Patent Grant
7657960
1. Field of the Invention
The present invention is directed towards power buffing equipment for automobile body refinishing, and more particularly, to a quick release connector used to connect a dual-sided buffing pad assembly to a power buffer or polisher.
2. Description of Related Art
Buffing refers to the application of a chemical or compound to a surface using a buffing pad. In the automotive detailing industry, for example, buffing is used to repair, refinish or polish the exterior surfaces of automobiles. Buffing can be done by hand, however, professionals and consumers alike prefer to use buffing pads with power buffers. A power buffer can be pneumatic, in which the power is supplied by an air compressor, or motorized, in which the power is supplied by an electric motor. A motorized power buffer is a hand-held tool having a buffing pad attached to a spindle that extends from the electric motor. The motor spins the buffing pad and thus results in faster performance, while reducing fatigue on the operator. It also allows the operator to get optimum finishing effects as compared to buffing by hand.
There are two types of motorized power buffers, including high-speed rotary buffers and dual-action or random orbital buffers. The main difference between the two relates to the direction of the rotation of the buffing pad assembly, which in turn produces different results. High-speed buffers provide a circular motion, spinning at very high continuous revolutions per minute (RPMs) and can have either one or two buffing pads attached to the motor. For example, a dual-head buffer is a high-speed rotary buffer having two buffing pads attached to the motor, adjacent to each other. Dual-action or random-orbital buffers turn in a combined circular and orbital motion, at varying speeds. The continuous revolutions of either type of buffer causes friction on contact with the surface producing heat, that when combined with a compound alters the surface of the automobile. Power buffers are used for various purposes, including repairing damages to surfaces or for different finishing effects. The buffing pads are usually circular, are made in varying sizes and are made of various materials, such as natural wool, synthetic fibers, a blend of wool and synthetic fibers or open or closed cell synthetic foam.
Because the power buffer spins the buffing pad at a high rotational rate, the type of motion, whether it be circular, orbital or both, is integral to the desired polishing and/or waxing effect. Consequently, effective performance of the power buffer relates to the interaction between the compound, the buffing pad and the power buffer, and more particularly the connection between the buffing pad assembly and the power buffer, which directly effects the rotation. If any one of these fail, the results will be less than desirable. An uneven application of the compound can cause unsightly swirls on the surface that can only be removed by a polisher and not by hand, if at all. Certain compounds and pads, e.g., wool pads, are inherently designed to cut into the paint to repair damages. An uneven application or a faulty assembly can cause the wool pad to chip away at the surface and cause more damage. Thus, a proper connection between the buffing pad and the power buffer is critical to achieving desired results.
Buffing pads can be either single-sided or dual-sided. The single-sided pad is affixed to a backing plate made of plastic, metal or other rigid material. A dual-sided buffing pad includes a central backing plate that is sandwiched between two pads. Dual-sided pads are advantageous since they can be flipped over to provide continuous use. Also, dual-sided pads do not have an exposed backing plate that may contact the automobile surface and cause damage.
There are three known ways to affix the buffing pad to the spindle of the power buffer. A first way is to affix the buffing pad to a backing plate using a bolt. The backing plate has a round, non-threaded center hole that is sized to slide over the spindle. The buffing pad also has a center hole that is aligned with the center hole of the backing plate when the buffing pad is placed on the backing plate, with the threaded end of the spindle extending though both center holes. A metal nut is used to engage the threaded end of the spindle and affix the buffing pad and backing plate to the spindle. High-speed buffers typically have a lock button for the spindle shaft that prevents the spindle from rotating. Hence, with the spindle shaft locked, it is relatively easy to manually tighten the nut to affix the buffing pad and backing plate to the spindle, as well as to manually loosen the nut to remove the buffing pad and backing plate from the spindle. A drawback of this approach is that it is time consuming and cumbersome to change buffing pads during use. Another drawback is that this approach cannot be used with double-sided buffing pads. Notwithstanding these drawbacks, bolt-on buffing pads are widely used due to their relatively low cost.
