Patent Application
20120122317
The invention relates to a device for pulsed laser deposition, which device comprises:
Pulsed laser deposition (PLD) is a known technique for arranging a coating on an object. With this technique material of a target material is ablated by a laser, such that a plasma plume of this target material is achieved. This plasma plume then is deposited on a substrate resulting in a coating of the target material on the substrate.
PLD was at first developed for coating small substrate surfaces, typically 10 millimeters by 10 millimeters. This is typically used in research environments, where small substrates are coated with all kinds of materials with high thin film quality.
Resulting from this research a need to coat larger surfaces originated. This has resulted in innovative techniques with which surfaces having a typical diameter of several inches or more can be coated.
The substrate can be coated with several layers with this PLD technique. Out of such a substrate with several layers, it is possible to manufacture devices by applying photolithography. The disadvantage of this manufacturing process, is that the substrate has to be removed from the vacuum chamber and has to be transported to a clean room for the photolithography. The process photolithography is often used in microfabrication to selectively remove parts of a thin film (or the bulk of a substrate). It is used to transfer a geometric pattern from a photomask to a light-sensitive chemical (photoresist, or simply “resist”) on the substrate. A series of chemical and/or physical treatments then engraves the exposure pattern into the material underneath the photoresist. In a complex integrated circuit (for example, modern CMOS), a wafer will go through the photolithographic cycle up to 50 times.
Sometimes it is necessary to transport the substrate back to the vacuum chamber to arrange by PLD an additional coating. Due to the risk of contamination by dust particles of the substrate, this method is undesired. Another disadvantage is that the substrate with thin films and structure has often to be heated again for the deposition process. Heating after cooling can have an influence on the deposited thin film properties and has to be limited as well. Another method to structure a pattern during deposition is to place a shadow mask or stencil on top of the substrate with a small mask-substrate distance. This configuration ensures that a specific pattern is coated on the substrate by PLD. Such a shadow mask is attached to the substrate by screws or bolts and is typically mounted on as well as removed from the substrate outside of the vacuum chamber. It is necessary to arrange the shadow mask in close contact with the substrate to achieve a sharp image of the mask onto the substrate.
This kind of attachment is furthermore necessary as the prior art PLD techniques have the substrate mount arranged vertically. Without a proper attachment of the shadow mask to the substrate, the mask could shift or even come loose from the substrate.
Accordingly it is an object of the invention to at least partially resolve the above mentioned problems.
This object is achieved by the invention, which is characterized in that the shadow mask is arranged in a movable disc, which movable disc is movable in axial direction to and from the substrate mount.
With a device according to the invention it is possible to arrange and remove the shadow mask when desired. This is done by moving the movable disc away from the substrate mount, such that the disc is free to move in directions parallel to the substrate surface. Then the disc is moved to a desired position, for example to a position in which the shadow mask is positioned over the substrate mount. Finally, the disc is again lowered onto the substrate mount, such that a close contact is established between the substrate on the substrate mount and the shadow mask arranged in the movable disc.
The movement of the disc could be a rotation, translation or combination of both in one or more dimensions. Preferably, the disc can be translated in axial direction and rotated around the axis.
Preferably the movable disc comprises a number of shadow masks. This enables the manufacturing of devices with the PLD technique having complex structures.
In an embodiment of the device according to the invention the movable disc comprises at least one opening for housing the shadow mask. Preferably, the opening comprises a flange for supporting the shadow mask.
In this embodiment, the shadow mask is housed in the opening, which ensures a correct position of the shadow mask relative to the movable disc. A preferred embodiment of the device according to the invention comprises spring means for urging the at least one shadow mask against the movable disc. As the shadow mask is spring mounted, small differences in alignment in the direction perpendicular to the surface of the substrate can be resolved. Furthermore, the spring means provide a substantial constant force with which the shadow mask is pressed against the substrate.
For large area PLD the substrate is sometimes rotated. If the substrate rotates the shadow mask has to rotate as well. To ensure that the gap between the rotating mask and substrate is small a relatively heavy ring can be placed on top of the shadow mask such that additional force can be exploited. This ring is placed such that no holes of the shadow mask are covered. The ring can have a complex structure such that also the middle part of the shadow mask can be pushed against the substrate.
In another preferred embodiment of the device according to the invention the at least one shadow mask comprises primary alignment means for aligning the shadow mask relative to the movable disc. These alignment means could for example comprise a ridge arranged on the shadow mask, which co acts with a notch in the movable disc.
In yet another preferred embodiment of the device according to the invention, the device comprises secondary alignment means for aligning the movable disc to the substrate mount. The disc could for example be under an angle, such that the shadow mask is not properly brought into contact with the substrate. Also due to eccentricity of the disc, it could be that not all shadow masks would be aligned the same without the secondary alignment means.
