Claims
- 1. Test carrier for analysis of a liquid sample, said test carrier comprising
- a first absorbent layer having a surface,
- a second absorbent layer having a surface facing said surface of said first absorbent layer, and
- an array of dots of hot melt adhesive connecting said surfaces of said first and second layers, said array comprising at least 25 dots per cm.sup.2, wherein said dots of hot melt adhesive have a dimension perpendicular to said surfaces which keeps said surfaces spaced apart by a gap of 0.05 to 0.2 mm, said dots and said cap being dimensioned such that a liquid sample can pass from said surface of said first absorbent layer to said surface of said second absorbent layer.
- 2. Test carrier as in claim 1 wherein said array comprises at least 50 dots/cm.sup.2.
- 3. Test carrier as in claim 2 wherein said array comprises at least 90 dots/cm.sup.2.
- 4. Test carrier as in claim 1 wherein said dots cover at least 50% of the surface of each layer.
- 5. Test carrier as in claim 1 wherein each dot covers a maximum of 1.0 mm.sup.2 of the surface of each layer.
- 6. Test carrier as in claim 5 wherein each dot covers a maximum of 0.3 mm.sup.2 of the surface of each layer.
- 7. Test carrier for the analysis of a liquid sample, said test carrier comprising
- a first absorbent layer having a surface,
- a second absorbent layer having a surface facing said surface of said first absorbent layer,
- a filamentary array of hot melt adhesive connecting said surfaces of said first and second layers, said array having a dimension perpendicular to said surfaces which keeps said surfaces spaced apart by a gap of 0.05 to 0.2 mm.
- 8. Method of manufacturing a test carrier for analysis of a liquid sample, said method comprising
- providing a first absorbent layer having a surface and a second absorbent layer having a surface,
- applying hot melt adhesive to the surface of said first layer in an array of dots comprising at least 25 dots/cm.sup.2, and
- applying said surface of said second layer against said array so that said surfaces are spaced apart by a gap of 0.05 to 0.2 mm.
- 9. Method as in claim 8 wherein said array comprises at least 50 dots/cm.sup.2.
- 10. Method as in claim 9 wherein said array comprises at least 90 dots/cm.sup.2.
- 11. Method as in claim 8 wherein said surface of said second layer is applied so that said dots cover at least 50% of the surface of each layer.
- 12. Method as in claim 8 wherein said second layer is applied so that each dot covers a maximum of 1.0 mm of the surface of each layer.
- 13. Method as in claim 12 wherein said second layer is applied so that each dot covers a maximum of 0.3 mm.sup.2 of the surface of each layer.
- 14. Method as in claim 8 wherein said hot melt adhesive is applied to said first layer in an amount ranging from 2 to 50 g per m.sup.2 of said surface of said first layer.
- 15. Method as in claim 14 wherein said hot melt adhesive is applied to said first layer in an amount ranging from 10 to 20 g per m.sup.2 of said surface of said first layer.
- 16. Method as in claim 8 wherein said hot melt adhesive is applied with a screen printing process.
- 17. Method as in claim 8 wherein said hot melt adhesive is applied with a wheel application device.
- 18. Method of manufacturing a test carrier for analysis of a liquid sample, said method comprising
- providing a first absorbent layer having a surface and a second absorbent layer having a surface,
- applying hot melt adhesive to the surface of said first layer by a pressurized gas spray to form a filamentary array of adhesive, and
- applying said surface of said second layer against said array so that said surfaces are spaced apart by a gap of capillary dimensions.
- 19. Method as in claim 18 wherein said hot melt adhesive is applied to said first layer in an amount ranging from 2 to 50 g per m.sup.2 of said surface of said first layer.
- 20. Method as in claim 19 wherein said hot melt adhesive is applied to said first layer in an amount ranging from 10 to 20 g per m.sup.2 of said surface of said first layer.
- 21. Method as in claim 18 wherein said hot melt adhesive is applied at a gas pressure in the range of 0.2 to 10 bar.
- 22. Method as in claim 21 wherein said pressure is in the range of 0.2 to 2.0 bar.
- 23. Method as in claim 18 wherein said second layer is applied against said array of melt adhesive at a pressure of 0.2 to 2.0 bar.
Priority Claims (1)
Number |
Date |
Country |
Kind |
37 21 236.2 |
Jun 1987 |
DEX |
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Parent Case Info
This application is a continuation-in-part of application Ser. No. 07/205,319, filed Jun. 10, 1988, now abandoned.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
3993451 |
Verbeck |
Nov 1976 |
|
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360961 |
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0158190 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
205319 |
Jun 1988 |
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