A second attachment method is affix the buffing pad to the backing plate uses a hook and loop (e.g., Velcro®) fastener. The backing plate is provided with a threaded metal socket molded into the back surface and hook material attached to the front surface. The threaded metal socket enables the backing plate to be screwed directly onto the threaded end of the spindle shaft. The buffing pad has loop material attached to its back surface, enabling the buffing pad to be affixed to the backing plate by simply pressing the buffing pad and the backing plate together. The hook and loop attachment facilitates ease of attachment to and removal of the buffing pad from the backing plate. As with the bolt-on method, the hook and loop fastening method cannot be used with double-sided buffing pads.
A third type of attachment method used exclusively with double-sided pads includes an adapter having a socket with female threads at one end and male threads at the other end. The female threads enables the adapter to be threaded onto the spindle. The male threads attach to a plastic plate that is sandwiched between two buffing pads bonded back-to-back. The plate includes a central socket having threads that engage the male end of the adapter. The adapter remains attached to the spindle, and the buffing pad is attached to the adapter by screwing the entire buffing pad assembly onto the male end of the adapter. When the buffing pad surface becomes spent, the entire pad assembly is unscrewed and either flipped over or replaced entirely. A drawback of this method is that the high speed rotation of the spindle tends to further tighten the male end of the adapter onto the buffing pad, making it difficult to manually remove the buffing pad from the adapter. Another drawback is that the plastic plate with the double-sided pad is necessarily disposed of when both sides of the pad are spent, thereby increasing the replacement cost of the buffing pad.
To overcome some of these drawbacks, it is known to attach the dual-sided buffing pad assembly to the power buffer using an adapter or connector that provide a quick release mechanism. Such a quick release mechanism is advantageous in that it allows the pad to be easily detached from the power buffer and flipped over to continue buffing with the unused side, without requiring any special tools. This saves time in retrieving another pad and enables the operator to continue working with minimal interruption. The commercially known type of quick release mechanism connects the buffing pad assembly to the power buffer using a cylindrical shaped metal connector. One end of the connector has a threaded bore that engages the spindle of the power buffer. The other end has a hexagonal shaped head that engages a correspondingly shaped socket formed at the center of the central plate. The head further includes a plurality of protruding balls that snap into a recess formed in the socket to thereby provide a firm connection between the power buffer and buffing pad. The connector includes a release mechanism that causes the protruding balls to retract in order to facilitate removal of the buffing pad from the connector head. A button located on the connector head enables manual operation of the release mechanism. The release mechanism further includes an internal spring within the body of the connector that biases the protruding balls outward. The connector further includes an adjusting screw that serves to vary the tension applied by the spring onto the protruding balls.
Notwithstanding the advantages of the known quick release mechanism, there are also many practical drawbacks. Since the connector body is typically formed of a high strength material, such as metal, the hexagonal shaped head is difficult and hence expensive to manufacture, particularly in comparison to a simple, round head. Moreover, it is difficult to align the hexagonal connector head onto the corresponding hexagonal socket. The buffing pad impedes a clear view of the socket and the operator will typically fumble with the device for a while before getting the connector head and socket aligned together.
Due to the inconsistency in manufacturing tolerances of the plastic socket contained within the dual-sided pad, the quality of the fit between the connector body head and the socket will vary from unit-to-unit. In some cases, the head will fit snugly within the socket, while in other cases the head will fit loosely within the socket. After continued use, the plastic socket at the center of the backing plate tends to wear out, providing an even looser fit with the hexagonal shaped head. If the connector head does not maintain a snug fit with the socket, the buffing pad will wobble during operation. This causes an undesirable vibration that effects the rotation of the buffing pad, thereby causing poor application of the compound. The vibration also contributes to operator fatigue, and thereby reduces the productivity of the automotive detailing operation.
Often, operators of the power buffer will buff a portion of the automobile surface using the back side of the dual-sided pad, such as to reach an edge of a wheel well. This exerts force on the buffing pad assembly that could cause it to inadvertently pop off of the connector during use, potentially resulting in injury to the operator and/or damage to the automobile surface. To avoid this condition, the operator may be tempted to increase the tension on the internal spring by tightening the adjusting screw in order to thereby achieve a tighter fit; however, this makes it more difficult to use the quick release mechanism to remove the buffing pad when it is spent.
Another drawback with the known quick release mechanism is that the compound used to buff the surface tends to collect in the socket at the center of the plate. The compound gets into the body of the connector and impedes retraction of the protruding balls. As a result, it becomes difficult to remove the buffing pad assembly from the connector. Even under normal conditions without the presence of compound in the body of the connector, the factory setting of the spring tension applied by the release mechanism can require significant pressure by the operator to overcome and thereby compress the spring.
