Claims
- 1. A process for manufacturing a sifting device having slit-shaped openings, the process comprising:
- forming a plurality of insets in a support element, and shaping the insets to comprise a first opening tapering to a predetermined depth and a second opening that expands from the predetermined depth;
- shaping a rod for insertion into the insets to be securely held in a position in the support element during subsequent manufacturing;
- inserting the rods to be substantially parallel in the insets, deforming the support element after insertion of the rods, such that the deformed state comprises an intended form, fixing the rods within respective insets by the deformation of the support element, and forming a filtering gap between the inserted rods; and
- permanently bonding the rods in the insets with a high temperature bonding agent.
- 2. The process according to claim 1, further comprising forming the slit-shaped openings to be less than or equal to approximately 3 mm wide at a narrowest point.
- 3. The process according to claim 2, further comprising forming the slit-shaped openings being less than or equal to approximately 0.4 mm wide at the narrowest point.
- 4. The process according to claim 1, further comprising shaping the rod to comprise a cross-sectional area having a triangular shape and a rounded portion for coupling to the support element.
- 5. The process according to claim 1, further comprising shaping and positioning the rods to form the slit-shaped openings that begins with a narrowest point to create a cross-sectional flow that widens in a flow direction.
- 6. The process according to claim 1, the permanently bonding comprising a solder material.
- 7. The process according to claim 6, further comprising soldering the rod into the inset at a temperature below 900.degree. C.
- 8. The process according to claim 6, further comprising producing a high vacuum and hard soldering at a temperature of over 900.degree. C.
- 9. The process according to claim 1, the permanent bonding comprising welding.
- 10. The process according to claim 1, further comprising bending a substantially straight support element into a ring or ring segment after inserting the rods.
- 11. The process according to claim 1, the permanently bonding comprising one of hard soldering and brazing.
- 12. A process for manufacturing a sifting device having a plurality of sifting slits comprising:
- forming a plurality of insets in a support element;
- forming each inset with a first portion having a gap tapering to a predetermined distance and forming each inset with a second portion having an increasing size coupled to the tapering gap at the predetermined distance;
- inserting a plurality of rods into the insets to be parallel with each other and deforming the support element so that said rods are securely held in position in the support element;
- permanently bonding the rod into the respective inset with a high temperature bonding agent.
- 13. The process according to claim 12, the inserting comprising a press fitting of the rods within the insets.
- 14. The process according to claim 12, further comprising shaping a rod to have a shape substantially similar to the shape of the inset.
- 15. The process according to claim 12, further comprising shaping a rod having a first section having a substantially triangular shape and a second section having a circular shape, the second shape being coupled to the first shape.
- 16. The process according to claim 12, the forming comprising one of laser welding and electroerosion.
- 17. The process according to claim 12, the permanently bonding comprising one of hard soldering and brazing.
- 18. A process for manufacturing a sifting device having a plurality of sifting slits comprising:
- providing an elastically deformable support element;
- forming a plurality of insets in said support element;
- elastically deforming said support element;
- inserting a plurality of rods into the insets while said support element is elastically deformed, said plurality of rods to be parallel with each other; and
- releasing said support element so that said support element returns to an undeformed position such that said rods are securely held in position in said support element; and permanently bonding said rods into a respective inset of said support element with a high temperature bonding agent.
- 19. The process according to claim 18, the forming comprising forming a first portion having tapering gap to a predetermined distance and forming a second portion having an increasing size coupled to the taper gap at the predetermined distance.
- 20. The process according to claim 18, further comprising shaping a rod to have a shape substantially similar to the shape of the inset.
- 21. The process according to claim 18, further comprising shaping a rod having a first section having a substantially triangular shape and a second section having a circular shape, the second shape being coupled to the first shape.
- 22. The process according to claim 18, the forming comprising one of laser welding and electroerosion.
- 23. The process according to claim 18, wherein said bonding comprises one of hard soldering and brazing.
- 24. The process according to claim 18, wherein said elastically deformable element is configured to have a semi-circular shape in an undeformed condition.
Priority Claims (2)
Number |
Date |
Country |
Kind |
296 09 298 U |
May 1996 |
DEX |
|
197 09 582 |
Mar 1997 |
DEX |
|
CROSS-REFERENCE OF RELATED APPLICATION
The present invention claims the priority under 35 U.S.C. .sctn. 119 of German Patent Application (Utility Model - Gebrauchsmuster) No. 296 09 298.3 filed on May 24, 1996, and German Patent Application No. 197 09 582.8-45 filed on Mar. 8, 1997, the disclosures of which are expressly incorporated by reference herein in their entireties.
US Referenced Citations (9)
Foreign Referenced Citations (3)
Number |
Date |
Country |
3327422 |
Feb 1985 |
DEX |
4214061 |
Nov 1993 |
DEX |
3927748 |
Mar 1994 |
DEX |
Non-Patent Literature Citations (1)
Entry |
European Search Report in connection with European Application No. 97 10 4439. |