Claims
- 1. A process for the production of a covering sleeve for a medium-voltage cable joint comprising the following steps:
- extruding together a multilayer tubular structure comprising an internal semiconductive layer, an intermediate field-control layer having a dielectric constant and a dielectric rigidity for controlling electrical field distribution and selected to substantially prevent electric discharge through the sleeve and an external insulating layer;
- cutting lengths of said tube having each a predetermined length;
- partially removing from each of the predetermined lengths the internal semiconductor layer leaving only a central portion thereof to provide an electrode of semiconductive material centered around the cable joint; and
- shaping each of the lengths.
- 2. Covering sleeve for a medium voltage electric cable joint comprising:
- an insulating external layer,
- an intermediate field-control layer, and
- a conductive shield provided in the central zone of the field-control layer
- and characterized in that the conductive shield is a residual portion of a partially removed layer and in that the field-control layer has a relative dielectric constant between 6 and 12 and a dielectric rigidity greater than 5 kV/mm.
- 3. Covering sleeve in accordance with claim 2 in which the field-control layer is provided by an elastomer having the following mix:
- ______________________________________terpolymer ethylene-propylene-thiene 100zinc oxide 5calcined kaolin surface-treated with trimetoxyethoxy vinylsylane 60carbon black 80paraffinic plastifier 40poly 1.2 dihydro 2.4.4 trimethylkinolin 1.5stearic acid 1triallyl cyanurate 1diminyl peroxide 3.______________________________________
- 4. The process of claim 1, wherein the intermediate field-control layer has a dielectric constant between 6and 12.
- 5. The process of claim 1, wherein the intermediate field-control layer has a dielectric rigidity greater than 5 kV/mm.
- 6. The process of claim 1, wherein the extruding further comprises extruding the intermediate field-control layer having the relative dielectric constant equal to between 6 and 12 and the predetermined dielectric rigidity equal to greater than 5 kV/mm.
- 7. The process of claim 1, wherein the intermediate field-control layer comprises, in parts by weight, terpolymer ethylene-propylene-thiene about 100, zinc oxide about 5, calcined kaolin surface-treated with trimetoxyethoxy vinylsulane about 60, carbon black about 80, paraffinic plastifier about 40, poly 1.2 dehydro 2.4.4 treimethlykinolin about 1.5, stearic acid about 1, triallyl cyanurate about 1 and diminyl peroxide about 3.
- 8. The process of claim 1, further comprising the step of applying a conductive shield about the central portion of the internal semiconductive layer.
- 9. The process of claim 1, wherein the partially removing further comprises partially removing the internal semiconductor layer to form a conductive shield in the central portion and without substantial removal of the intermediate field-control layer.
- 10. The process of claim 1, wherein the partially removing comprises rounding an end of at least one of the electrodes of the lengths.
- 11. The process of claim 1, wherein each of the extruded layers is in contact with the next adjacent layer.
Priority Claims (1)
Number |
Date |
Country |
Kind |
MI94A1018 |
May 1994 |
ITX |
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Parent Case Info
This application is a continuation, of application Ser. No. 08/441,324, filed May 15, 1995 now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4363842 |
Nelson |
Dec 1982 |
|
4822952 |
Katz et al. |
Apr 1989 |
|
Foreign Referenced Citations (3)
Number |
Date |
Country |
0422567 |
Apr 1991 |
EPX |
2046032 |
Nov 1980 |
GBX |
WO9405064 |
Mar 1994 |
WOX |
Continuations (1)
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Number |
Date |
Country |
Parent |
441324 |
May 1995 |
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