Patent Application
20090326164
The invention relates to a process for preparing a hydroxy-aromatic resin, to a hydroxy-aromatic resin, to a method for modifying a hydroxy-aromatic resin and to a resin such obtained.
Hydroxy-aromatic resins and their preparation are known, such as form example the preparation of phenol-formaldehyde resins from for example A. Knop, L. A. Pilato, Phenolic Resins, Springer Verlag Berlin 1990. These resins have many known uses, such as for example the use of these resins in adhesives for the preparation of particle boards.
A disadvantage of the known formaldehyde-containing hydroxy-aromatic resins is that their use is associated with health risks, relating to the emission of formaldehyde during resin preparation, resin curing and in end products.
It is the objective of the present invention to reduce or even eliminate the said disadvantage while still providing a compound suitable for the preparation of hydroxy-aromatic resins.
One aspect of the present invention the comprises a process for preparing a hydroxy-aromatic resin, comprising the steps of:
A further aspect of the present invention comprises a process for the preparation of hydroxy-aromatic compounds comprising the steps of:
A further aspect of the present invention comprises a process comprises the steps of:
wherein R4 is a C1-C20 alkyl group, aryl group, aralkyl group or cycloalkyl group;
An advantage of the method according to the invention is that hydroxy-aromatic resins can be prepared that are essentially free of formaldehyde and thus suffer less, or even not at all, from the health risks associated with the use of formaldehyde, while still being suitable for use in typical known applications. Thus, resins prepared with the compound according to the present invention are in particular suitable for use in many applications such as adhesives, coatings, laminates, and shaped articles.
The method according to the invention relates to the preparation of a resin. A resin is herein understood to have the same meaning as it has to a skilled person in thermosetting chemistry, namely as a low molecular weight polymer having reactive groups. The term low molecular weight means a molecular weight typical for an oligomer and lying between a few hundred g/mole, e.g. 200, and a few thousand g/mole, e.g. 3,000. Ideally the number of reactive groups per molecule is at least two. These reactive groups form the chemical handles to connect the polymer chains together through covalent cross-link bonds, via a chemical reaction. The process of cross-linking is mostly referred to as “cure” or “hardening”. A resin may be present in the form of a solution, e.g. an aqueous solution, or as such.
The resin is according to the invention prepared by bringing raw materials together to form a reaction mixture. The raw materials comprise a hydroxy-aromatic compound. Hydroxy-aromatic compounds are defined as compounds having an aromatic ring with at least one —OH group attached directly to it. An example of such a compound is phenol. As is known in hydroxy-aromatic chemistry, the positions on the aromatic ring adjacent to and opposite the hydroxy group (i.e., ortho and para) have a different reactivity than the remaining two meta-positions.
In formula (I) the groups R1, R3, and R5 should be regarded within a similar context and are herein referred to as a set. In the hydroxy-aromatic compound, at least one of the groups in the set consisting of R1, R3, and R5 is H; the other one or two groups in the said set—in case not all three of the said set is given by H—is/are OH, a C1-C20 or preferably a C1-C12 or C1-C9 alkyl group, or an oligomeric or polymeric system. R2 and R4 may be the same or may be different and may each individually be H, OH, a C1-C20 or preferably a C1-C12 or C1-C9 alkyl group, or an oligomeric or polymeric system.
The oligomeric or polymeric system may be any suitable type such as a hydroxy-aromatic resin, e.g. either of the resol or of the novolac type, preferably of the resol type; or it may be a different type of thermosetting or thermoplastic system.
The hydroxy-aromatic compound according to formula (I) may be one single compound but is understood to also comprise the meaning of a mixture of two or more compounds falling within the scope of the formulas as defined above. Examples of preferred compounds include phenol, (2, 3, or 4-)cresol, meta-substituted phenol, resorcinol, catechol, (2, 3, or 4-)tert-butylphenol, (2, 3, or 4-)nonylphenol, (2,3- 2,4- 2,5- 2,6- or 3,4-)dimethylphenol, (2, 3, or 4-)ethylphenol, bisphenol A, bisphenol F, and hydrochinon. Further examples of preferred compounds are poly-phenolic systems such as tannins or lignins. Preferred are bisphenol A and phenol.
