Patent Application
20140133679
The present application claims priority from German Patent Application No. DE 10 2012 219 915.2 filed on Oct. 31, 2012, the disclosure of which is incorporated herein by reference in its entirety.
The present invention concerns a process for the production of a capacitor microphone and a capacitor microphone.
It is noted that citation or identification of any document in this application is not an admission that such document is available as prior art to the present invention.
Capacitor microphones or electret microphones typically have a microphone housing having a sound inlet opening, a diaphragm and a counterpart electrode which is associated with that diaphragm and which is arranged at a small spacing relative thereto. Capacitor microphones and in particular miniature capacitor microphones are typically produced using stacking technology. For that purpose the individual elements of the capacitor microphone (diaphragm with glued-on diaphragm, spacer ring, counterpart electrode) are stacked on each other in a microphone housing.
The following documents were searched in the German application from which priority is claimed: DE 10 2006 042 855 A1, DE 696 11 983 T2, U.S. Pat. No. 4,701,640 A and EP 1 762 117B1.
EP 1 762 117 B1 discloses a capacitor microphone having a microphone housing with a sound inlet opening, a diaphragm and a counterpart electrode which is associated with that diaphragm and which is arranged at a small spacing relative thereto. The microphone housing comprises two housing portions of which the second housing portion is of a larger diameter than the first and the second housing portion is arranged in the form of a cap or sleeve over the first housing portion. In that arrangement an edge of the diaphragm is folded over the edge of the first housing portion and fixed at the outside of the first housing portion.
It is noted that in this disclosure and particularly in the claims and/or paragraphs, terms such as “comprises”, “comprised”, “comprising” and the like can have the meaning attributed to it in U.S. Patent law; e.g., they can mean “includes”, “included”, “including”, and the like; and that terms such as “consisting essentially of” and “consists essentially of” have the meaning ascribed to them in U.S. Patent law, e.g., they allow for elements not explicitly recited, but exclude elements that are found in the prior art or that affect a basic or novel characteristic of the invention.
It is further noted that the invention does not intend to encompass within the scope of the invention any previously disclosed product, process of making the product or method of using the product, which meets the written description and enablement requirements of the USPTO (35 U.S.C. 112, first paragraph) or the EPO (Article 83 of the EPC), such that applicant(s) reserve the right to disclaim, and hereby disclose a disclaimer of, any previously described product, method of making the product, or process of using the product.
An object of the present invention is to provide a process for the production of a capacitor microphone and a capacitor microphone which can be assembled in automated fashion and which can be produced less expensively.
Thus there is provided process for assembling a capacitor microphone. The capacitor microphone has an electrically non-conducting frame, a counterpart electrode and a diaphragm. The counterpart electrode is positioned directly in the frame and held. Adhesive is applied so that the counterpart electrode is glued directly to the frame. The diaphragm is optionally directly fixed to the frame.
According to an aspect of the present invention the application of the adhesive is effected in an edge region of the counterpart electrode and/or beneath the counterpart electrode.
In a further aspect of the invention the counterpart electrode is only in contact with the adhesive at its underside or in the edge region and is radially at least partially surrounded by the frame.
The invention also concerns a capacitor microphone having an electrically non-conducting frame, a counterpart electrode optionally with an electret layer on the top side of the counterpart electrode and adhesive at an underside and/or in the edge region of the counterpart electrode so that the underside of the counterpart electrode rests only on adhesive or the edge region of the counterpart electrode is connected to the frame by the adhesive.
In an aspect of the invention the counterpart electrode is radially surrounded by the frame and the underside of the counterpart electrode is held by adhesive.
In an aspect of the present invention the electret layer extends at least partially beyond the edge region of the counterpart electrode so that in its outer edge the electret layer is provided or clamped between the housing and the counterpart electrode.
The invention concerns the notion that a counterpart electrode of the capacitor microphone is positioned and fixed in an electrically non-conducting frame, for example a plastic frame, so that the spacing between a face of the frame and the counterpart electrode is of a desired value. Optionally the diaphragm and the counterpart electrode can be fixed directly to the non-conducting frame. That value must correspond to the air gap between the fitted diaphragm and the counterpart electrode. That can already provide a measurable and operable transducer.
It is to be understood that the figures and descriptions of the present invention have been simplified to illustrate elements that are relevant for a clear understanding of the present invention, while eliminating, for purposes of clarity, many other elements which are conventional in this art. Those of ordinary skill in the art will recognize that other elements are desirable for implementing the present invention. However, because such elements are well known in the art, and because they do not facilitate a better understanding of the present invention, a discussion of such elements is not provided herein.
The present invention will now be described in detail on the basis of exemplary embodiments.
