The disclosure relates to a protective film and an electronic device including the protective film.
With the recent development of display technologies, flexible displays have been released to the market. Such a flexible display may be used to implement a display having a size-changeable screen. For example, electronic devices of a new concept, which include a display of which the screen size increases or decreases through sliding, a display rollable on a specific mechanical element, or a display deformable through folding, have also been developed.
The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure.
A protective film for protecting the surface of a display may be attached to a rollable or a foldable flexible display. The protective film may include a substrate layer and an adhesive layer for attaching the substrate layer to the display. The substrate layer may be formed of a hard material to reduce damage to the display.
In addition, as the substrate layer is formed of a hard material, a repulsive force generated in the substrate layer during rolling or folding thereof may be greater than that of the case in which the substrate layer is formed of a soft material. As a display is coupled to the substrate layer through the adhesive layer, the shape of the display may be deformed due to the repulsive force of the substrate layer, or the operation such as rolling or folding may be interrupted.
Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide a substrate layer, of a protective film, that is formed of a hard material and formed to have a low repulsive force. Therefore, it may be possible to alleviate the shape deformation of a display or the phenomenon that the operation such as rolling or folding is interrupted due to a repulsive force of the substrate layer.
Additional aspects will be set forth in part in the description which follows and in part, will be apparent from the description, or may be learned by practice of the presented embodiments.
In accordance with an aspect of the disclosure, an electronic device is provided. The electronic device includes a first housing, a second housing connected to the first housing such that a relative position thereof with respect to the first housing is changeable, a display including a window layer and a display panel disposed under the window layer and including a deformation area deformed as the relative position between the first housing and the second housing is changed, a substrate layer which includes a pattern in which multiple protrusions repeat and is disposed above the window layer, and an adhesive layer which is disposed between the window layer and the substrate layer such that at least a part thereof is disposed between the protrusions of the substrate layer, and has a refractive index adjustment member mixed therein in order to reduce a refractive index difference with the substrate layer.
In accordance with another aspect of the disclosure, a protective film disposed on a display of an electronic device is provided. The protective film includes a substrate layer which includes a pattern in which multiple protrusions repeat and is disposed above a window layer of the display, and an adhesive layer which is disposed between the window layer and the substrate layer such that at least a part thereof is disposed between the protrusions of the substrate layer, and has a refractive index adjustment member mixed therein in order to reduce a refractive index difference with the substrate layer.
According to various embodiments disclosed in the document, a substrate layer of a protective film may be formed of a hard material and have a low a repulsive force. Therefore, it may be possible to alleviate the shape deformation of a display or the phenomenon that the operation such as rolling or folding is interrupted due to a repulsive force of the substrate layer.
In addition, it may be possible to reduce a refractive index difference between the substrate layer and the adhesive layer of the protective film through the adhesive layer.
Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.
The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:
Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures.
The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.
The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustration purpose only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.
It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces.
With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements.
As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively,” as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it denotes that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element.
Referring to
The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in a volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in a non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.
The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.
The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134. The non-volatile memory 134 may include an internal memory 136 and an external memory 138.
The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.
The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.
The display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.
The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
The connection terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, a HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.
The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
The power management module 188 may manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.
The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a 5th generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.
The wireless communication module 192 may support a 5G network, after a 4th generation (4G) network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., the millimeter Wave (mmWave) band) to achieve, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1 ms or less) for implementing URLLC.
The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.
According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.
At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).
According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 or 104 may be a device of a same type as, or a different type, from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102 and 104 or the server 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet-of-things (IoT) device. The server 108 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.