The second embodiment of the present invention comprises an ortho-substituted hydroxy-aromatic compound according to formula (II). In this compound R1 and R2 may be the same or they may be different, and are a C1-C20 alkyl group. In a preferred embodiment, R1 and R2 are both tert-butyl or both methyl, or R1 is tert-butyl and R2 is methyl. The compound according to formula (II) may be one single compound but is understood to also comprise the meaning of a mixture of two or more compounds falling within the scope of the formulae as defined above. Examples of preferred compounds according to formula (II) are (2,6-)di-tert-butylphenol, (2,6-)dimethylphenol and 2-tert-butyl-6-methyl-phenol.
In an alternative embodiment of the invention, the process for preparation of the hydroxy-aromatic compound is carried out by using as starting compound a compound of formula (II) wherein R1 is a C1-C20 group and preferably a methyl or tert-butyl group and wherein R2 is H. Thus, in this embodiment the hydroxy-aromatic starting compound is ortho-substituted only once. In this embodiment, it is preferred that the A/H ratio lies between 1.3 and 1.7 and is preferably around 1.5.
In the third embodiment of the invention the process comprises a starting compound according to formula (III). In formula (III), R4 refers to a C1-C20, preferably C1-C12, alkyl group, aryl group, aralkyl group or cycloalkyl group. The compound according to formula (III) may be one single compound or a mixture of two or more compounds falling within the scope of the formulae as defined above. In one preferred embodiment, R4 is a C9 alkyl group. An advantage of the para-substitution is that it can increase the compatibility and/or solubility of the hydroxy-aromatic compound with alkyl compounds or olefinic compounds or polymers such as various oils and polymers like for example PE, PP, EPDM. In a preferred embodiment, the compound of formula (III) is nonylphenol.
The process of the present invention comprises glyoxylic acid and/or derivatives thereof. Glyoxylic acid is readily available in both aqueous and non-aqueous form (e.g. glyoxylic acid hydrate).
The raw materials that are brought together to form the reaction mixture may optionally comprise—besides the hydroxy-aromatic compound according to formula (I) and the glyoxylic acid—an amino compound. An amino compound is defined herein as a compound containing at least one —NH or —NH2 group. Amino compounds are known as such; examples of amino compounds that are suitable for use in the method according to the invention are urea, melamine, melam and melem. Preferable, urea is used as amino compound.
The molar ratio between the raw materials that are brought together in the reaction mixture may vary between wide limits. The molar ration between the glyoxylic acid (A) and the hydroxy-aromatic compound (H), herein referred to as the A/H ratio, preferably lies between about 0.1 and about 10, more preferably between about 0.5 and about 3. If the reaction mixture also comprises an amino compound (O), then the ratios as given apply to the ratio between the glyoxylic acid and the sum of the hydroxy-aromatic compound and the amino compound. The molar ratio A/(H+O) is preferably at least 0.1, 0.2, 0.3, 0.4, 0.5 or 0.6 and preferably at most 10, 9, 8, 7, 6, 5, 4, 3, or 2.
The bringing together of the raw materials to form the reaction mixture may be accomplished by simply mixing them; it may be beneficial to do this in the presence of a solvent. It may thus be beneficial to execute the reaction step according to the invention in a solvent or dispersant. As solvents, those compounds are suitable in which the reactants dissolve sufficiently to let the reaction take place. Examples of such solvents are water and various organic solvents. Depending on the specific compound or compounds of formula (I), (II) and (III), it may well be possible to use one or more of the reactants as solvent; in such a case, it can be possible to forego on the use of a solvent that is essentially a non-reactant and to execute the reaction step in bulk. In particular, many of the compounds according to formula (II) are a liquid at temperatures between 10° C. and 100° C. and can act as dispersant/solvent as well as reactant.