According to the invention the counterpart electrode 2 is introduced into an end of the frame 1 and is held on a position so that there is a gap between the underside of the counterpart electrode and the second step 1b. A glue or adhesive 4 can be applied or introduced into that gap. Due to positioning and holding of the counterpart electrode 2 before the adhesive is applied or introduced into the gap between the counterpart electrode and the second step 1b the spacing between the top side of the counterpart electrode with the electret layer 3 and the end face A of the frame, on winch the diaphragm is fitted can be adjusted. According to the invention the counterpart electrode 2 is glued directly on the frame 1 (here the second step 1b). The adhesive can peripherally form a closed contour along the entire edge of the counterpart electrode 2 or can be applied only at individual portions of the edge.
According to the invention there is no element (like for example a spacer ring) which establishes the spacing between the counterpart electrode 2 and the diaphragm of the electroacoustic transducer. Rather, the spacing between the top side of the counterpart electrode 2 and the diaphragm is achieved by suitable positioning of the counterpart electrode and then glueing of the counterpart electrode directly to the frame 1. In that way the spacing between the top side of the counterpart electrode with the electret layer 3 and the diaphragm can be adjusted according to the invention without various spacer rings having to be provided for that purpose.
In other words, the air gap between the diaphragm and the counterpart electrode is not defined by the configuration of the plastic frame and in particular the first and second steps 1a, 1b as well as the thickness of the counterpart electrode, but in the final effect is established only by the adhesive.
In the region of the end face A of the frame 1 the outside can respectively have a bevelled surface 1d.
The diaphragm 5 and/or the counterpart electrode 2 can optionally be fixed directly to the electrically non-conducting frame.
The counterpart electrode 2 can be fixed by means of adhesive 4 to the frame (in particular between the first step 1a). In the second embodiment the adhesive 4 used for fixing purposes is provided only in the edge region 1c of the frame 1 below the step 1a so that the counterpart electrode 2 is glued directly to the frame 1. In the region of the end face A of the frame the outside can have a respective bevelled surface 1d.
According to the invention the counterpart electrode 2 is introduced into the frame 1 and appropriately positioned. In the second embodiment the electrode 2 can be so positioned that the underside of the counterpart electrode 2 terminates with the edge region 1c of the frame 1. Then an adhesive 4 can be provided for fixing purposes, wherein the adhesive is provided in the edge region 1c in such a way that the adhesive 4 is in contact with an outer region of the underside of the counterpart electrode 2. As in the first embodiment the spacing between the top side of the counterpart electrode 2 and the diaphragm (or the end face A of the frame) can be adjusted by suitable positioning of the counterpart electrode in the frame and then glueing, without a spacer ring having to be used for that purpose. In the second embodiment the counterpart electrode 2 is glued directly to or on the frame 1 or a portion thereof.
The diaphragm 5 is optionally fixed directly on the end face A of the frame. In that case at its outside the diaphragm is glued in the region of the bevelled surface 1d by means of an adhesive 6. It is possible in that way to achieve a maximum active diaphragm area as only that narrow region of the diaphragm, that is in contact with the adhesive 6, does not vibrate.
The microphone further has an electrically conducting capsule housing 8 (with a sound inlet 12) which surrounds the frame 1. The microphone further has a circuit board 11 with electronic components 10 and connections 13. The counterpart electrode 2 is connected to the circuit board 11 by way of a connecting element 9. A conductor track 14 at the underside of the circuit board 11 serves as a ground contact with the capsule housing 8.
The third and fourth embodiments are based on the first embodiment. Accordingly the foregoing description correspondingly applies to the third and fourth embodiments.
According to the invention a contact ring 7 can optionally be omitted. In that case the diaphragm is not directly cut off at the glueing location 6 but is cut off at a radial spacing of about half the height of the transducer assembly. When the structural assembly is introduced into the housing 8 the excess piece of diaphragm is laid over at the air gap between the transducer assembly and the housing. In that case the outer metallisation layer contacts the diaphragm with the housing. In that case the transducer assembly can be fixed to the housing for example by glueing.
In the region of the end face A of the frame 1 the outside of the frame 1 can have a respective bevelled surface 1d.
According to the invention the counterpart electrode 2 is glued or held to the frame 1 by way of adhesive 4. In that arrangement the adhesive can be provided between the counterpart electrode 2 and the frame 1, beneath the counterpart electrode 2 and/or above the counterpart electrode 2.
While this invention has been described in conjunction with the specific embodiments outlined above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, the preferred embodiments of the invention as set forth above are intended to be illustrative, not limiting. Various changes may be made without departing from the spirit and scope of the inventions as defined in the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2012 219 915.2 | Oct 2012 | DE | national |