According to various embodiments, an electronic device 200 illustrated in
Referring to
The electronic device 200 according to various embodiments disclosed in the document may be the electronic device 200 implemented such that an area of a display 230 (e.g., the display module 160 in
According to various embodiments, the display 230 may be a flexible display 230 which is bendable. In an embodiment, the display 230 may include a substrate made of a flexible material. For example, the display 230 may include a substrate formed of a polymer material made of a flexible material such as polyimide (PI) or polyethylene terephthalate (PET). In addition, the display may include a substrate made of a glass material formed very thin. The display 230 may be supported by a support member 250, and may have an area which is a portion seen to the outside and is increasable or decreasable according to sliding of the second housing 220 with respect to the first housing 210. In an embodiment, the display 230 may further include a touch sensing circuit (e.g., a touch sensor). In addition, the display 230 may be coupled or adjacently disposed to a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer for detecting a magnetic field type pen input device (a stylus pen). For example, the digitizer may include a coil member disposed on a dielectric substrate to be able to detect the resonance frequency of an electromagnetic induction method, which is applied from the pen input device.
According to various embodiments, a state of the electronic device 200 may be changed from a closed state (e.g., the state illustrated in
A closed state may mean a state in which the second housing 220 is fully slid in. The closed state may mean a state in which the second housing 220 has reached a position in which the second housing may no longer slide in. In the closed state, the ends of the first housing 210 and the end of the second housing 220 may be substantially coincident. For example, as illustrated in
An open state may mean a state in which the second housing 220 is fully slid out. The open state may mean a state in which the second housing 220 has reached a position in which the second housing may no longer slide out. The area of the display 230, which is visually exposed from the outside, may be larger in the open state than in the closed state.
According to an embodiment, sliding of the second housing 220 with respect to the first housing 210 may be performed semi-automatically. For example, sliding of the second housing 220 with respect to the first housing 210 may be performed by a member (not shown) for providing an elastic force in the sliding direction thereof. In this case, in case that sliding of the second housing 220 with respect to the first housing 210 is partially achieved, sliding of the second housing 220 may be achieved by an elastic force provided to the first housing 210 and/or the second housing 220.
According to an embodiment, sliding of the second housing 220 with respect to the first housing 210 may be performed automatically. For example, the second housing 220 may be slid with respect to the first housing 210 by a motor (not shown). The motor, which slides the second housing 220, may be operated according to a signal input through various buttons and sensors included in the electronic device 200.
According to various embodiments, a protective film 400 for protecting the display 230 may be disposed on the display 230. The protective film 400 may protect the display 230 from an external force. The protective film 400 may include a substrate layer 410 formed of a hard material and exposed to the surface of the electronic device 200 and an adhesive layer 430 formed of a soft material and disposed between the substrate layer 410 and the display 230. The substrate layer 410 may be attached to the display 230 through the adhesive layer 430. Referring to
According to various embodiments, the first housing 210 may include multiple housings. Since the second housing 220 slides with respect to the first housing 210, it may be understood that the second housing 220 slides with respect to the multiple housings included in the first housing 210. For example, the multiple housings included in the first housing 210 may include a front housing 211 constituting a part of the front surface (e.g., the surface oriented in the +Z-direction in
According to various embodiments, the second housing 220 may be slid with respect to the first housing 210. Referring to
According to various embodiments, the support member 250 may support a part of the display 230. The support member 250 may include a bendable structure. For example, the support member 250 may include a structure in which multiple bars 251 extending in a direction (e.g., the Y-axis direction with reference to
According to various embodiments, the support member 250 may be slid according to sliding of the second housing 220 and may support the display 230. Sliding of the support member 250 may be guided by guide rails 260. For example, both ends of the multiple bars 251 included in the support member 250 may be inserted into the guide rails 260, respectively, so that sliding of the support member 250 is be guided. The guide rails 260 for guiding the support member 250 may be coupled to the second housing 220. For example, as illustrated in
Referring to
In an embodiment, the deformation area 230C may be an area in which a part of the display 230 is deformed to correspond to the outer shape of the second housing 220. For example, as illustrated in
In an embodiment, the display 230 may be supported by the support member 250. Sliding of the support member 250 may be guided by the guide rails 260. The guide rails 260 may be formed to correspond to the round shape of the second housing 220 such that the support member 250 supports the deformation area 230C, and the support member 250 may be bent along the guide rails 260 corresponding to the round shape. For example, in case that the support member 250 includes the multiple bars 251, the gaps between the multiple bars 251 in the portion for supporting the deformation area 230C may be more spaced, compared to those of the portions for supporting the exposure area 230A or the storage area 230B of the display 230, and thus the support member 250 may be bent as a whole. The support member 250 may support the deformation area 230C of the display 230 in a state bent along the guide rails 260.
