The present invention relates to a pump structure.
A technology related to a pump configured to pump a fluid by bending vibration of a plate-shaped piezoelectric actuator has been developed (for example, Patent Documents 1 and 2). In the structure of the pump disclosed in Patent Documents 1 and 2, a bending vibration portion of the piezoelectric actuator is supported by a surrounding fixing portion.
Patent Document 1: US 2017/222122 A
Patent Document 2: JP 5177331 B
In order to improve the characteristics of the pump having the structure disclosed in Patent Documents 1 and 2, it is conceivable to increase the length of a support portion that supports the bending vibration portion of the piezoelectric actuator with respect to the fixing portion. This is because it is assumed that the amplitude of the piezoelectric actuator increases as the rigidity of the support portion decreases. However, in such a case, the area occupied by the piezoelectric actuator and the support portion increases, and therefore, it may be difficult to downsize the pump.
Accordingly, in order to realize downsizing, it is conceivable to form the support portion in a short linear shape and to increase the rigidity of the support portion such that the support portion can support the piezoelectric actuator. However, in such a case, the amplitude of the piezoelectric actuator decreases, and thus the characteristics of the pump may be deteriorated. Therefore, although it is conceivable to process the support portion to reduce thickness, in such a case, the support portion may be formed having excessively low rigidity due to decreased processing accuracy. In other words, it may be difficult for the pump having the structure disclosed in Patent Documents 1 and 2 to achieve an improvement in the characteristics and downsizing in a compatible manner.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a technology that can achieve an improvement in the characteristics of a pump configured to pump a fluid by bending vibration of a plate-shaped piezoelectric actuator and downsizing of the pump in a compatible manner.
The present invention adopts the following configurations in order to achieve the above-mentioned object.
In other words, a pump structure according to an aspect of the present invention includes: an actuator formed in a plate shape and having a plate surface capable of bending vibration by action of an element having a piezoelectric effect;
According to such a configuration, the support portion includes the folded portion, and thus the entire length of the support portion can be increased. Therefore, the rigidity of the support portion is decreased, and the amplitude of the bending vibration of the actuator supported by the support portion increases. As a result, the pump function is improved. Further, according to the configuration, even in a case where the entire length of the support portion is long, the support portion can be folded back and overlapped, and thus the size of the support portion can be reduced. Therefore, downsizing of the pump can be realized. Furthermore, according to the configuration, the location where the support portion is disposed is the largest region of the regions occupied by the fixing portion if the support portion does not exist. Therefore, according to the configuration, it is obvious that by providing the support portion in such a location, a space is effectively utilized and the entire pump is downsized.
In the pump structure according to the aspect described above, the support portion may include a first end portion connected to the actuator and a second end portion connected to the fixing portion. The first end portion and the second end portion may be one each, and the first end portion and the second end portion may be disposed side by side on the virtual line.
According to such a configuration, the first end portion and the second end portion are disposed side by side on the virtual line when viewed from the center point. Therefore, the actuator is stably supported with respect to the fixing portion. As a result, the bending vibration of the actuator is stabilized.
In the pump structure according to the aspect described above, the support portion may be disposed symmetrically with respect to the virtual line.
According to such a configuration, the structure of the support portion is a branched structure symmetrical with respect to the virtual line. Therefore, the support portion can stably support the actuator. As a result, the bending vibration of the actuator is stabilized.
In the pump structure according to the aspect described above, when the virtual line is a center line, the support portion may be disposed in one of portions into which a region is divided by the center line.
According to such a configuration, the region occupied by the support portion along the outer shape of the actuator can be reduced. Therefore, downsizing of the pump can be realized.
In the pump structure according to the aspect described above, the support portion may be folded up into concertinas.
According to such a configuration, the entire length of the support portion can be further increased. Therefore, the rigidity of the support portion is decreased. Consequently, the amplitude of the bending vibration of the actuator supported by the support portion increases. As a result, the pump function is improved. In addition, according to the configuration, since the support portion is folded up into concertinas, the size of the support portion can be reduced. Therefore, downsizing of the pump can be realized.
In the pump structure according to the aspect described above, the actuator may have a disk shape, the outer shape in the plate surface direction of the fixing portion may be rectangular, and the support portion may include support portions disposed at four corners of the fixing portion.
According to such a configuration, the location where the support portion is disposed is the largest region of the regions occupied by the fixing portion if the support portion does not exist. Therefore, according to the configuration, it is obvious that by providing the support portion in such a location, a space is effectively utilized and the entire pump is downsized. In addition, since the support portion is disposed in such a position, the actuator can be supported symmetrically with respect to the center point of the actuator. As a result, the pump can be downsized and the bending vibration of the actuator can be stabilized.
In the pump structure according to the aspect described above, the support portion may be provided with a slit having a substantially constant width.
According to such a configuration, the aspect ratio between the depth and width of the slit is substantially constant. Therefore, when the slit is formed by etching, the occurrence of a difference in etching rate depending on the location is suppressed.
In the pump structure according to the aspect described above, the support portion may be rounded at an intersecting portion between surfaces orthogonal to the plate surface direction.
According to such a configuration, stress acting on the rounded intersecting portion can be reduced. Therefore, breakage of the support portion can be suppressed. In addition, since the intersecting portion is rounded, the support portion is downsized.
