PROCESS OF FABRICATING MICROLENS MOLD

Abstract

A process for fabricating a mold for an aspherical microlens having a desired aspherical and smooth surface, the lens having an effective diameter of 1 mm or smaller and a thickness of 0.5 mm or greater. A double-layer mask layer is formed on a single crystal silicon substrate, and anisotropic etching and isotropic etching are carried out using a first mask layer so as to form a concave portion that is a little smaller than the size of a desired microlens mold. Isotropic etching is then carried out using a second mask layer so as to enlarge the concave portion, thereby obtaining a microlens mold having desired dimensions.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic flow of the process for fabricating a microlens mold according to the invention.

FIG. 2 shows a schematic flow of the process for fabricating a microlens mold according to another embodiment of the invention.

FIG. 3 shows a schematic flow of the process for molding a microlens using the microlens mold according to the invention.

FIG. 4 shows a schematic flow of the process for molding a microlens using the microlens mold according to the invention.

Claims

1. A process of fabricating a mold for a microlens having a desired aspherical surface and a thickness greater than one half of the lens aperture, comprising the steps of: forming a first mask layer on a silicon substrate in such a shape that it surrounds a circular region that is smaller than the size of a concave portion of a mold to be fabricated;forming a second mask layer on the circular region, the second mask layer having a plurality of circular apertures with different sizes;carrying out anisotropic dry etching on the silicon substrate within the circular region through the circular apertures so as to form a plurality of holes in the silicon substrate having depths corresponding to the size of each circular aperture;carrying out isotropic etching on the silicon substrate within the circular region through the circular apertures so as to remove the side walls of the holes and thereby merge the holes;removing the second mask layer;carrying out isotropic etching on a concave portion formed by the merging of the holes, through the circular region in the first mask layer;enlarging the concave portion;smoothing the surface of the concave portion; andremoving the first mask layer.

2. The process for fabricating a microlens mold according to claim 1, comprising the step of forming, after removing the first layer, a layer on the surface of the microlens mold, the layer having a good peeling property with respect to a preform for lens.

3. The process for fabricating a microlens mold according to claim 1, comprising the step of forming, after removing the first mask layer, a layer on the surface of the microlens mold, the layer being resistant to a gas or liquid with which the silicon mold material is etched.

4. A process for fabricating a microlens mold using a microlens mold fabricated by the microlens mold fabricating process according to claim 2, comprising the steps of: transferring the shape of the one surface of the microlens mold having a desired aspherical surface, to a preform for lens;removing the silicon substrate by etching the other surface of the microlens mold opposite the one surface; andremoving the layer formed on the one surface.

5. A process of fabricating a mold for a microlens having a desired aspherical surface and a thickness greater than one half of the lens aperture, comprising the steps of: forming a first mask layer on a silicon substrate in such a shape that it surrounds a circular region that is smaller than the size of a concave portion of a mold to be fabricated;forming a second mask layer on the circular region, the second mask layer having a plurality of circular apertures with different sizes;carrying out anisotropic dry etching on the silicon substrate within the circular region through the circular apertures so as to form a plurality of holes in the silicon substrate having depths corresponding to the size of each circular aperture;removing the second mask layer;carrying out isotropic etching through the circular region of the first mask layer so as to remove the side walls of the holes, thereby merging the holes and forming a concave portion; andremoving the first mask layer.

6. The process for fabricating a microlens mold according to claim 5, comprising the step of forming, after removing the first layer, a layer on the surface of the microlens mold, the layer having a good peeling property with respect to a preform for lens.

7. The process for fabricating a microlens mold according to claim 5, comprising the step of forming, after removing the first mask layer, a layer on the surface of the microlens mold, the layer being resistant to a gas or liquid with which the silicon mold material is etched.

8. A process for fabricating a microlens mold using a microlens mold fabricated by the microlens mold fabricating process according to claim 6, comprising the steps of: transferring the shape of the one surface of the microlens mold having a desired aspherical surface, to a preform for lens;removing the silicon substrate by etching the other surface of the microlens mold opposite the one surface; andremoving the layer formed on the one surface.

9. A process of fabricating a mold for a microlens having a desired aspherical surface and a thickness greater than one half of the lens aperture, comprising the steps of: forming a first mask layer on a silicon substrate, the first mask layer having a plurality of circular apertures with different sizes in a circular region corresponding to a concave portion of a mold to be fabricated;forming a second mask layer such that it covers a plurality of circular apertures that exist at the periphery of the circular region;carrying out anisotropic dry etching on the silicon substrate within the circular region through those of the circular apertures that are not covered by the second mask layer so as to form a plurality of holes in the silicon substrate having depths corresponding to the size of each circular aperture;removing the second mask layer;carrying out anisotropic dry etching on the silicon substrate within the circular region through all of the circular apertures within the circular region, so as to form a plurality of holes in the silicon substrate having different depths;carrying out isotropic etching on the silicon substrate within the circular region through the circular apertures so as to remove the side walls of the holes and thereby merge the holes;removing the first mask layer; andsmoothing the surface of the concave portion formed by the merging of the holes by isotropic etching.

10. The process for fabricating a microlens mold according to claim 9, comprising the step of forming, after removing the first layer, a layer on the surface of the microlens mold, the layer having a good peeling property with respect to a preform for lens.

11. The process for fabricating a microlens mold according to claim 9, comprising the step of forming, after removing the first mask layer, a layer on the surface of the microlens mold, the layer being resistant to a gas or liquid with which the silicon mold material is etched.

12. A process for fabricating a microlens mold using a microlens mold fabricated by the microlens mold fabricating process according to claim 10, comprising the steps of: transferring the shape of the one surface of the microlens mold having a desired aspherical surface, to a preform for lens;removing the silicon substrate by etching the other surface of the microlens mold opposite the one surface; andremoving the layer formed on the one surface.