As the electronic device 200 slides, the sizes of the exposure area 230A and the storage area 230B may be changed. For example, the size of the exposure area 230A in a closed state (e.g., the state illustrated in
According to various embodiments, in case that the second housing 220 slides out, the display 230 supported by the support member 250 may slide so that the exposure area 230A increases and the storage area 230B decreases.
According to various embodiments, in case that the second housing 220 slides in, the display 230 supported by the support member 250 may slide so that the exposure area 230A decreases and the storage area 230B increases.
In the electronic device 200 according to various embodiments disclosed in the document, a part of the display 230 may be inserted into the accommodation space 280 or withdrawn from the accommodation space 280, so that the area of the display 230 seen from the outside of the electronic device 200 may increase or decrease. As the area of the display 230 seen from the outside changes, various operations such as adjusting the amount of information displayed thereon or adjusting the aspect ratio of the content displayed thereon may be performed.
The display 230 (e.g., the display module 160 in
Referring to
According to various embodiments, the window layer 310 may include a glass layer. According to an embodiment, the window layer 310 may include an ultra-thin glass (UTG). In some embodiments, the window layer 310 may also include polymer. In the case, the window layer 310 may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, the window layer 310 may also be disposed as multiple layers to allow a glass layer and polymer to be included therein.
According to various embodiments, the display panel 330 may include multiple pixels and a wire structure. According to an embodiment, the polarizer 320 may allow light, which is generated from a light source of the display panel 330 and vibrates in a predetermined direction, to selectively pass therethrough. According to an embodiment, the display panel 330 and the polarizer 320 may also be integrally formed. According to an embodiment, the display 230 may also include a touch panel (not shown).
According to various embodiments, the polymer layer 340 may be disposed under the display panel 330 to provide a dark background for securing visibility of the display panel 330, and may be formed of a buffer material for a buffer function. In some embodiments, in order to waterproof the display 230, the polymer layer 340 may be removed or may be disposed under the support plate 350.
According to various embodiments, the support plate 350 may provide a flexural characteristic to the display 230. For example, the support plate 350 may be formed of a non-metal thin plate-shaped material for supporting the display panel 330, such as fiber reinforced plastics (FRP) (e.g., carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP)) having a rigid characteristic. In some embodiments, the support plate 350 may also be formed of a metal material such as steel use stainless (SUS) (e.g., stainless steel (STS)), Cu, Al, or metal CLAD (e.g., a stacking member in which SUS and Al are alternately arranged). The support plate 350 may be used in order to help stiffness reinforcement of the electronic device 200 (e.g., the electronic device 101 in
According to various embodiments, the display 230 may include a digitizer panel which is disposed under the support plate 350 and is a detection member configured to receive an input of an electronic pen (e.g., a stylus). According to an embodiment, the digitizer panel may include coil members which are arranged on a dielectric substrate (e.g., a dielectric film or a dielectric sheet) so as to detect a resonance frequency of an electromagnetic induction type, which is applied from the electronic pen.
According to various embodiments, the protective film 400 (a protective layer) may be disposed on the upper part (e.g., the surface oriented in the +Z-direction with reference to
According to various embodiments, the protective film 400 may include the substrate layer 410 and the adhesive layer 430. The substrate layer 410 may be a layer exposed on the surface of the electronic device 200. In addition, the substrate layer 410 may be a layer to which the adhesive layer 430 is attached. The substrate layer 410 may be formed of a hard material having stiffness of a predetermined level or higher such that durability against an external force is secured. For example, even in case that a user uses the electronic pen on the surface of the substrate layer 410, the surface of the substrate layer 410 may not be damaged (e.g., scratched). The substrate layer 410 may be formed of a hard material such as polyethylene terephthalate (PET), thermal plastic polyurethane (TPU), polyurethane (PU), and polyimide (PI). The adhesive layer 430 may be disposed between the substrate layer 410 and the window layer 310 in order to attach the substrate layer 410 to the window layer 310. The adhesive layer 430 may be formed of a soft material such as an acrylic-based material, a silicone-based material, a rubber-based material, and a urethane-based material so as to be bendable. In addition, the adhesive layer 430 may include at least one of an optical clear adhesive (OCA), an optical clear resin (OCR), a pressure sensitive adhesive (PSA), a general adhesive, or a double-sided tape.
