1. Field of the Invention:
The present invention is related to a radiator unit and particularly to a cooling device associated with a heat generating member for lowering temperature of the heat generating member and supplying electric energy by way of the cooling device moving the heat and transferring energy.
2. Brief Description of the Related Art:
Due to various apparatus frequently producing heat during being in operation, heat-removing device has to be utilized to dissipate the generated heat energy. The most currently used heat-removing device is the cooling fan. But, extremely high temperature heat energy is incapable of being removed by the cooling fan and it often results in shutdown or damage of the product.
Taiwanese Patent Official Gazette No. 260325 discloses an improved cooling and temperature control device, which provides a fan at the top of the cooling fins and a cooling device under the cooling fins. The cooling fins have a plurality of jut pieces at the surfaces thereof and the jut pieces are arranged in order on the surfaces with an end of the respective jut piece extending outward the respective cooling fin and the contact surface of the fan. In addition, a slot is provided at the cooling fins for being inserted with a control circuit board. Further, a temperature sensor 12 is disposed at an edge of a lower conductive plate 42 of the cooling device 40 such that the temperature sensor 12 contacts with a temperature controlled object to feed back a correct sensed temperature so as to reach a purpose of temperature control.
However, the structure formed with the control circuit board, the temperature sensor and the cooling device has a cooing surface adhered with a CPU and a heat dissipation surface joined to a fan for removing heat from the heat generating object. When the power is off, the residue electric charges still act to the cooling device continuously to result in the cooling surface on the cooling device keeping absorbing heat so as to occur condensation phenomenon and lead to short circuit. Besides, the preceding improved cooling and temperature control device has to be supplied power for normal working so that the prior art obviously is unable to regenerate and reuse the energy under the condition of limited energy and material with high cost.
A primary object of the present invention is to provide a radiator unit in which a cooling device associated with a heat generating member for lowering temperature of the heat generating member and supplying electric energy by way of the cooling device moving the heat and transferring energy for being used by other heat dissipation device and saving resources.
Another object of the present invention is to provide a radiator unit with which the cooling surface thereof contacts heat generating member to prevent from short circuit due to condensation phenomenon resulting from the cold surface of the cooling device absorbing heat continuously.
The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which:
Referring to
The heat dissipated object 20 contacts or adheres the cooling device 10 and, in a feasible implement, the second substrate 15 of the cooling device 10 is adhered to the heat dissipated object 20 to allow electrons of the N-type semiconductors 12 acquiring energy and moving to conductive band from the valence band as free electrons. The electrons are transmitted with the conductor 13 to produce current, which is reverse to moving direction of the electrons, and absorb heat at the same time. When the electrons moves to the P-type semiconductors 11, heat is released, that is, the heat is transmitted from one side to another side of the cooling device to occur Peltier effect as long as electrons pass through the N-type semiconductors 12 and the P-type semiconductors 11. In this way, the cooling device 10 forms temperature between a cold surface (the first substrate 14) and a hot surface (the second substrate 15) thereof.
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While the invention has been described with referencing to preferred embodiments thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.