Patent Application
20220350231
This application claims the priority benefit of Taiwan application serial no. 110115450, filed on Apr. 28, 2021. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
The disclosure relates to a projection device, and particularly relates to a projection device including a heat storage module.
Currently, the applications of projectors in different fields have become increasingly diversified. Taking the welcome lamp in the automotive market as an example, in some high-end cars, the welcome lamp module is installed at the bottom of the vehicle door, and the existing projector optical elements are embedded in the car shell. However, due to space constraints, the projection module needs to be miniaturized, so a fan cannot be added for heat dissipation of the system, but only natural convection is relied on as the main heat dissipation path of the system. Therefore, the temperature of key components in the projection module rises rapidly, and only a short operation time is available or only poor performance can be provided to meet the operation time required by the welcome lamp. In addition, the miniaturized projection module is also confined by the size of the heat dissipation module. The heat dissipation capability of the heat dissipation module is associated with its effective heat dissipation area; i.e., the smaller the heat dissipation module, the smaller the effective heat dissipation area.
The information disclosed in this Background section is only for enhancement of understanding of the background of the described technology and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art. Further, the information disclosed in the Background section does not mean that one or more problems to be resolved by one or more embodiments of the disclosure were acknowledged by a person of ordinary skill in the art.
The disclosure provides a projection device which exhibits efficient heat dissipation effect.
Other objectives and advantages of the disclosure may be further understood from the technical features disclosed herein.
To achieve one, part, or all of the above objectives or other objectives, an embodiment of the disclosure provides a projection device including a heat source module, a heat storage module, and a heat dissipation connecting element. The heat source module is configured to generate a light beam. The heat storage module includes a storage tank and a heat storage material, and the heat storage material is filled into the storage tank. The heat dissipation connecting element connects the heat source module and the heat storage module. Heat generated by the heat source module is transferred to the heat storage module through the heat dissipation connecting element.
In an embodiment of the disclosure, the heat storage material includes a phase change material or a heat capacity material having a specific heat capacity greater than 2000 J/(K·kg).
In an embodiment of the disclosure, the phase change material is a solid-liquid phase change material.
In an embodiment of the disclosure, the phase change material includes paraffin or indium alloy.
In an embodiment of the disclosure, the heat capacity material includes water or paraffin.
In an embodiment of the disclosure, the heat source module includes a light source module, and the light beam includes an illumination beam.
In an embodiment of the disclosure, the projection device further includes an optical engine module disposed on one side of the light source module and located on a transmission path of the illumination beam.
In an embodiment of the disclosure, the light source module includes a first light source module and a second light source module, the heat storage module includes a first heat storage module and a second heat storage module, and the heat dissipation connecting element includes a first heat dissipation connecting element and a second heat dissipation connecting element. The first light source module is connected to the first heat storage module through the first heat dissipation connecting element, and the second light source module is connected to the second heat storage module through the second heat dissipation connecting element.
In an embodiment of the disclosure, the light source module includes a first light source module and a second light source module, and the first light source module and the second light source module are connected to the heat storage module through the heat dissipation connecting element.
In an embodiment of the disclosure, the heat source module further includes a light valve module, and the light valve module is disposed in the optical engine module. The light beam further includes an image beam. The light source module includes a first light source module and a second light source module. The heat storage module includes a first heat storage module, a second heat storage module, and a third heat storage module. The heat dissipation connecting element includes a first heat dissipation connecting element, a second heat dissipation connecting element, and a third heat dissipation connecting element. The first light source module is connected to the first heat storage module through the first heat dissipation connecting element. The second light source module is connected to the second heat storage module through the second heat dissipation connecting element. The light valve module is connected to the third heat storage module through the third heat dissipation connecting element.
In an embodiment of the disclosure, the heat source module further includes a light valve module, and the light valve module is disposed in the optical engine module. The light beam further includes an image beam. The light source module includes a first light source module and a second light source module. The first light source module, the second light source module, and the light valve module are connected to the heat storage module through the heat dissipation connecting element.
In an embodiment of the disclosure, the heat source module includes a light valve module, and the light beam includes an image beam.
In an embodiment of the disclosure, the heat dissipation connecting element includes a heat pipe, a vapor chamber, or a heat dissipation plate.
In an embodiment of the disclosure, the projection device further includes a thermal interface material layer disposed between the heat source module and the heat dissipation connecting element and between the heat storage module and the heat dissipation connecting element.
In an embodiment of the disclosure, the thermal interface material layer includes a thermal grease or a thermally conductive film.