Meanwhile, in case that the display 230 is bent or folded, a repulsive force to be restored to the original shape thereof may be generated in the substrate layer 410. The magnitude of a repulsive force may be greater in the case that the substrate layer 410 is formed of a hard material than in the case that the substrate layer 410 is formed of a soft material. In this case, a repulsive force of the substrate layer 410 may interrupt an operation in which the display 230 is bent or folded. In addition, a repulsive force may change the shape of the display 230 coupled to the substrate layer 410 and the shape of the support member 250 coupled to the display 230.
Referring to
In some embodiments, a repulsive force of the substrate layer 410 may cause deformation of the protective film 400 and the display 230. For example, the substrate layer 410, the adhesive layer 430, and the display 230 may be a structure stacked in the order thereof. In case that the display 230 is bent or folded in the deformation area 203C through a sliding operation of the electronic device 200, a repulsive force to be restored to the original shape thereof may be generated in the substrate layer 410. In this case, a repulsive force generated in the substrate layer 410 may cause deformation in the substrate layer 410, the adhesive layer 430, and the display 230. Accordingly, the display 230 may be lifted or bent together with the protective film 400.
The protective film 400 according to various embodiments disclosed in the document may include the substrate layer 410 and the adhesive layer 430. The substrate layer 410 may be formed of a hard material to protect the display 230 from an external force. The adhesive layer 430 may attach the substrate layer 410 to the display 230. As will be described later, the substrate layer 410 may include the pattern 420 in which the multiple grooves 421 are repeated. The pattern 420 may be formed on the rear surface (e.g., the surface oriented in the −Z-direction with reference to
According to various embodiments, the protective film 400 may be configured such that the front surface of the substrate layer 410 is exposed to the outside of the electronic device 200 (e.g., the electronic device 101 in
Referring to
According to various embodiments, a repulsive force thereof may be reduced as the multiple grooves 421 constituting the pattern 420 are repeatedly formed, and thus the substrate layer 410 may become flexible.
In an embodiment, the depth H of the grooves 421 formed on the substrate layer 410 may be determined within a range which allows a repulsive force of the substrate layer 410 to be reduced to a predetermined level. In addition, the depth H of the grooves 421 may be determined within a range which allows the substrate layer 410 to maintain stiffness of a predetermined level or more. For example, the depth H of the grooves 421 may be 30% or more of the thickness in the width direction (e.g., the Z-axis direction with reference to
According to various embodiments, a part of the adhesive layer 430 may be disposed in the grooves 421 formed on the substrate layer 410. The adhesive layer 430 may be disposed on the rear surface of the substrate layer 410 so as to be in close contact with the pattern 420 of the substrate layer 410, so that a part thereof is filled in the grooves 421 of the substrate layer 410. In this case, the ratio in which the central area 411, in which the grooves 421 are formed on the substrate layer 410, is occupied by the adhesive layer 430, may increase compared to those of the remaining areas 412 of the substrate layer 410 except for the central area 411. Therefore, the central area 411 of the substrate layer 410, on which the grooves 421 are formed, may have a reduced repulsive force and an improved flexibility, compared to the remaining areas 412 of the substrate layer 410, on which the grooves 421 are not formed.
In the remaining areas 412 of the substrate layer 410, on which the grooves 421 are not formed, the ratio between the substrate layer 410 and the adhesive layer 430 may be the same. Accordingly, the substrate layer 410 may secure stiffness of a predetermined level or more.
