a process for making wafers and/or similar structures, in particular for the formation of dental prostheses and/or support structures for dental prostheses, such as bridges and/or similar, as well as of a dental wafer and/or a similar structure for the formation of dental prostheses, in particular on material removal CNC centres and/or machines, in accordance with the present invention.
The description will be made hereafter with reference to the attached drawings, provided only for indicating and therefore not limiting purposes, in which:
With reference to
The dental wafer 1 comprises a body 2 having a substantially cylindrical configuration, preferably disc-shaped (
However, it should be noted that for the purposes of the present invention the body 2 of the dental wafer 1 can also have a cubic, parallelepiped or prismatic configuration.
Going into detail, the body 2 of the dental wafer 1 is provided with at least two layers of formation 2a (
Advantageously, at least one of the layers of formation 2a of the body 2 of the dental wafer 1 comprises graphene and/or carbon fibre and/or glass fibre.
Advantageously, at least one of the layers of formation 2a of the body 2 of the dental wafer 1 comprises graphene and/or sheeted graphene, the thickness of which is comprised between 0.2μ and 250μ, preferably between 0.5μ and 200μ and/or graphene fibre and/or graphene particles of various forms, with maximum dimensions comprised between 0.2μ and 300μ, preferably 0.5μ and 20μ and/or a resin doped with graphene particles of various forms, with maximum dimensions comprised between 0.2μ and 300μ, preferably 0.5μ and 20μ.
In accordance with a preferred embodiment of the present invention, each layer 2a of the body 2 of the dental wafer 1 comprises graphene and/or sheeted graphene and/or graphene fibre and/or graphene particles and/or a resin doped with graphene particles. In accordance with a further embodiment of the present invention, at least one of the layers of formation 2a of the body 2 of the dental wafer 1, preferably more than one, comprises carbon fibre, in particular in sheet, in which each fibre has a diameter comprised between 1μ and 15μ, preferably between 3μ and 8μ, and/or a resin doped with carbon fibres, in which each fibre has a diameter comprised between 1μ and 15μ, preferably between 3μ and 8μ, and/or particles of carbon fibre of various forms the maximum dimensions of which are comprised between 0.1 mm and 12 mm, preferably between 0.1 mm and 6 mm.
In accordance with a preferred embodiment of the present invention, each layer 2a of the body 2 of the dental wafer 1 comprises carbon fibre in sheet and/or in resin and/or particles of carbon fibre dispersed in a resin.
In accordance with a further embodiment of the present invention, at least one layer of formation 2a in carbon fibre, preferably more than one, of the body 2 of the dental wafer 1 comprises glass fibre, in which each fibre has a diameter comprised between 1μ and 15μ, preferably between 3μ and 8μ, in particular in sheet, and/or a resin doped with glass fibre, in which each fibre has a diameter comprised between 1μ and 15μ, preferably between 3μ and 8μ, and/or particles of glass fibre of various forms the maximum dimensions of which are comprised between 0.1 mm and 12 mm, preferably between 0.1 mm and 6 mm.
In accordance with a preferred embodiment of the present invention, each layer 2a of the body 2 of the dental wafer 1 comprises glass fibre in sheet and/or in resin and/or particles of carbon fibre dispersed in a resin.
Therefore, the dental wafer 1 described above can be made totally with graphene or carbon fibre or glass fibre, just as it can be made using such materials in combination. For example, it is possible to provide that the body 2 of the dental wafer 1 be formed from some layers of formation 2a in graphene and from some layers of formation 2a in carbon fibre.
Alternatively, it is possible to provide for the body 2 of the dental wafer 1 to be formed from some layers of formation 2a in graphene and from some layers of formation 2a in glass fibre.
It is also possible to provide for the body 2 of the dental wafer 1 to be provided with some layers of formation 2a in carbon fibre and others in glass fibre. It is not excluded that the body 2 of the dental wafer 1 also be provided with some layers of formation 2a in graphene, some layers of formation 2a in carbon fibre and other layers of formation 2a in glass fibre suitably coupled to each other.