In an embodiment of the disclosure, the heat storage module includes a body part and a heat dissipation fin part. The body part includes the storage tank, and the heat dissipation fin part is connected to the body part and is located above the storage tank.
In an embodiment of the disclosure, the heat dissipation connecting element includes a body part and a heat dissipation fin part. The body part has an upper surface and a lower surface opposite to each other. The heat source module and the heat storage module are located on the upper surface, and the heat dissipation fin part is connected to the body part and is located on the lower surface.
In an embodiment of the disclosure, an orthographic projection of the storage tank on the body part overlaps with an orthographic projection of the heat dissipation fin part on the body part.
Based on the above, the embodiments of the disclosure exhibit at least one of the following advantages or effects. In the projection device of the disclosure, the heat storage module includes the storage tank and the heat storage material, and the heat storage material is filled into the storage tank. The heat dissipation connecting element connects the heat source module and the heat storage module, and heat generated by the heat source module is transferred to the heat storage module through the heat dissipation connecting element. Accordingly, the heat storage module may quickly store the heat generated by the heat source module, so the projection device of the disclosure can maintain an optimal operating brightness during short-time operation. In addition, in the disclosure, since it is not required to provide the projection device with a fan, an advantage of miniaturization can be achieved.
Other objectives, features, and advantages of the disclosure will be further understood from the further technological features disclosed by the embodiments of the disclosure wherein there are shown and described exemplary embodiments of this disclosure, simply by way of illustration of modes best suited to carry out the disclosure.
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.
In the following detailed description of the exemplary embodiments, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments in which the disclosure may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” etc., is used with reference to the orientation of the Figure(s) being described. The components of the disclosure can be positioned in a number of different orientations. As such, the directional terminology is used for purposes of illustration and is in no way limiting. On the other hand, the drawings are only schematic and the sizes of components may be exaggerated for clarity. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the disclosure. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless limited otherwise, the terms “connected,” “coupled,” and “mounted” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. Similarly, the terms “facing,” “faces” and variations thereof herein are used broadly and encompass direct and indirect facing, and “adjacent to” and variations thereof herein are used broadly and encompass directly and indirectly “adjacent to”. Therefore, the description of “A” component facing “B” component herein may contain the situations that “A” component directly faces “B” component or one or more additional components are between “A” component and “B” component. Also, the description of “A” component “adjacent to” “B” component herein may contain the situations that “A” component is directly “adjacent to” “B” component or one or more additional components are between “A” component and “B” component. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.
In this embodiment, the projection device 100a is, for example, a small-sized projection device for a car, which is disposed at the bottom on the inner side of the vehicle door and embedded in the car shell, and may serve as a welcome lamp. The heat source module 110 is, for example, a light source module, a light valve module, or a similar component which generates heat during operation. As a light source module, the heat source module 110 is configured to generate an illumination beam. As a light valve module, the heat source module 110 is located on the transmission path of an illumination beam and receives and modulates the illumination beam to form an image beam. When the vehicle door is opened, the projection device 100a projects various colors or various patterns/texts through the heat source module 110 to greet the passenger.
In addition, the heat storage material 122 of the heat storage module 120a of this embodiment is, for example, a phase change material. In this embodiment, the phase change material is a solid-liquid phase change material such as paraffin or indium alloy. Since the phase change material has high latent heat, when the temperature reaches the melting point of the phase change material, the phase change material in the molten state may continuously absorb the heat from the heat source module 110 while the temperature is maintained at a constant value or close to a constant value. Accordingly, the heat of the heat source module 110 can be temporarily and effectively absorbed by the phase change material, thereby damage of the heat source module 110 due to an excessively high temperature can be avoided.
In another embodiment, the heat storage material 122 may also be, for example, a heat capacity material having a specific heat capacity greater than 2000 J/(K·kg). In this embodiment, the heat capacity material is, for example, water or paraffin. Within the temperature variation range of the projection device 100a, the specific heat capacity of water is about 4200 J/(K·kg), and the specific heat capacity of paraffin is about 2200 J/(K·kg). The heat capacity material may absorb a large amount of heat from the heat source module 110 when the temperature variation is small. Accordingly, the heat of the heat source module 110 can be temporarily and effectively absorbed by the heat capacity material, thereby damage of the heat source module 110 due to an excessively high temperature can be avoided. In brief, the heat storage material 122 of this embodiment may be determined depending on the operating temperature and heat dissipation requirements of the projection device 100a, and the selection of the heat storage material 122 is not limited to those described above.