The protective film 400 according to various embodiments disclosed in the document may include the substrate layer 410 and the adhesive layer 430. The substrate layer 410 may be formed of a hard material to protect the display 230 from an external force. The pattern 420 for reducing a repulsive force of the substrate layer 410 may be formed on the substrate layer 410. Referring to
In addition, as the result of the reduced repulsive force of the substrate layer 410, it may be possible to alleviate or solve the phenomenon in which the center portions of the multiple bars 251 included in the support member 250 are deformed due to a repulsive force of the substrate layer 410. Therefore, it may be possible to alleviate or solve the lifting phenomenon in which a portion of the display 230, which is coupled to the support member 250, protuberates in a specific direction compared to the other portions.
In addition, as the result that a repulsive force of the substrate layer 410 is reduced, regardless of the phenomenon that the central portion of the multiple bars 251 included in the support member 250 is deformed, it may be possible to alleviate or solve a phenomenon in which the protective film 400 and the display 230 themselves are deformed.
Referring to
According to various embodiments disclosed in the document, the pattern 420 formed on the substrate layer 410 may be formed in nanometer (nm) size such that a phenomenon, in which the pattern 420 is recognized, is alleviated or solved.
Referring to
According to various embodiments, the pattern 420 of the substrate layer 410 may include the multiple grooves 421 and the protrusions 422 convexly formed on one surface of the substrate layer 410 since the substrate layer is recessed due to the grooves. The grooves 421 and the protrusions 422 of the pattern 420 may be formed in nanometer size. In an embodiment, referring to
According to various embodiments disclosed in the document, the grooves 421 and the protrusions 422 of the pattern 420 may be formed in nanometer size of a wavelength of visible light or less. In this case, it may be possible to alleviate the phenomenon in which light incident onto the substrate layer 410 is reflected from the pattern 420. Therefore, it may be possible to alleviate or solve the phenomenon in which the transmittance of light with respect to the pattern 420 is increased so that the pattern 420 is recognized by a user.
According to various embodiments, the pattern 420 may be formed in a shape which reduces the degree of reflection of light incident onto the substrate layer 410 and then reflected from the pattern 420. In an embodiment, referring to
In addition, referring to
According to various embodiments, as the refractive index difference between the substrate layer 410 and the adhesive layer 430 increases, a phenomenon, in which light is reflected from the pattern 420 formed on the substrate layer 410, may increase. Therefore, visibility of the pattern 420 may increase. According to various embodiments disclosed in the document, a refractive index difference between the substrate layer 410 and the adhesive layer 430 may be reduced by adjusting the refractive index of the adhesive layer 430. Accordingly, visibility of the pattern 420 from the outside of the electronic device 200 may be reduced. A method of adjusting the refractive index of the adhesive layer 430 will be described in detail below.
According to various embodiments, the refractive index difference between the substrate layer 410 and the adhesive layer 430 may be adjusted in various methods. In an embodiment, the refractive index difference between the substrate layer 410 and the adhesive layer 430 may be reduced through adjusting the refractive index of the adhesive layer 430. In an embodiment, the refractive index of the adhesive layer 430 may be changed by adjusting a ratio of a solute and a solvent constituting the adhesive layer 430. For example, a solute or a solvent for adjusting the refractive index thereof may be mixed in or added to the adhesive layer 430. In an embodiment, a refractive index adjustment member 440 for reducing a refractive index difference with the substrate layer 410 may be mixed in the adhesive layer 430. The refractive index adjustment member 440 may be a solute such as a solid filler, or a solvent such as deionized (DI) water. The solid filler may be formed of a silica-based material.