Yet another drawback of the known quick release mechanism is that the connector body is relatively long in comparison to the traditional adapter due to the inclusion of the release mechanism within the body of the connector. This relatively longer distance between the buffer and the pad can be disorienting for the operator that is already accustomed to a certain shorter distance. This tends to further exacerbate operator fatigue and result in an uneven application to the automotive surface.
For each of the foregoing reasons, a need exists for an improved quick release mechanism that enables attachment between a dual-sided buffing pad and the power buffer without interfering with the overall function of the power buffer and without including any moving parts, while otherwise maintaining the overall convenience and ease of use of the quick release feature.
The present invention provides a quick release mechanism for a dual-sided buffing pad assembly that overcomes the aforementioned drawbacks of the prior art. The quick release mechanism includes a connector that enables a dual-sided buffing pad assembly to be quickly and easily engaged and disengaged from the spindle of a power buffer. The quick release connector further includes a circular connector head that engages a corresponding circular socket in the center of the dual-sided buffing pad, thereby simplifying alignment between the connector and socket. The quick release connector includes no moving internal mechanical parts that can become fouled by contact with buffing compound or that can wear out from normal use.
In a first embodiment of the invention, a buffing system comprises a power buffer having a rotatable spindle, a buffing pad assembly, and a quick release connector adapted to join the buffing pad assembly to the spindle. The buffing pad assembly includes a mounting plate and at least one buffing pad affixed to a side of the mounting plate. The mounting plate and the at least one buffing pad each have a respective aligned central aperture. The mounting plate aperture further comprises a circular ring disposed therein and has a pin extending diametrically across the aperture. The pin comprises a magnetically attractive material.
The quick release connector has a main body adapted to fixedly engage the spindle. The connector further has a head end extending from the main body and having a circular cross-section sized to engage the circular ring. The head end further has a slot sized to engage the pin. The slot further comprises a distal portion extending axially along the head end, a proximal portion extending axially along the head end offset from the distal portion, and a transition portion joining the distal and proximal portions. The main body further comprises a permanent magnet disposed therein having at least one surface adjacent to the proximal portion of the slot. The buffing pad is selectively affixed to the quick release connector by manipulating the head end into the aperture and moving the pin through the slot until reaching the proximal portion, whereupon the pin is retained by the magnetic attraction of the permanent magnet.
More particularly, the buffing pad assembly further comprises a dual-sided buffing pad assembly with a first buffing pad affixed to a first side of the mounting plate and a second buffing pad affixed to a second side of the mounting plate. The buffing pad may be comprised of a wool material or a foam material. The pin is comprised of steel. The spindle further comprises a threaded end, and the connector main body has a corresponding threaded interior surface adapted to threadingly engage the spindle threaded end.
In another embodiment of the invention, a buffing pad assembly comprises a mounting plate having a central aperture and at least one buffing pad affixed to a side of the mounting plate. The at least one buffing pad has a central aperture aligned with the central aperture of the mounting plate. A circular ring is affixed to the central aperture of the mounting plate. The ring has a pin extending diametrically across the aperture, with the pin comprising a magnetically attractive material. The buffing pad assembly is adapted to engage a quick release connector having a circular head end sized to engage the aperture and a slot sized to engage the pin.
In yet another embodiment of the invention, a quick release attachment system for a power buffer comprises a buffing pad assembly having a mounting plate and at least one buffing pad affixed to a side of the mounting plate. The mounting plate and the at least one buffing pad each have a respective aligned central aperture. The mounting plate aperture further comprises a circular ring disposed therein and having a pin extending diametrically across the aperture, with the pin comprising a magnetically attractive material. A quick release connector has a main body adapted to fixedly engage a spindle of the power buffer, and a head end extending from the main body and having a circular cross-section sized to engage the circular ring. The head end further has a slot sized to engage the pin. The slot further comprises a distal portion extending axially along the head end, a proximal portion extending axially along the head end offset from the distal portion, and a transition portion joining the distal and proximal portions. The main body further comprises a permanent magnet disposed therein having at least one surface adjacent to the proximal portion of the slot. The buffing pad is selectively affixed to the quick release connector by manipulating the head end into the aperture and moving the pin through the slot until reaching the proximal portion, whereupon the pin is retained by the magnetic attraction of the permanent magnet.
