Claims
- 1. A process for producing corrugated wafer board panel from binder-coated wafers, comprising:
- distributing a mat of loose binder-coated wood wafers between a pair of spaced apart, substantially horizontally disposed platens having substantially non-porous and planar platen surfaces, said platens being adapted to be mechanically actuated to move the surfaces together and, when further required, to be converted from the planar configuration to a corrugated configuration by application of a side force;
- biasing the platens together vertically to pre-compress the mat between the planar surfaces, to substantially fix the wafers together to limit their further relative movement;
- then converting the two platens and their platen surfaces, still in pressing association with the mat, from the planar to the corrugated configuration;
- and applying heat and additional pressure with the platen surfaces to the mat for sufficient time to cure the binder and produce a corrugated wafer board panel.
Parent Case Info
This application is a division of application Ser. No. 765,840, filed Aug. 15, 1985, now U.S. Pat. No. 4,616,991.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
771677 |
Squires |
Oct 1904 |
|
4559194 |
Hegenstaller |
Dec 1985 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
806209 |
Dec 1958 |
GBX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
765840 |
Aug 1985 |
|