According to the present invention, a technology can be provided that can achieve an improvement in the characteristics of a pump configured to pump a fluid by bending vibration of a plate-shaped piezoelectric actuator and downsizing of the pump.
Further, the pump 1 is provided with a fixing plate 4 disposed around the vibration plate 3. The fixing plate 4 has a rectangular shape, and the fixing plate 4 is, for example, an SOI as with the vibration plate 3. Furthermore, the fixing plate 4 is disposed at a predetermined interval from the vibration plate 3 in the plate surface direction.
Further, the pump 1 is provided with a support portion 5 between the vibration plate 3 and the fixing plate 4. The support portion 5 is connected to both the fixing plate 4 and the vibration plate 3. Furthermore, the support portion 5 supports the vibration plate 3 with respect to the fixing plate 4. Additionally, the support portions 5 are disposed close to four corners of the rectangular fixing plate 4.
Also, as illustrated in
The pump 1 as described above is manufactured by the following method. In other words, the structure of the pump 1 illustrated in
According to the pump 1 described above, since the support portion 5 is provided with the folded portion 6, the entire length of the support portion 5 can be increased. Therefore, the rigidity of the support portion 5 is decreased. Consequently, the amplitude of the bending vibration of the piezoelectric element 2 and the vibration plate 3 that are supported by the support portion 5 increases. As a result, the pump function is improved. Further, according to the pump 1 described above, even when the entire length of the support portion 5 is long, the support portion 5 can be folded back and overlapped, and thus the size of the support portion 5 can be reduced. Therefore, downsizing of the pump 1 can be realized. Furthermore, according to such a pump 1, downsizing of the pump 1 can be realized while the pump function is maintained without reducing the size of the vibration plate 3 itself.
Additionally, according to the pump 1 described above, the end portion 7 and the end portion 8 are disposed side by side on the virtual line when viewed from the center point. Therefore, the piezoelectric element 2 and the vibration plate 3 are stably supported by the fixing plate 4. As a result, the bending vibration of the piezoelectric element 2 and the vibration plate 3 is stabilized.
Moreover, according to the pump 1 described above, the structure of the support portion 5 has a branched structure that is symmetrical with respect to the virtual line passing through the end portion 7 and the end portion 8. Therefore, the support portion 5 can stably support the piezoelectric element 2 and the vibration plate 3. As a result, the bending vibration of the piezoelectric element 2 and the vibration plate 3 is stabilized.
Further, according to the pump 1 described above, the four corners of the fixing plate 4 at which the support portions 5 are disposed are the largest regions of the regions occupied by the fixing plate 4 if the support portions 5 do not exist. Thus, according to such a pump 1, it is obvious that by providing the support portions in such a location, a space is effectively utilized and the entire pump 1 is downsized. Furthermore, according to the pump 1 described above, the support portions 5 are disposed at the four corners of the rectangular fixing plate 4, and thus the support portions 5 can support the piezoelectric element 2 and the vibration plate 3 symmetrically with respect to the center point of the piezoelectric element 2. As a result, the pump 1 can be downsized and the bending vibration of the piezoelectric element 2 and the vibration plate 3 can be stabilized.
In addition, according to the pump 1 described above, the aspect ratio between the depth and width of the slit 14 of the support portion 5 is substantially constant. Therefore, when the slit 14 is formed by etching, the occurrence of a difference in etching rate depending on the location is suppressed.
Moreover, according to the pump 1 described above, the intersecting portion (for example, the portion 15) between the surfaces orthogonal to the plate surface direction of the support portion 5 is rounded. Therefore, stress acting on the rounded intersecting portion can be reduced. Therefore, breakage of the support portion 5 can be suppressed. Additionally, the intersecting portion is rounded, and thus the support portion 5 is downsized.
According to the pump 1B described above, the same effects as those of the pump 1 according to the embodiment are achieved. In addition, the pump 1B can have a longer overall length of the support portion 5B. Therefore, the rigidity of the support portion 5B is decreased. Consequently, the amplitude of bending vibration of a piezoelectric element 2B and the vibration plate 3B that are supported by the support portion 5B increases. As a result, the pump function is improved.
There may be a plurality of end portions 7 that are connection portions between the support portion 5 and the vibration plate 3 and a plurality of end portions 8 that are connection portions between the support portion 5 and the fixing plate 4. Further, the end portion 7 and the end portion 8 may not be disposed on the virtual line passing through the center point of the vibration plate 3. Furthermore, the shapes of the vibration plate 3 and the fixing plate 4 are not limited to the aforementioned example and may be any shapes as long as the vibration plate and the fixing plate are not similar in shape. In addition, the width of the slit 14 of the support portion 5 may not be substantially constant. Moreover, the portion 15 and the like (see
The embodiments and modified examples disclosed above can be combined with each other.
Number | Date | Country | Kind |
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2022-001872 | Jan 2022 | JP | national |
This application is the U.S. national stage application filed pursuant to 35 U.S.C. 365(c) and 120 as a continuation of International Patent Application No. PCT/JP2022/047200, filed Dec. 21, 2022, which application claims priority to Japanese Patent Application No. 2022-001872, filed Jan. 7, 2022, which applications are incorporated herein by reference in their entireties.
Number | Date | Country | |
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Parent | PCT/JP2022/047200 | Dec 2022 | WO |
Child | 18442698 | US |