Moreover, the heat dissipation connecting element 130a of this embodiment is, for example, a heat pipe, a vapor chamber, or a heat dissipation plate. With the heat source module 110 and the heat storage module 120a connected through the heat dissipation connecting element 130a, the heat transfer efficiency can be effectively improved. Therefore, the heat generated by the heat source module 110 can be more quickly and efficiently transferred to the heat storage module 120a. In addition, the heat dissipation connecting element 130a also increases the overall heat dissipation area of the projection device 100a.
In this embodiment, the projection device 100a further includes a thermal interface material (TIM) layer 150, and the thermal interface material layer 150 is disposed between the heat source module 110 and the heat dissipation connecting element 130a and between the heat storage module 120a and the heat dissipation connecting element 130a. Through the thermal interface material layer 150, the heat transfer between the heat source module 110 and the heat dissipation connecting element 130a and the heat transfer between the heat storage module 120a and the heat dissipation connecting element 130a can be effectively improved, and the heat generated by the heat source module 110 can be more quickly and efficiently transferred to the heat storage module 120a. Specifically, the thermal interface material layer 150 of this embodiment is, for example, a thermal grease or a thermally conductive film.
In brief, in this embodiment, the heat generated by the heat source module 110 is transferred to the heat storage module 120a through the heat dissipation connecting element 130a, and the heat storage module 120a may quickly store the heat generated by the heat source module 110, so that the projection device 100a of this embodiment can maintain an optimal operating brightness during short-time operation. In addition, since it is not required to provide the projection device 100a of this embodiment with a fan, an advantage of miniaturization can be achieved.
It is noted that some of the reference numerals and descriptions of the above embodiment will apply to the following embodiments. The same reference numerals will represent the same or similar components and the descriptions of the same technical contents will be omitted. Reference may be made to the above embodiment for the omitted descriptions, which will not be repeated in the following embodiments.
As shown in
In another embodiment not shown, the projection device 100e further includes a casing. The casing is connected to the heat dissipation connecting element 130e, and the thermal interface material layer 150 is disposed between the casing and the heat dissipation connecting element 130e. Therefore, when the heat generated by the heat source module 110 is greater than the heat that can be stored by the heat storage module 120e, the heat may be transferred to the casing through the heat dissipation connecting element 130e to dissipate heat by convection between the casing and the outside. Accordingly, the heat would not be transferred back to the heat source module 110 and cause damage to the heat source module 110.
In summary of the above, the embodiments of the disclosure exhibit at least one of the following advantages or effects. In the projection device of the disclosure, the heat storage module includes the storage tank and the heat storage material, and the heat storage material is filled into the storage tank. The heat dissipation connecting element connects the heat source module and the heat storage module, and heat generated by the heat source module is transferred to the heat storage module through the heat dissipation connecting element. Accordingly, the heat storage module may quickly store the heat generated by the heat source module, so the projection device of the disclosure can maintain an optimal operating brightness during short-time operation. In addition, in the disclosure, since it is not required to provide the projection device with a fan, an advantage of miniaturization can be achieved.
The foregoing description of the exemplary embodiments of the disclosure has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure to the precise form or to exemplary embodiments disclosed. Accordingly, the foregoing description should be regarded as illustrative rather than restrictive. Obviously, many modifications and variations will be apparent to practitioners skilled in this art. The embodiments are chosen and described in order to best explain the principles of the disclosure and its best mode practical application, thereby to enable persons skilled in the art to understand the disclosure for various embodiments and with various modifications as are suited to the particular use or implementation contemplated. It is intended that the scope of the disclosure be defined by the claims appended hereto and their equivalents in which all terms are meant in their broadest reasonable sense unless otherwise indicated. Therefore, the term “the invention”, “the disclosure” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to exemplary embodiments of the disclosure does not imply a limitation on the disclosure, and no such limitation is to be inferred. The disclosure is limited only by the spirit and scope of the appended claims. Moreover, these claims may refer to use “first”, “second”, etc. following with noun or element. Such terms should be understood as a nomenclature and should not be construed as giving the limitation on the number of the elements modified by such nomenclature unless specific number has been given. The abstract of the disclosure is provided to comply with the rules requiring an abstract, which will allow a searcher to quickly ascertain the subject matter of the technical disclosure of any patent issued from this disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Any advantages and benefits described may not apply to all embodiments of the disclosure. It should be appreciated that variations may be made in the embodiments described by persons skilled in the art without departing from the scope of the disclosure as defined by the following claims. Moreover, no element and component in the disclosure is intended to be dedicated to the public regardless of whether the element or component is explicitly recited in the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 110115450 | Apr 2021 | TW | national |
