This is a divisional of copending application Ser. No. 08/021,146 filed on Feb. 23, 1993 now U.S. Pat. No. 5,288,456.
Number | Name | Date | Kind |
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3158504 | Anderson | Nov 1964 | |
3198999 | Baker et al. | Aug 1965 | |
3243324 | Kodera et al. | Mar 1966 | |
4201601 | D'Silva | May 1980 | |
4853184 | Naya et al. | Aug 1989 | |
5066612 | Ohba et al. | Nov 1991 | |
5073210 | Humpston et al. | Dec 1991 | |
5112699 | Chang | May 1992 | |
5130274 | Harper et al. | Jul 1992 |
Number | Date | Country |
---|---|---|
064662 | Nov 1982 | EPX |
179369 | Apr 1986 | EPX |
259616 | Mar 1988 | EPX |
335383 | Oct 1989 | EPX |
55-152144 | Nov 1980 | JPX |
58-112336 | Jul 1983 | JPX |
61-156823 | Jul 1986 | JPX |
2095908 | Oct 1982 | GBX |
Entry |
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Krusin-Elbaum et al., "Usually low resistivity of copper germanide thin films formed at lo2 temperatures", Appl. Phys. Lett. 58, pp. 1341-1343 (1991). |
Chang, "Thermal stability of the Cu/PtSi metallurgy", J. Appl. Phys. 66, pp. 2989-2992 (1989). |
Chang, "Formation of copper silicides from Cu(100)Si(100) and Cu(111)/Si(111) structures", J. Appl. Phys. 67, pp. 566-568 (1990). |
Cros, et al., "Formation, oxidation, electronic, and electrical properties of copper silicides", J. Appl. Phys. 67, pp. 3328-3336 (1990). |
Number | Date | Country | |
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Parent | 21146 | Feb 1993 |