The invention relates to the general field of magnetic write heads with particular reference to pole trimming.
The stitched writer has been the major workhorse of the data recording industry for the past several years due to its capability to provide narrow track width as well as for its tolerance control. On the other hand, the planar writer has proven to have better mechanical behavior due to its planar and non-recessed structure. Both writer designs can, however, be further improved by adopting aggressive stitching techniques to overcome the following problems.
A.
B.
The present invention discloses how to overcome the alumina integrity problem at the ABS (air bearing surface). The invention makes possible both aggressive P3 stitching as well as aggressive P1 recession without any of the problems associated with the alumina integrity.
A routine search of the prior art was performed with the following references of interest being found:
In U.S. Pat. No. 6,608,737, a Headway patent, Han et al. show a plated P2 where Ps is stitched to P2. In U.S. Pat. No. 6,591,480, Chen et al. disclose forming both poles by plating where an upper pole yoke is plated over the upper pole piece.
It has been an object of at least one embodiment of the present invention to provide a process for pole trimming a stitched writer without causing any accessory damage thereto.
Another object of at least one embodiment of the present invention has been that said writer be a LDCR write head.
Still another object of at least one embodiment of the present invention has been that said writer be a planar writer.
A further object of at least one embodiment of the present invention has been to provide the structures that derive from said trimming processes.
These objects have been achieved by replacing the alumina filler layer, that is used to protect the stitched pole during trimming, with a layer of electro-plated material. Because of the superior edge coverage associated with the plating method of deposition, pole trimming can then proceed without the introduction of stresses to the stitched pole while it is being trimmed.
We will disclose the present invention through a description of improved processes for the manufacture of both LDCR and planar writers. These descriptions will also make clear the structures that are claimed.
Referring now to
The structure is then coated with a layer of a positive photoresist which, by exposing through a first mask and then performing a first development, gets patterned into mold 32 which surrounds coils 14 but leaves areas 33 at the top surface of lower pole 31 exposed. These areas are typically between about 2 and 4 microns wide.
In the next step, illustrated in
As a key feature of the invention, this is followed by the deposition, through electroplating, of layer of non-magnetic material 61 on upper magnetic pole 41 as well as the exposed areas 53. Our preferred materials for electroplated layer 61 have been any of NiPd, NiP, or NiCu, but any non-magnetic electro-platable material could have been used.
The process concludes with the removal of mold 52 followed by simultaneously polishing both magnetic poles until the ABS level is reached, making sure that some thickness of non-magnetic material 61 remains. Except for the presence of layer 61, The final structure is as seen in
Referring now to
A photoresist mold (not shown) is then formed which covers all surfaces except an area that extends from edge 81 of the cavity to a distance that is sufficient to leave fully exposed the step described immediately above (which can be seen to be covered by element 28 in
Then, through electroplating, layer of non-magnetic material 88 is deposited to a thickness sufficient to cover all of the above-described step (just behind where the ABS, marked by broken line 82, will eventually be), generally to a thickness between about 1.5 and 2.5 microns. Our preferred materials for electroplated layer 88 have been any of NiPd, NiP, or NiCu, but any non-magnetic electro-platable material could have been used. The mold used to contain the electroplate is then removed and the surface is planarized (using CMP) until layers 88, 71, and 17b all have coplanar top surfaces.
Finally, as seen in
The final structure is as seen in
This is a divisional application of U.S. patent application Ser. No. 10/782,496, filed on Feb. 19, 2004, now U.S. Pat. No. 7,251,102, which is herein incorporated by reference in its entirety, and assigned to a common assignee.
Number | Name | Date | Kind |
---|---|---|---|
4315985 | Castellani et al. | Feb 1982 | A |
6195872 | Sasaki | Mar 2001 | B1 |
6591480 | Chen et al. | Jul 2003 | B1 |
6608737 | Han et al. | Aug 2003 | B2 |
Number | Date | Country |
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61079785 | Apr 1986 | JP |
Number | Date | Country | |
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20070266551 A1 | Nov 2007 | US |
Number | Date | Country | |
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Parent | 10782496 | Feb 2004 | US |
Child | 11881316 | US |