Claims
- 1. The process for the production of polyamide silicate resinous product by mixing and reacting the following components:
- (a) halosilicon acids, 0.5 to 1 mol, produced by reacting 0.5 to 2 mols of hydrated silica compound with 1 mol of a silicon halide; the mols of halosilicon acid is based on the mols of silicon halide used,
- (b) organic polyamine, 1 to 2 mols,
- (c) polycarboxylic acid, polycarboxylic acid anhydride, or mixture thereof, 1 to 2 mols.
- 2. The process of claim 1 wherein the polyamine is selected from the group consisting of aliphatic, cycloaliphatic, aromatic or heterocyclic polyamines and mixtures thereof.
- 3. The process of claim 1 wherein the polycarboxylic acid or polycarboxylic anhydride is selected from the group consisting of aliphatic, cycloaliphatic, aromatic or heterocyclic polycarboxylic acids, and polycarboxylic anhydride thereof.
- 4. The process of claim 1 wherein the polyamine is selected from the group consisting of: ethylenediamine; diethylenetriamine; triethylenetetramine; tetraethylenepentamine; 1,4-diaminobutane; 1,3-diaminobutane; hexamethylenediamine; 3-(N-isopropylamine) propylamine; N,N'-diethyl-1,3-propanediamine; hexapropyleneheptamine; penta(1-methylpropylene) hexamine; tri(1,2,2-trimethylethylene) tetramine; tetra(1,3-dimethylpropylene) pentamine; penta(1,5-dimethylamylene) hexamine; penta-(1,2-dimethyl-1-isopropylethylene) hexamine; N,N'-dibutyl-1,6-hexanediamine; propylenediamine; dipropylenetriamine; piperazines; tolylene diamine; and mixtures thereof.
- 5. The process of claim 1 wherein the polycarboxylic acid and polycarboxylic anhydride are added together in a total amount of 1 to 2 mols and are selected from the group consisting of aliphatic, cycloaliphatic, aromatic and heterocyclic polycarboxylic acids or polycarboxylic anhydrides and mixtures thereof.
- 6. The process of claim 1 wherein the polycarboxylic acid or polycarboxylic acid anhydride is selected from the group consisting of: succinic acid, succinic anhydride, adipic acid, suberic acid, azelaic acid, sebacic acid, phthalic acid, phthalic acid anhydride, isophthalic acid, trimellitic acid, tetrahydrophthalic acid anhydride, hexahydrophthalic acid anhydride, tetrachlorophthalic acid anhydride, endomethylene tetrahydrophthalic acid anhydride, glutaric acid anhydride, maleic acid anhydride, fumaric acid, and mixtures thereof.
- 7. The process of claim 1 wherein the silicon halide is silicon tetrachloride.
- 8. The process of claim 1 wherein the halosilicon acids are first mixed and reacted with the polyamine to produce polyamino-silicon acid compound, then mixed with the polycarboxylic acid or polycarboxylic acid anhydride, the mixture being heated to a temperature between the melting temperature of the polycarboxylic acid or polycarboxylic acid anhydride and the boiling temperature of the reactants while agitating for 20 to 120 minutes, thereby producing a polyamide silicate resinous product.
- 9. The process of claim 1 wherein the halosilicon acids are first mixed and reacted with the polycarboxylic acid or polycarboxylic acid anhydride, to produce a polycarboxylic acid silicon acid compound, then mixed with the polyamine compound and heated to a temperature between the melting temperature of the polycarboxylic acid silicon acid compound and the boiling point of the reactants while agitating for 20 to 120 minutes, thereby producing a polyamide silicate resinous product.
- 10. The process according to claim 1 wherein a portion of the polycarboxylic acid is replaced with a linear organic carbonate, selected from the group consisting of: p-xylene glycol bis(allyl carbonate); diethylene glycol bis(allyl carbonate); diphenylcarbonate; and mixtures thereof.
- 11. The resinous product produced by the process of claim 1.
- 12. The resinous product produced by the process of claim 8.
- 13. The resinous product produced by the process of claim 9.
CROSS-REFERENCE TO RELATED APPLICATIONS
This Application is a continuation-in-part of my copending U.S. Patent Application, Ser. No. 908,106, filed May 22, 1978, now U.S. Pat. No. 4,198,491, issued Apr. 15, 1980, which is a continuation-in-part of my copending U.S. Patent Application, Ser. No. 845,464, filed Oct. 25, 1977, now U.S. Pat. No. 4,120,937.
US Referenced Citations (12)
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
908106 |
May 1978 |
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Parent |
845464 |
Oct 1977 |
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