Preferably, at least two alignment notches are arranged on opposite sides of the substrate mount for aligning cooperation with the movable disc. For example pins arranged on the disc or the shadow mask could be inserted into these alignment notches.
In a very preferred embodiment of the device according to the invention the target mount is arranged on a movable arm comprising a number of target mounts. This enables one to deposit several materials on the substrate without having to open up the vacuum chamber to exchange the target material. In combination with the exchangeable shadow masks it is possible to manufacture complex devices composed out of several layers of different materials and in different patterns.
Yet another embodiment of the invention comprises vision means for observing the orientation of the at least one shadow mask relative to the substrate. Preferably the vision means comprise a camera or a microscope.
With the invention several masks can be easily exchanged but the masks still have to be aligned with respect to the substrate structures. Aligning several masks relative to the substrate with a micrometer precession can be done according to the invention with positioners and vision means such as an optical or scanning electron microscope. With such a microscope the in plane movement (x, y) as well as the rotation (φ) of the substrate relative to the mask can be observed during manipulation. The substrate which is placed on a holder should be positionable in x, y, z as well as rotated. The microscope observation can be used as feedback in the positioning of the substrate relative to the mask.
When the vision means cannot observe the shadow mask in one view or when a close-up is desired, it is preferred that the vision means can be moved in at least two dimensions parallel to the shadow mask. Movement in the third dimension can be used for focusing the vision means and/or for removing the vision means.
In another embodiment the vision means are movable towards and away from the at least one shadow mask. Preferably, the the vision means are arranged on the rotatable arm. However, the vision means can also be arranged on a separate guide attached to the vacuum chamber wall or the like.
In order to look at the surface and position the substrate relative to the shadow mask an optical microscope preferably has to be placed directly above the shadow mask to observe the alignment markers which are typically used in photolithography to align sequentially several masks.
The inventions furthermore relates to a method for operating a device according to the invention, the method comprising the steps of:
In a further embodiment of the method according to the invention, the rotatable arm is rotated such that a second target mount with a second target material is arranged opposite of the substrate.
Preferably, the method according to the invention comprises the step of moving the substrate mount up after lowering the movable disc. This makes it possible to properly align the movable disc to the substrate mount and by moving the substrate mount up, it is ensured that the substrate is pressed to the shadow mask to ensure close contact.
In any of the above embodiments of the device according to the invention, it is preferred, that the direction of gravity is perpendicular to the surface of the substrate and that the shadow mask is arranged on top of the substrate.
These and other features and advantages of the invention will be elucidated in conjunction with the accompanying drawings.
Above the substrate mount 2 a rotatable frame 4 with four arms 5 is arranged. On each free end of the arms 5 a target mount 6 is arranged. On each target mount a specific target material can be arranged.
In between the target mount 6 and the substrate mount 2, a rotatable disc 7 is arranged. The disc 7 has five openings 8, in which shadow masks 9 are arranged except for one opening 8.
From the opening 8, in which no shadow mask 9 is present, it is clear, that each opening is provided with a flange 10, which supports the shadow mask 9.
The shadow mask 9 itself is provided with a reduced diameter at the bottom, which is almost the same as the inner diameter of the flange 10. This ensures a proper alignment of the shadow mask 9 relative to rotatable disc 7.
On top of the shadow mask 9 a number of spring elements 14 are present, which urge the shadow mask 9 into the opening 8 of the disc 7.
In the next step, shown in
Then the substrate mount 2 with the substrate 3 is moved up, as shown in
By bringing the shadow mask 9 in close contact with the substrate, the shadow mask 9 is pushed somewhat up in the opening 8, such that the shadow mask 9 is located above the flange 10. The advantage is that when the shadow mask 9 and substrate 3 expand due to high temperatures, the shadow mask 9 is not restricted by the disc 7 and in particular the flange 10 of the opening 8.
In
In
In order to ensure a proper alignment of the shadow mask 20 to the substrate 27, a microscope 32 is lowered to near the shadow mask 20. With the microscope 32 the alignment markers 22 can be observed and the substrate 27 below the shadow mask 20. The alignment markers of a previous mask will have left a mark on the substrate 27 and by aligning these marks with the alignment markers 22 it is ensured that the next shadow mask 20 is properly aligned.
The alignment can be performed by positioning the substrate mount 26 with the positioners 34, 35, 36, 37 which provide movement in all three dimensions as well as a rotation.
| Number | Date | Country | Kind |
|---|---|---|---|
| 09158528.1 | Apr 2009 | EP | regional |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/EP2010/054877 | 4/14/2010 | WO | 00 | 1/20/2012 |