The arrangement of the layers of formation 2a, understood as the layered sequence of the different materials used, can vary according to requirements and is selected as a function of the type of dental prostheses P (
Advantageously, the layers of formation 2a of the body 2 of the dental wafer 1 provided with graphene, carbon or glass fibres can have fibres F oriented unidirectionally (
According to an advantageous aspect of the present invention, schematically represented in
The present invention also provides a process 100, schematically represented in blocks in
In particular, as can be seen in the block diagram of
Preferably, the dental wafer 1 obtained through the step of making 101 of the process 100 is intended for CNC CAD-CAM numerical control centres and/or machines through which it is possible to carry out the formation of the dental prostheses P by removal of material based on three-dimensional reference models.
In detail, the step of making 101 the dental wafer 1 is preferably carried out by firstly carrying out a step of overlapping 101a at least two layers of formation 2a, preferably a plurality of layers of formation 2a, pre-imbued or to be imbued with at least one thermosetting resin, such as an epoxy, acrylic, vinyl ester or polyester resin, or a thermoplastic resin, like for example polyamide and peek, in which at least one of the layers of formation 2a, preferably two or more, comprises graphene and/or carbon fibre and/or glass fibre in the most appropriate forms.
Once the step of overlapping 101a the layers of formation 2a has ended, a step of compressing 101b one layer of formation 2a against the other 2a is carried out to join these latter and break any micro air bubbles present therein or in the resins used to imbue them.
At the end of the compression step 101b a step of heating 101c the layers of formation 2a is carried out so that these latter harden forming a respective dental wafer 1 provided with graphene.
Subsequently to the step of making 101 the dental wafer 1, the process 100 comprises a step of removing 102 a predefined quantity of material. The removing step is preferably carried out starting from the dental wafer 1 based on a suitable three-dimensional reference model stored on a suitable memory support to form, at least in part, the dental prosthesis P and/or the support structure to be made.
The step of overlapping 101a the layers of formation 2a is carried out through the use of sheets of graphene and/or carbon and/or glass fibre F and provides, in detail, overlapping sheets the fibres F of which can be oriented unidirectionally or bidirectionally, preferably perpendicularly, or multidirectionally.
The step of overlapping 101a the aforementioned layers of formation 2a provides that each sheet be overlapped to at least one other sheet so that the respective fibres F are oriented transversely with respect to the fibres F of this latter. In other words, the step of overlapping 101a the aforementioned layers of formation 2a is carried out by firstly arranging a first sheet of fibres F so that these latter are oriented according to a respective reference direction, overlapping a second sheet with the respective fibres oriented transversely with respect to the fibres F of the first sheet, and subsequently each sheet so that the fibres F of this latter are oriented transversely with respect to the fibres F of the sheet overlapped previously.
Preferably, at least the steps of overlapping 101a and compressing 101b the layers of formation 2a can be carried out in a mould 200 (
Alternatively, the steps of overlapping 101a and compressing 101b the layers of formation 2a can also be carried out through the help of a vacuum bag in autoclave.
The heating step 101c can also be carried out in the mould 200 or in a suitable oven, once the compressed layers have been extracted from the mould 200 or from the vacuum bag in autoclave.
Subsequently to the step of heating 101c and to the consequent hardening of the compressed layers of formation 2a, the process 100 also comprises a finishing step 101d (
The present invention also comprises a process for making dental wafers 1 and/or similar structures that comprises the steps of overlapping 101a, compressing 101b, heating 101c and finishing 101d of the process 100 for the formation of dental prostheses P schematically illustrated in
The invention solves the problems encountered in the prior art and achieves important advantages.
The dental wafers according to the present invention obtained through the process described above allow dental prostheses to be made having high mechanical strength, hardness, solidity and lightness.
Number | Date | Country | Kind |
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MI2014A001780 | Oct 2014 | IT | national |