In case that the refractive index of the adhesive layer 430 is lower than the refractive index of the substrate layer 410, a material for increasing the refractive index of the adhesive layer 430 may be mixed in the adhesive layer 430. In an embodiment, referring to
In case that the refractive index of the adhesive layer 430 is higher than the refractive index of the substrate layer 410, a material for decreasing the refractive index of the adhesive layer 430 may be mixed in the adhesive layer 430. In an embodiment, a solid filler having a refractive index lower than the refractive index of the adhesive layer 430 may be mixed in the adhesive layer 430. In this case, the refractive index of the adhesive layer 430 may be decreased than that of the existing adhesive layer, and thus may become substantially the same as the refractive index of the substrate layer 410. In some embodiments, the adhesive layer 430 may be configured such that the refractive index of the adhesive layer 430 is reduced by increasing the ratio of a solvent in comparison with a solute constituting the adhesive layer 430. For example, the adhesive layer 430 may have DI water mixed therein to reduce a refractive index thereof. In this case, the refractive index of the adhesive layer 430 may be decreased than that of the existing adhesive layer, and thus may become substantially the same as the refractive index of the substrate layer 410. Therefore, the refractive index difference between the substrate layer 410 and the adhesive layer 430 may be reduced, and thus it may be possible to increase the transmittance of light with respect to the pattern 420 formed on the substrate layer 410. Therefore, it may be possible to reduce visibility of the pattern 420 from the outside of the electronic device 200.
According to various embodiments disclosed in the document, the pattern 420 for reducing a repulsive force of the substrate layer 410 may be formed on the substrate layer 410. The pattern 420 formed on the substrate layer 410 may be formed in nanometer size such that the phenomenon, in which the pattern 420 is recognized from the outside of the electronic device 200, is alleviated or solved. Preferably, the pattern 420 may be formed in a size between 300 nm-700 nm which is a visible light wavelength band. In this case, light incident onto the substrate layer 410 may pass through the pattern 420 without being reflected from the pattern 420. Therefore, as the result of increasing the transmittance of light with respect to the pattern 420, it may be possible to alleviate or solve the phenomenon in which the pattern 420 is visually recognized from the outside of the electronic device 200.
Meanwhile, as the refractive index difference between the substrate layer 410 and the adhesive layer 430 increases, a phenomenon, in which light is reflected from the pattern 420 formed on the substrate layer 410, may increase. The refractive index adjustment member 440 (e.g., a solid filler or DI water) for reducing the refractive index difference between the substrate layer 410 and the adhesive layer 430 may be mixed in the adhesive layer 430. The refractive indices of the substrate layer 410 and the adhesive layer 430 may become substantially the same since the refractive index difference therebetween is reduced by the refractive index adjustment member 440 mixed in the adhesive layer 430. Therefore, it may be possible to alleviate or solve the phenomenon in which light is reflected from the pattern 420 formed on the substrate layer 410. Therefore, it may be possible to alleviate or solve the phenomenon in which the pattern 420 is recognized from the outside of the electronic device 200 since the transmittance of light with respect to the pattern 420 is increased.
According to various embodiments, the display 230 (e.g., the display module 160 in
In case that the pattern 420 is not formed on the central area 411 of the substrate layer 410, a repulsive force of the substrate layer 410 may deform the central portion of the multiple bars 251 included in the support member 250. Accordingly, the second area 232 of the display 230 coupled to the support member 250 may be deformed and thus a lifting phenomenon may occur. For example, referring to
According to various embodiments, the pattern 420 formed on the substrate layer 410 may be positioned on the second area 232 of the display 230, which corresponds to the central portion of the multiple bars 251 configured so as not to bend in one direction.
Referring to
According to various embodiments, the pattern 420 of the substrate layer 410 may be positioned on the deformation area 230C of the display 230. The pattern 420 of the substrate layer 410 may be formed on one area of the substrate layer 410, which corresponds to the deformation area 230C of the display 230.
Referring to
According to various embodiments, as illustrated in
An electronic device 500 to be described below may be a foldable electronic device 500 including a display 530 which is foldable with reference to a folding axis D-D of a hinge device as a form factor electronic device 500 different from the electronic device 200 described in
In the below description, in connection with elements which are identical or similar to elements described in
According to various embodiments, the electronic device 500 illustrated in
According to various embodiments, the first housing 510 and the second housing 520 may be connected to be foldable by a hinge device.