Once the reaction mixture is formed, it should be brought to conditions whereby the hydroxy-aromatic resin can be formed, i.e. in a reaction step. Although the reaction step may proceed spontaneously once the respective compounds have been brought together, it may be useful to bring the compounds together in the presence of a catalyst in order to accelerate the reaction. As catalyst, preferably an acid is used; in particular, a Lewis or a Brønsted type of acid is preferred—such as for example sulphuric acid—whereby the pH is reduced to between 0 and 5, preferably to between 1 and 4, in particular to between 2 and 3. Suitable examples of acid catalysts are sulphuric acid, nitric acid, hydrochloric acid, phosphoric acid, boric acid, tetrafluoroboric acid, paratoluene sulphonic acid, methane sulphonic acid, formic acid, ammonium sulphate, ammonium chloride, ammonium nitrate, aluminum sulphate, aluminum chloride, zirconium (IV) chloride, titanium (IV) chloride, zinc chloride, stannic chloride, stannous chloride, boron trifluoride etherate.
The temperature in the reaction step of present process can vary within wide limits, and preferably lies between 10° C. and 100° C. More preferably the process is carried out at between 40° C. and 90° C. The pressure in the present process preferably is between 0.005 MPa and 1.0 MPa, preferably between 0.02 MPa and 0.2 MPa; most preferably, the pressure is atmospheric. The reaction step may be carried out in air, although it can have benefits to operate in an inert atmosphere such as nitrogen. The time needed for completion of the reaction step may vary within wide limits and is primarily determined by the time needed to achieve the end result of the reaction step, i.e. the formation of a resin. As is known, factors like the temperature and the nature and amount of catalyst strongly influence the time needed to achieve the desired end result. In practice, the reaction step could be completed in a time lying between 5 minutes and 180 minutes.
The invention further relates to the resin as obtainable by the methods as described above. The invention moreover relates to the use of the hydroxy-aromatic aldehyde resin according to the invention for the preparation of coatings or shaped articles such as wood-based panels like particle boards and laminates, or mineral wool such as stone wool or glass wool. To this end, the resins may be used by methods and under conditions similar to those known per se from the use of known hydroxy-aromatic aldehyde resins like phenol-formaldehyde resins. A catalyst and other additives may be added to the resin before the resin is used for processing in its final application. Examples of customary additives are mould release agents, antistatic agents, adhesion promoters, plasticizers, colour enhancing agents, flame retardants, fillers, flow promoters, colorants, diluents, polymerization initiators, UV-stabilizers and heat stabilizers. Examples of fillers are glass fibres, mica, carbon fibres, metal fibres, clay, aramide fibres and strong polyethylene fibres.
It was found that if phenol was used as hydroxy-aromatic compound of formula (I), the amount of free phenol in the resin as prepared can be very low. This is surprising, since known phenolic resins such as phenol-formaldehyde resins are notorious for suffering from high levels of free phenol, ranging often in levels of around 1% or more. In the resin according to the invention, by contrast, the level of free phenol was found to be very low, often below 0.1% or even below 0.01%.
The resin according to the invention may be used as such; however, it is also possible to subject the resin to a modification step; this is a reaction step designed to alter or enhance its functionality in a specific way. An example of an altered functionality is the solubility of the resin in water. An example of an enhanced functionality is the addition of a reactive group. An example of a modification step is to bring the resin in contact with compounds that react with the —OH groups; an example of such a compound is epichlorohydrin. If a modification step with an amine is done on a resin, it is preferred that no amino compound was used as raw material for resin preparation.
In a preferred embodiment of the invention, the bisphenol compound is used in the preparation of an epoxy resin. An epoxy resin is an oligomeric or polymeric material comprising at least two oxygen-containing three-membered ring structures, often in the form of glycidyl ether moieties. The oxygen-containing three-membered ring serves as location for further reactions, commonly referred to as curing or cross-linking. The term epoxy resins is in practice also used for the cured/cross-linked polymers, even thought practically all or even all of the oxygen-containing three-membered ring structures that were present have reacted away. The invention thus further relates to the use of such epoxy resins in coatings, inks, structural composites, flooring, electrical laminates, or adhesives.
