This application is a U.S. national stage application filed under 35 U.S.C. § 371 from International Application Serial No. PCT/EP2016/056917, which was filed 30 Mar. 2016, and published as WO2016/156395 on 6 Oct. 2016, and which claims priority to European Application No. 15382158.2, filed 30 Mar. 2015, which applications and publication are incorporated by reference as if reproduced herein and made a part hereof in their entirety, and the benefit of priority of each of which is claimed herein.
The present disclosure relates generally to electronic blasting systems, and particularly to protection devices against electromagnetic interference and electrostatic discharge.
Detonator and blasting systems have applications in the mining, quarry, construction, pipeline and geophysical exploration industries, where a multitude of detonators may be connected.
Electronic delay elements are provided in electronic detonators, in the inner part of a metallic round shell which is a piece holding an explosive charge; a printed circuit board (PCB) comprising the electronic components of the delayer is provided with an electric contact to said shell for electrostatic discharge (ESD) protection. The electric contact is usually provided by having metallic terminals from the PCB to the shell; however the use of metallic parts or terminals presents do not have proper protection against electromagnetic interference (EMI) because they do not provide a proper sealing at the open end in the inlet of the shell.
The current solutions used in the industry are made by hand soldered wire pieces and cannot be automated by surface mount technology (SMD) or any other automated process and as mentioned before do not protect against EMI.
Electronic devices are exposed to electromagnetic interferences so there is a need for a detonator which provides protection against EMI and ESD at the same time.
The present invention provides a solution for the aforementioned problem by an electronic detonator according to claim 1, a blasting system according to claim 9, method for enabling or disabling a blasting system according to claim 10, and a method for manufacturing an electronic detonator according to claim 11. Dependent claims define particular embodiments of the invention. All the features described in this specification (including the claims, description and drawings) and/or all the steps of the described method can be combined in any combination, with the exception of combinations of such mutually exclusive features and/or steps.
In a first aspect of the invention there is provided an electronic detonator with electronic delayer, comprising:
Advantageously, an electronic delayer comprising a resilient, compressible and conductive gasket provides protection against electromagnetic interference EMI. Besides, contacting a ground connection of the PCB and the inner surface of the conductive shell provides for protection against ESD.
The resilient, compressible and conductive gasket establishes a low resistance contact to the shell, and on the other hand seals the opened space in the inlet of the shell for EMI protection.
The use of the gasket allows the automatic assembly of the circuits instead of soldering wires by hand. This solution is cheaper and its production is faster by reducing the manual labor, in particular in SMD processes.
Advantageously the immunity of the electronic detonators against EMI and ESD applied to the circuit and/or the lead wires is enhanced, by using flexible gaskets connected to the circuit by any means e.g. surface mount technology.
In an embodiment of the invention the conductive shell is made of metal, preferably copper or aluminium. Advantageously a metallic shell acts like an electrically conductive shield.
In an embodiment of the invention the gasket is adapted to cover the complete opening between the PCB and the detonator shell. Advantageously this embodiment provides with full isolation of one side of at least a partial length of the PCB from any EMI external to the detonator.
In an embodiment of the invention the detonator comprises two conductive gaskets. Advantageously, positioning first gasket on one side of the PCB and second gasket on the opposite side provides with full isolation on both sides of at least a partial length of the PCB from any external EMI.
In an embodiment of the invention the gasket is positioned on a shield connection point of the PCB. The shield connection point of the PCB is the ground pin of the PCB. Advantageously this positioning provides proper grounding to the PCB and the detonator so that ESD is completely avoided.
In an embodiment of the invention the gasket is made of a low resistance material. Advantageously an electronic delayer comprising an elastic and compressible gasket for protection against EMI combined with a low DC resistance for circuit grounding to an external conductive surface provides an improved solution against ESD.
In an embodiment of the invention the gasket is positioned on a plane coinciding with the plane of the edge of the open end of the conductive shell. Advantageously, the gasket positioned on the edge allows the complete length of the PCB to be protected against any external EMI.