A more complete understanding of the quick release connector for a dual-sided buffing pad will be afforded to those skilled in the art, as well as a realization of additional advantages and objects thereof, by a consideration of the following detailed description of the preferred embodiment. Reference will be made to the appended sheets of drawings that will first be described briefly.
The present invention provides a quick release assembly that is used to connect a dual-sided buffing pad assembly to the spindle of a power buffer. The present invention satisfies the need for a quick release mechanism that fits securely at the center of the dual-sided buffing pad assembly without interfering with the overall function of the power buffer, while being convenient and easy to attach and remove the buffing pad assembly from the power buffer. In the detailed description that follows, like element numerals are used to describe like elements shown in one or more of the figures.
The dual-sided buffing pad assembly 4 includes a first pad 5 and a second pad 8 that are each separated by a plate 11 (see also
Referring now to
The buffing pad assembly 4 is completed by aligning the central aperture 6 of the first buffing pad 5 with the central aperture 14 of the plate 11 such that the rear surface 7 of the first buffing pad 5 faces the first face 12 of the plate 11. Similarly, the central aperture 9 of the second buffing pad 8 is aligned with the central aperture 14 of the plate 11 such that the second rear surface 10 of the second buffing pad 8 faces the second face 13 of the plate 11. The buffing pads 5 and 8 are then secured to the plate 11 using adhesive 18 that attaches the rear surfaces 7, 10 of pads 5, 8, respectively, to the plate 11. The resulting buffing pad assembly 4 has the first rear surface 7 of buffing pad 5 adhered to the first face 12 of the plate 11 and the second rear surface 10 of buffing pad 8 adhered to the second face 13 of the plate 11. The central apertures 6, 9 of the buffing pads 5, 8, respectively, are aligned with the central aperture 14 of the plate 11, which engages a ring 19 having an attached pin 28, as described below and illustrated in
Referring now to
The ring 19 with the attached pin 28 of the present invention is further attached to the center of the plate 11. In the preferred embodiment of the present invention, the ring 19 with the attached pin 28 is permanently attached to the central aperture 14 of the plate 11 during the manufacturing process to provide a unitary plate structure 32 (see
Referring now to
The head 39 further includes a continuous slot 44 that extends across the head and provides a path for the pin 28 as the head engages the ring 19. The slot has three successive portions, including a first (distal) portion 45, a second (proximal) portion 47, and a transition (intermediate) portion 49 disposed between the first and second portions. In the first portion 45, the slot 44 extends axially along the length of the head 39. In the second portion 47, the slot 44 extends axially along the length of the head 39 although offset circumferentially from the first portion by roughly 90°. In the transition portion 49, the slot 44 defines arcuate openings on opposite sides of the head 39. The transition portion 49 provides a transition path for the pin 28 as it traverses the first and second portions 45, 47 respectively (see
An opening 50 is provided at the base 42 of the head 39 of the connector 33 (see
In other words, the ring 19 is affixed to the head 39 of the connector 33 through a series of movements in which the ring is first moved axially with respect to the head, and is then rotated clockwise with respect to the head, and lastly is again moved axially with respect to the head. As the ring 19 is turned clockwise with the pin 28 in the first portion 45 of the slot 44, the middle portion 31 of the pin 28 passes through the transition portion 49 of the slot 44 until it is aligned with the second portion 47 of the slot 44. Then, the magnetic attraction of the magnet 51 draws the middle portion 31 of the pin toward the first side 52 of the circular magnet 51 that is exposed through the opening 50 at the base 42 of the head 39 of the connector 33.
To remove the ring 19 from the head, the process is simply reversed. The ring 19 with the attached pin 28 can be removed by pulling the same away from the body 34 of the connector 33, in order to overcome the magnetic attraction and disengage the middle portion 31 of the pin 28 from the first side 52 of the magnet 51 and remove it from the second portion 47 of the slot 44. The ring 19 and pin 28 is then manually rotated counterclockwise to align the middle portion 31 of the pin 28 with the first portion 45 of the slot 44, thereby allowing the ring 19 to be removed axially from the head 39 of the connector 33.
