Claims
- 1. A process for preparing an aromatic polymer which comprises heating a condensed oligomer obtained by reaction in a solvent of a dihalo benzenoid compound of the formula ##STR14## wherein Z represents --SO.sub.2 or --CO--; X and X' are halogen atoms which are ortho or para to Z with a substantially equivalent amount of an alkali metal hydroxide followed by removal of solvent; said condensed oligomer being heated at 200.degree.-400.degree. C. under a nonreactive atmosphere in the substantial absence of a solvent.
- 2. A process for preparing an aromatic polymer which comprises heating a condensed oligomer having a reduced viscosity of 0.06 to 0.2 as measured in a 1% solution of said oligomer in dimethyl formamide at 25.degree. C. obtained by reaction in a solvent of a dihalo benzenoid compound of the formula ##STR15## wherein Z represents --SO.sub.2 -- or --CO--; X and X' are halogen atoms which are ortho or para to Z, with a substantially equivalent amount of an alkali metal hydroxide followed by removal of solvent; said condensed oligomer being heated at 200.degree.-400.degree. C. under a nonreactive atmosphere in the substantial absence of a solvent.
- 3. The process of claim 1 wherein the condensed oligomer is heated at 200.degree.-400.degree. C. in a vacuum in the substantial absence of a solvent.
- 4. The process of claim 1 wherein the condensed oligomer is heated at 200.degree.-400.degree. C. in an inert gas atmosphere in the substantial absence of a solvent.
- 5. The process of claim 1, wherein the dihalobenzenoid compound has the formula ##STR16##
- 6. A process for preparing an aromatic polymer which comprises heating a condensed oligomer having units having the formula ##STR17## wherein Z represents --SO.sub.2 -- or --CO-- and the ether bond is ortho or para to Z; at 200.degree.-400.degree. C. under a nonreactive atmosphere in the substantial absence of a solvent.
- 7. A process for preparing an aromatic polymer which comprises heating a condensed oligomer having a reduced viscosity of 0.06 to 0.2 as measured in a 1% solution of said oligomer in dimethyl formamide at 25.degree. C. having units having the formula ##STR18## wherein Z represents --SO.sub.2 -- or --CO--; and the ether bond is ortho or para to Z; at 200.degree.-400.degree. C. under a nonreactive atmosphere in the substantial absence of a solvent.
- 8. The process of claim 6 wherein the condensed oligomer is heated at 200.degree.-400.degree. C. in a vacuum in the substantial absence of a solvent.
- 9. The process of claim 6 wherein the condensed oligomer is heated at 200.degree.-400.degree. C. in an inert gas atmosphere in the substantial absence of a solvent.
- 10. The process of claim 6, wherein the condensed oligomer has units having the formula ##STR19##
- 11. The process of claim 6 wherein the condensed oligomer has units having the formula ##STR20##
Priority Claims (5)
Number |
Date |
Country |
Kind |
40734/65 |
Sep 1965 |
GBX |
|
4176/66 |
Jan 1966 |
GBX |
|
4177/66 |
Jan 1966 |
GBX |
|
4178/66 |
Jan 1966 |
GBX |
|
9764/66 |
Mar 1966 |
GBX |
|
Parent Case Info
This is a division, of application Ser. No. 335,902 filed Feb. 26, 1973, now U.S. Pat. No. 4,051,109, which in turn is a continuation-in-part of our application Ser. No. 580,290 filed on Sept. 19, 1966, now abandoned.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
3886121 |
Yazi et al. |
May 1975 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
335902 |
Feb 1973 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
580290 |
Sep 1966 |
|