In an embodiment of the invention the gasket comprises an inner hole by which the gasket is connected to the shield connection point of the PCB, preferably by means of melted tin. Advantageously the position of the gasket on the PCB is securely fastened by an inner hole in the gasket.
In an embodiment of the invention the gasket is semi-circle shaped. Advantageously if a rounded shell is provided, a semi-circled shape of the gasket provides complete adaptation to the open space between the inner part of the shell and the PCB.
In a second aspect of the invention there is provided a blasting system comprising an electronic detonator with electronic delayer according to the first aspect of the invention.
In a third aspect of the invention there is provided a method for manufacturing an electronic detonator according to the first aspect of the invention comprising assembling at least one resilient, compressible and conductive gasket in a position such that the gasket is
In an embodiment of the third aspect of the invention the gasket is positioned on a shield connection point of the PCB.
These and other characteristics and advantages of the invention will become clearly understood in view of the detailed description of the invention which becomes apparent from preferred embodiments of the invention, given just as an example and not being limited thereto, with reference to the drawings.
Once the object of the invention has been outlined, specific non-limitative embodiments are described hereinafter.
Said solutions in the state of the art use normally 2 ways of protection, the first is to solder a piece of metal from the PCB to the shell, and the other solution is to have copper pads in the edge of the PCB to ease the spark between the shell and the pad in case of electrostatic discharge. None of these solutions provides with EMI protection in the way the invention does; besides, solutions in the state of the art require manual assembly process.
The PCB (22) grounded to the outer part of the shell (23) provides protection against ESD via a physical connection. ESD protection is therefore provided against voltage transients and other transient events.
Besides, the gasket (33) is positioned on a plane (34) coinciding with the plane of the edge of the open end of the conductive shell (35). Advantageously, the gasket (33) positioned on (34) the edge allows the complete length of the PCB (32), from the open end until the closed end where the explosive may be inserted, to be protected against any external EMI.
There is also shown an inner hole (36) by which the gasket (33) is connected to the shield connection point (31) of the PCB (32), preferably by means of melted tin (37). Advantageously the position of the gasket (33) on the PCB (32) is securely fastened by said inner hole (37) in the gasket.
In an embodiment, the gasket is a highly compressible and resilient electrically conductive pad which is compatible with standard surface mount technology (SMT) installation processes. Besides it is comprised in a conductive silver-coated hollow silicone extrusion bonded to a silver-plated metal support layer adapted to be welded. By piecing a series of parts of identical or varying lengths on a PCB ground trace, an efficient EMI seal can be formed between the PCB and corresponding shield housing. This enables users to create a low cost, custom EMI gasket at the board level without special tooling or custom installation equipment.
Manufacturing Method:
In
Different positions of the different parts of the detonator (6) and the sequence of assembling them are shown:
Number | Date | Country | Kind |
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15382158 | Mar 2015 | EP | regional |
Filing Document | Filing Date | Country | Kind |
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PCT/EP2016/056917 | 3/30/2016 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2016/156395 | 10/6/2016 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
5173569 | Pallanck et al. | Dec 1992 | A |
5929368 | Ewick | Jul 1999 | A |
7617775 | Teowee | Nov 2009 | B2 |
20040007834 | Kohler et al. | Jan 2004 | A1 |
20050011390 | Jennings, III | Jan 2005 | A1 |
Number | Date | Country |
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3533389 | Jun 1986 | DE |
WO-2016156395 | Oct 2016 | WO |
Entry |
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“European Application No. 15382158.2, Extended European Search Report dated Sep. 15, 2015”, (Sep. 15, 2015), 7 pgs. |
“International Application No. PCT/EP2016/056917, International Search Report and Written Opinion dated Dec. 9, 2016”, (Dec. 9, 2016), 8 pgs. |
Number | Date | Country | |
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20180106578 A1 | Apr 2018 | US |