In the preferred embodiment of the present invention, the ring 19 and the connector 33 may be made of a non-magnetically attractive material, such as stainless steel. The stainless steel material provides high strength for the connector to endure the mechanical stress applied by the power buffer 1, without demagnetizing the magnet 51 contained in the body 34 of the connector 33. It should be appreciated that other materials for the ring 19, connector 33, and pin 28 could also be advantageously utilized within the skill and knowledge of persons in the art. In another embodiment of the invention, a metallic slug may be disposed below the magnet 51 at a side opposite the first side 52. The slug serves to deform the magnetic field in the region below the magnet 51 to thereby increase the magnetic field above the magnet 51 and increase the attraction between the magnet 51 and the pin 28.
Referring now to
The socket ring 80 further includes a ring 82 and a central disk 84. The central disk 84 extends perpendicularly across the ring 82 and is oriented in a plane corresponding to a central axis of the plate. A t-shaped key 86 extends from either side of the central disk 84. As shown in
The head end 39 with the affixed sleeve 72 is sized to engage the ring 82 of the socket ring 80, with the key 86 engaging the slot 44. In the same manner described above with respect to the foregoing embodiment, the key 86 is arranged to couple to the head end 39 of the connector by traversing three successive portions of the slot 44. Specifically, the key 86 provides the same function as the pin 28 described above. The magnet 51 disposed within the body of the connector will provide magnetic attraction that will tend to retain the key 86 in the second portion of the slot. The buffing-pad is removed from the engagement with the connector by reversing the direction of rotation of the pad to cause the key 86 to traverse the three successive portions of the slot 44 in the opposite direction. Since the socket ring 80 has a corresponding key 86 on either side, the buffing pad can be flipped over and reattached to the connector.
The present invention is superior to the known quick release mechanism in many ways. First, the head 39 of the connector 33 of the present invention is round. It is much easier to manufacture a round metal component using conventional machining techniques, in comparison with the hexagonal metal head of the known quick release mechanism. Furthermore, it is easier for the operator to align the round head 39 of the connector 33 with the plate 11, rather than having to align and insert a hexagonal head to a hexagonal connector. The present invention provides for a far more stable connection between the connector 33 and the buffing pad assembly 4, as the middle portion 31 of the pin 28 that is attached to the buffing pad assembly 4 is held firmly in the second portion 47 of the slot 44 by a magnetic attraction. This magnetic connection, along with the uniquely shaped slot, prevents the buffing pad assembly from inadvertently coming off the connector. Any force applied to the buffing pad assembly 4 away from the connector 33 would be countered by the magnetic force of the magnet 51, thus preventing the buffing pad assembly 4 from popping out.
For example, if the operator is buffing using the rear surface of the buffing pad and applies a force on the pad opposite to the direction of magnetic attraction that overcomes the magnetic attraction, the pin 28 may become disengaged from the magnet. But, the buffing pad assembly 4 won't become disengaged from the connector 33 since the pin 28 will advance only as far as the transition path of the slot, which provides a path that is directly opposite the direction of the spin of the spindle 2 of the power buffer 1. The rotation of the buffing pad assembly 4 keeps the pin 28 in physical contact with the side wall defining the slot. Hence, it is highly unlikely for the buffing pad to come off during operation of the power buffer. This provides a significant safety advantage over the known quick release mechanism that could allow the buffing pad to come off the connector body during use, as substantially discussed above.
Moreover, unlike the known quick release mechanism, the present invention does not contain any moving or resilient parts that could be jammed, worn out, misaligned or otherwise altered through use. Likewise, there is no tension adjusting mechanism that that could become improperly set by an operator. The connector body of the present invention is made of solid non-moving parts that interlock to form a firm connection yet still provide for a quick release, as controlled by the operator. It therefore takes much less force and is hence easier for the operator to install and remove the dual-sided pads from the connector body of the present invention in comparison to the prior art quick release mechanism.
The present invention can be used with high-speed rotary buffers, including dual-head buffers, as well as dual-action or random orbital buffers. As shown in
Having thus described a preferred embodiment of a quick release connector used to connect a dual-sided buffing pad assembly to a power buffer or polisher, it should be apparent to those skilled in the art that certain advantages have been achieved. It should also be appreciated that various modifications, adaptations, and alternative embodiments thereof may be made within the scope and spirit of the present invention. The invention is further defined by the following claims.
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| 20070266514 A1 | Nov 2007 | US |