In another preferred embodiment of the invention, the hydroxy-aromatic resin is subjected to a modification step in which the resin is brought into contact with ammonia. The ammonia may be as such, e.g. in gaseous form or in liquid form, or it may be in the form of a solution, e.g. an aqueous solution. An important effect of the ammonia treatment is typically the increase in solubility of the resin in aqueous systems. Moreover, this increase in solubility has essentially no or only a limited effect on the ability of the resin to undergo subsequent curing reactions. It was found that certain other methods that may lead to increase of solubility of the resin in water, such as treatment with basic aqueous solutions of alkaline metals such as aqueous NaOH, can lead to a severe or even complete destruction of the ability of the resin to undergo curing reactions which is undesirable.
In yet another preferred embodiment of the invention, the hydroxy-aromatic resin is used in the preparation of thermoplastic polymers. In particular, polycarbonates or polyurethanes. The processes for the preparation of polyurethanes or polycarbonates as referred to are as such known; optimal conditions for incorporating the compounds according to the invention may be found through routine experimentation. The invention further relates to polyurethanes or polycarbonates thus obtainable.
The resins of the present invention may be useful in coating compositions, laminates, adhesives, cross-linkers, elastomers, as antioxidants, in personal care compositions, or the like.
The invention will be elucidated by means of the following examples, without being limited to it.
A hydroxy-aromatic resin was prepared in the following fashion: as hydroxy-aromatic compound, 58.84 grams of bisphenol-A (97% purity) was taken; as alkanol hemiacetal, 66.73 grams of glyoxylic acid (GA) (90% purity) was taken. These components were mixed together, i.e. the bisphenol A was dissolved into the GA, at a temperature of 80° C. No further solvent was used. As catalyst, 0.5 ml of concentrated H2SO4 was added; the temperature was then raised to 90° C., and the reaction continued for 3 hours under nitrogen atmosphere and at reflux. Upon cooling, a very high viscosity resin was obtained that did not dissolve in water.
As subsequent treatment, a portion of the resin was taken and treated at 200° C. during 2 hours. This resulted in the formation of a glassy material, indicative of a cured resin. The glassy material contained less than 1 wt. % of either of the raw materials bisphenol A or GA in their free, unreacted form. Of this glassy material, 5 grams were taken and combined with 95 grams of demineralised water; then, the whole was heated to 80° C. during 3 hours. After cooling down and filtering, less than 1 wt. % of the 5 grams was lost due to degradation and dissolving.
Another portion of the resin was taken, and combined in 5 wt. % with demineralised water. Initially, no solution was formed. However, after the addition of ammonia in the form of an aqueous NH4OH solution at 60° C. it turned out to be possible to dissolve the resin; at that moment the pH of the aqueous resin solution was 7.5. Subsequent to the ammonia treatment, the resin solution was heated to—ultimately—200° C.; this yielded—after evaporation of water and ammonia—a glassy material. This glassy material turned out to be as insoluble in water at 80° C. as prior to the ammonia treatment. This shows that although an ammonia treatment according to the invention served to create water-solubility of a resin, it did not lead to destruction of the resin as evidenced by the fact that it could be cured.
Bis(2,6-di-tertbutyl,4-hydroxyphenyl) Acetic acid was prepared in the following manner. A reactor was filled with 150 grams of Acetic Acid (glacial). At room temperature, 41.2 grams of 2,6-di-tert-butylphenol (0.20 moles) was added. As catalyst 14.7 grams Sulfuric acid was added. The mixture was heated to 70° C. Within ½ hour 20.4 grams (0.11 moles) Glyoxylic acid (40% solution in water) was dosed to the mixture. The reaction mixture was kept at 70° C. during 6 hours. The reaction mixture was cooled to 20° and the crystals were filtered of, washed and dried. The crystals were identified by H-NMR and Mass spectrometry as Bis(2,6-di-tertbutyl,4-hydroxyphenyl) Acetic acid. The yield was 85%
| Number | Date | Country | Kind |
|---|---|---|---|
| 06011437.8 | Jun 2006 | EP | regional |
| 06011438.6 | Jun 2006 | EP | regional |
| 06011439.4 | Jun 2006 | EP | regional |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/EP07/04875 | 6/1/2007 | WO | 00 | 6/1/2009 |
