This application is a National Stage of International patent application PCT/EP2012/059071, filed on May 15, 2012, which claims priority to foreign French patent application No. FR 1101499, filed on May 17, 2011, the disclosures of which are incorporated by reference in their entirety.
The present invention relates to a single- or dual-polarization radiating element for active array antenna consisting of juxtaposed tiles. It applies notably in the field of active array antennas consisting of elementary tiles.
In the present patent application, an active array antenna architecture is said to be of ‘tile’ type if its active components, notably its amplifiers and its phase shifters, are disposed in planes parallel to the radiating plane, so as to obtain a mechanically orientable antenna of restricted depth or one that can be installed on the surface of a carrier.
The radiating elements of such an array antenna can be grouped into sub-arrays of 2n radiating elements (where n is a positive integer), called ‘elementary tiles’. Indeed, the pitch of the array, that is to say the distance between the center of 2 neighboring radiating elements, generally around λ/2 for an electronic-scanning antenna (where λ designates the wavelength of the radiated wavebeam), is much too small to embed the components required for individual control of the radiating elements. The radiating elements of an elementary tile are disposed row-wise (or column-wise) perpendicularly to the antenna scan plane and are connected to a distributor consisting of Wilkinson dividers of restricted proportions whose input is linked to an active pathway of the antenna. The surface area of 2, 4 or 8 radiating elements is thus available for embedding the active and passive components required to constitute an active pathway. The pitch of the array must however be widened, up to about 0.65λ, so as to obtain a sufficient area to allow the active pathways to be housed in a metal casing and the mechanical play which is indispensable for an array-like assemblage, while being compatible with the intended beam scan field.
Unfortunately, such an array pitch limits the antenna's pointing performance, notably when it is desired to scan the beam in a plane along the orientation of the radiated electric field, this plane being called E subsequently.
A major drawback of the array-like arrangement of radiating elements of relatively significant dimensions, is that blind directions appear, that is to say directions in which it is not possible to scan the beam. A blind direction is related to the fact that, for a given frequency and a particular pointing, the active SWR (Standing Wave Ratio) at the input of each of the radiating elements attains a very high value, the reflection coefficient being close to 1. This phenomenon, which is destructive for the active circuits of the antenna, corresponds to the bringing into phase of the couplings between a large number of radiating elements and an arbitrary radiating element situated in the middle of the array of elements.
The aim of the invention is notably to suppress the blind directions that are customarily observed in active array antennas. Accordingly, the invention proposes notably to improve the radioelectric behavior of the radiating elements forming the tiles, so as to obtain radiating elements exhibiting very good performance once grouped together on a tile, whether this be in terms of operating bandwidth or active reflection coefficient. For this purpose, the subject of the invention is an antenna comprising a plurality of tiles forming an antenna plane, each of said tiles comprising a plurality of radiating elements. Each radiating element comprises a metallic upper patch disposed above a metallic lower patch, the two patches being separated by a layer insulating them electrically. The lower patch is fed with electric current. Each radiating element comprises a conducting frame disposed parallel to the antenna plane and framing the two patches of said element, the two so-called patches being coupled electromagnetically through the aperture of said frame whose body comprises a rear face of small cross section disposed on the side of the lower patch and a front face of larger cross section disposed on the side of the upper patch, so as to widen the angular scan field of a beam in a plane orthogonal to the antenna plane.
Advantageously, each radiating element can comprise parasitic elements forming strips parallel to the edges of the upper patch.
Advantageously, the lower patch of each radiating element being able to be fed with electric current by a core of a coaxial line whose shielding can be linked to a ground plane disposed under said lower patch on the opposite side to the upper patch, said core can comprise a capacitive disk disposed between said lower patch and said ground plane.
In one embodiment, said lower patch can comprise a set of two demetallized slots, said core being able to be connected to said lower patch at a position centered on an axis of symmetry of said lower patch and as close as possible to one of its edges.
In another embodiment, said lower patch can comprise a set of four demetallized slots, said core being able to be connected to said lower patch at a position centered on an axis of symmetry of said lower patch and a core of a second coaxial line being able to be connected to said lower patch at a position centered on the other axis of symmetry of said lower patch.
Advantageously, the tiles are separated by a conducting seal. The antenna can then advantageously comprise a layout of metallized holes produced inside the tiles along the conducting seal.
Advantageously, the frame can be made of a dielectric material which is metallized over the whole of the external surface of the body of the frame, with the exception of a slot disposed on the front face of the frame. For example, the slot can be ring-shaped.
A main advantage of the invention described above is further that, compared with the systems customarily used, such as for example the dielectric layers of WAIM (Wide Angle Impedance Match) type aimed at reducing the angle of incidence of the wave on the array, it has practically no effect on the active SWR on the axis of the radiating elements in the middle of the array and does not increase the thickness of the antenna.
Other characteristics and advantages of the invention will become apparent with the aid of the description which follows offered in relation to appended drawings which represent:
On the front face, a tile comprises one or more rows of radiating elements. At the rear, it comprises one or more distributors of triplate circuit or “microstrip” type, followed by other printed circuit layers on which the controls and the active and passive components are disposed. The circuits are assembled together by various techniques, whether involving pressing, glue bonding or else brazing.
By virtue of an optimized radiating element such as this, it is possible to obtain, with a beam pointed in the axis, an active reflection coefficient in the axis of less than −18 dB in a band of frequencies of 15%. As described hereinafter in the present patent application, this makes it possible to suppress the blind directions that are observed in tiled active array antennas when the beam is off-boresighted in the E plane, that is to say along the orientation of the radiated electric field, genuine holes being able to be observed in the radiation pattern of the element situated in the middle of the array of such antennas.
In the case of an active antenna produced with the radiating elements described previously including a frame like the completely metallic frame 10 and with an array pitch allowing a pointing field of + or −45 degrees without array lobes, the pointing field in the scan plane is limited, on account of the presence of blind directions, to a maximum + or −25 degrees, more particularly in the top half of the operating band. It is possible to solve this problem by modifying the surface currents which circulate over the frame between the radiating elements. Accordingly, the frame 10 can advantageously be made of a dielectric material metallized over the whole of its external surface, with the exception of a ring-shaped slot etched or machined on the front face of the frame in the gap lying between the opening in the frame and the pitch of the array, like the slots 65 and 66. Advantageously, the dielectric constant of the material constituting the frame can be similar to those of the substrates on which the lower and upper patches are etched, such as for example the substrates of which the printed circuits 141 and 15 consist.
A layout of vias (Vertical Interconnect Access), that is to say a layout of metallized holes, can be produced along the conducting seal 68 inside the tiles, such as vias 67 and 69. Advantageously, the vias can be of a diameter equal to the thickness of the conducting seal 68. The role of these vias is to restore the periodicity of the array in the two planes at the level of the frame and although the array consists of assembled tiles.
The substrate which carries the upper patches is assembled with the frame by virtue of an insulating glue bond such as a glue bond 70 so as not to short-circuit the slots, while a conducting glue bond such as a glue bond 71 is used for the other face of the frame.
Cavities coupled to the exterior by the ring-shaped slots are thus produced around each radiating element in the volume of the frame. By optimizing their width and perimeter, it is possible to eliminate the blind directions in the E plane in a pointing field equal to + or −45 degrees in a band greater than 10%.
Number | Date | Country | Kind |
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11 01499 | May 2011 | FR | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP2012/059071 | 5/15/2012 | WO | 00 | 11/15/2013 |
Publishing Document | Publishing Date | Country | Kind |
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WO2012/156424 | 11/22/2012 | WO | A |
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