Referring to
According to various embodiments, the electronic device 500 may include the display 530 (e.g., the display 230 in
According to various embodiments, a protective film 600 may be disposed on the window layer 310 of the display 530. Here, the protective film 600 may include substantially the same configurations as those of the protective film 400 described above in
In addition, in case that the display 530 is folded as the first housing 510 and the second housing 520 are folded with reference to the folding axis D-D, the protective film 600 stacked on the display 530 may be folded together with the display 530. In this case, a repulsive force to be restored to the original shape thereof may be generated in a substrate layer 610 of the protective film 600. A repulsive force generated in the substrate layer 610 may interrupt a folding operation of the first housing 510 and the second housing 520. For example, the gaps between the first housing 510 and the second housing 520 of the electronic device 500 may be spaced due to a repulsive force of the substrate layer 610 in a folded state.
The protective film 600 according to various embodiments disclosed in the document may include the substrate layer 610 and an adhesive layer 630. The substrate layer 610 may be formed of a hard material to protect the display 530 from an external force. A pattern 620 for reducing a repulsive force of the substrate layer 610 may be formed on the substrate layer 610. Referring to
According to various embodiments, the pattern 620 formed on the substrate layer 610 may be positioned on the deformation area 532 of the display 530. In an embodiment, the pattern 620 may be formed on the central area 611 of the substrate layer 610, which corresponds to the deformation area 532 of the display 530. The pattern 620 may extend in a direction parallel to the folding axis D-D (e.g., the Y-axis direction with reference to
According to various embodiments, as illustrated in
The above-described protective films 400 and 600 may also be applied to a display module of a bar type electronic device, in addition to the slidable electronic device 200 illustrated in
An electronic device (e.g., the electronic device 101 in
In addition, the refractive index of the adhesive layer and the refractive index of the substrate layer may be substantially identical to each other.
In addition, the refractive index adjustment member may include a solid filler.
In addition, the widths R1 and R2 of the protrusions may have a nanometer size.
In addition, each of the protrusions may have a width of 300 nm to 700 nm.
In addition, the protrusions may have cross-sectional areas decreasing along a direction from the substrate layer to the adhesive layer.
In addition, the first housing may be coupled to be slidable with respect to the second housing, at least a part of the display may be inserted into the accommodation space 280 of the electronic device or withdrawn from the accommodation space according to sliding of the second housing, and the deformation area 230C of the display may be an area deformed by sliding of the first housing with respect to the second housing.
In addition, the support member 250 (e.g., the support plate 350 in
In addition, the pattern of the substrate layer may extend in a direction (e.g., the X-axis direction in
In addition, the pattern of the substrate layer may be positioned on the deformation area.
In addition, a hinge device, which is configured to connect the first housing and the second housing so as to be foldable with reference to a folding axis (e.g., the D-D axis in
In addition, the pattern of the substrate layer may be positioned on the deformation area and extend in a direction (e.g., the Y-axis direction with reference to
In addition, the adhesive layer may be formed of at least one material among an acrylic-based material, a silicone-based material, a rubber-based material, and a urethane-based material.
The protective film 400 or 600 disposed on a display (e.g., the display module 160 in
In addition, the refractive index of the adhesive layer and the refractive index of the substrate layer may be substantially identical to each other.
In addition, the refractive index adjustment member may include a solid filler.
In addition, the widths R1 and R2 of the protrusions may have a nanometer size.
In addition, each of the protrusions may have a width of 300 nm to 700 nm.
In addition, the protrusions may have cross-sectional areas decreasing along a direction from the substrate layer to the adhesive layer.
In addition, the display may include a deformation area (e.g., the deformation area 230C in
While the disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.
Number | Date | Country | Kind |
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10-2022-0019141 | Feb 2022 | KR | national |
10-2022-0043422 | Apr 2022 | KR | national |
This application is a continuation application, claiming priority under § 365(c), of an International application No. PCT/KR2023/001790, filed on Feb. 8, 2023, which is based on and claims the benefit of a Korean patent application number 10-2022-0019141, filed on Feb. 14, 2022, in the Korean Intellectual Property Office, and of a Korean patent application number 10-2022-0043422, filed on Apr. 7, 2022, in the Korean Intellectual Property Office, the disclosure of each of which is incorporated by reference herein in its entirety.
Number | Date | Country | |
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Parent | PCT/KR2023/001790 | Feb 2023 | US |
Child | 18178067 | US |