Patent Application
20230400259
This application claims the benefit of priority from Chinese Patent Application No. 202321571516.2, filed on Jun. 19, 2023. The content of the aforementioned application, including any intervening amendments made thereto, is incorporated herein by reference in its entirety.
This application relates to heat dissipation, in particular to a radiator.
Enhanced performance, high integration and high density of computers and other electronic devices result in increasing-growing power consumption. The continuous operation of electronic devices will produce a lot of heat, and if the heat cannot be dissipated in time, it will lead to overheating of devices and affect their performance, or even damage the electronic devices. Therefore, considerable attention has been paid to the heat dissipation in the design of electronic devices.
In the prior art, the fin size of the air-cooling radiator is limited by the computer case and motherboard, and thus cannot be increased. In this case, the power consumption is limited. Besides, the current air-cooling radiators have no air channels at the fins, and therefore the air flow generated by fan will flow through the fins in a short period of time, resulting in less heat dissipation and poor cooling efficiency. In view of this, it is urgently needed to further enhance the cooling efficiency of air-cooling radiators.
An object of this application is to provide a radiator to overcome the shortcomings of the prior art.
Technical solutions of the present disclosure are described as follows.
This application provides a radiator, comprising:
The fan can accelerate the air flow to lower the temperature of the heat-dissipation fin faster, so as to promote the heat dissipation of the heat pipe. An inside of the heat pipe is sealed. The heat-dissipation fin is an aluminum plate or a copper plate. The perpendicular insertion has a stable fitting effect, and the heat-conduction effect is good. The arrangement of the heat-dissipation hole introduces air channels to the heat-dissipation fin and optimizes the boundary layer. The open-type flow guide assembly protruding from the heat-dissipation fin provides a transverse opening to form an air channel to control the air flow. During operation, a laminar flow structure can be generated when the air flow generated by the fan flows through the heat-dissipation fin, which extends the time for the air flow to pass through the heat-dissipation fin, so as to take more heat away and improve the cooling efficiency of the radiator.
In one embodiment, the number of the second hole is 24, and the 24 second holes are divided into four groups with 6 holes in each group; the 6 holes in each group are distributed in a 2 (row)×3 (column) array. The four groups of second holes are symmetrically distributed in an array at four corners of the heat-dissipation fin along the X-axis direction and Y-axis direction.
In one embodiment, the number of the second hole is 24, and the 24 second holes are divided into four groups with 6 holes in each group; the 6 holes in each group are distributed in a 2 (row)×3 (column) array. The second holes are symmetrically distributed at the four corners of the heat-dissipation fin in a staggered manner, and the four groups of second holes are symmetrically distributed along the X-axis direction and Y-axis direction. The staggered arrangement can prevent air flows of the second holes from interfering with each other, making the wind flow smoother.
In one embodiment, an angle between the third sheet and a top surface of the heat-dissipation fin is 20-30 degrees. The angle of 20-30 degrees can not only facilitate the formation of the air channel, but also avoid the flow guide assembly from excessively protruding from the heat-dissipation fin.
In one embodiment, an opening of the flow guide assembly faces towards outside of the heat-dissipation fin, which facilitates the heat removal.
In one embodiment, at least two heat-dissipation fins are stacked on the heat pipe; and a spacing between adjacent heat-dissipation fins is larger than a height of the highest point of the flow guide assembly, which will not affect the height of the radiator and facilitate the adaption to the existing devices.
In one embodiment, a fixing base is arranged at a bottom of the heat pipe, and additional accessories, such as fan, can be fixed on the fixing base. The fixing base is made of aluminum because of its low cost and good plasticity. The fixing base has a T-shaped structure. Each side of the fixing base is provided with a screw hole for fixing other accessories.
In one embodiment, a bottom surface of the fixing base is provided with at least one first groove, and which is in close and parallel arrangement. The number of the at least one first groove is more than or equal to the number of the heat pipe, so that every heat pipe has a fitting position and can be held, and the number of heat pipes can be adjusted according to demand. The top surface of the fixing base is provided with at least one second groove, which is in a close and parallel arrangement. The second grooves can further promote the fixing in cooperation with additional accessories.
In one embodiment, a heat conduction base is provided at the bottom of the heat pipe. The heat conduction base is in direct contact with the heat source, which can transfer heat to the heat pipes quickly. The heat conduction base is provided with at least one groove, which is in close and parallel arrangement on the upper surface of the heat conduction base. The number of the groove is more than or equal to the number of the heat pipe, so that every heat pipe has a fitting position can be held, and the number of heat pipes can be adjusted according to demand.
In one embodiment, the heat conduction base is made of copper, which has high heat conductivity coefficient and excellent heat conduction performance.
The benefits of this application are described as follows.
This application improves the heat dissipation efficiency of the fin of the air-cooling radiator with the fin size remaining unchanged. It also introduces the design of air channels and optimizes the boundary layer by arranging the heat-dissipation holes. When the radiator is working, the time for the air flow generated by the fan to pass through the heat-dissipation fin is increased so as to take more heat away and improve the cooling efficiency. Therefore, the radiator provided herein can effectively dissipate the heat generated by the electronic devices and facilitate keeping the output power and performance of electronic devices stable, exhibiting a brilliant application prospect.
In order to illustrate the technical solutions of this application more clearly, the accompanying drawings required in the description of embodiments will be briefly introduced below. It should be understood that the following accompanying drawings only show some embodiments of this application, and therefore should not be considered as a limitation. For those of ordinary skill in the art, other relevant accompanying drawings can also be obtained according to these drawings without making creative effort.
In the drawings: 1, heat-dissipation fin; 2, heat pipe; 3, heat conduction base; 4, fixing base; 11, heat-dissipation hole; 12, third sheet; 13, top surface of heat-dissipation fin; 31, first groove; 41, screw hole; 42, second groove; and 43, third groove.
The present disclosure will be further described below with reference to accompanying drawings and embodiments to facilitate understanding of the disclosure. Presented in the drawings are merely some embodiments of the disclosure. The embodiments provided herein are intended to facilitate the understanding of the technical contents of the disclosure, rather than limiting the disclosure.
It should be noted that, when a component is said to be “fixed” (“connected”) to another component, it can be directly fixed (connected) to another component or directly fixed (connected) to another component with an intermediate component. The terms, such as “perpendicular”, “horizontal”, “left”, “right” and other similar expressions used herein are only illustrative, and are not intended to limit the implementation.
Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art. These terms used herein are only descriptive, and are not intended to limit the application. The term “and/or” used herein includes any and all combinations of one or more relevant listed items.
Referring to an embodiment of this application shown in
The fan can accelerate the air flow so as to reduce the temperature of the heat-dissipation fin 1 faster and dissipate heat generated by the heat pipe 2 faster. The heat-dissipation fin 1 arranged on the heat pipe 2 is a copper plate or an aluminum plate. The perpendicular insertion of the heat pipe 2 in the heat-dissipation fin 1 realizes firm and fitting connection and has good heat conduction effect. The heat-dissipation hole 11 arranged on the heat-dissipation fin 1 can increase the number of air channels and optimize the boundary layer. During operation, a laminar flow structure will be created when the air flow generated by the fan passes through the heat-dissipation fin 1. The flow guide assembly can offer a transverse opening. A part of the air flow generated by the fan will flow back through the heat-dissipation hole 11 and the flow guide assembly to create a swirl flow, thereby prolonging the time for the air flow to pass through the heat-dissipation fin 1 and taking away more heat. The heat dissipation efficiency of the radiator is improved with the size of the heat-dissipation fin 1 remaining unchanged.
In an embodiment, the heat-dissipation fin 1 has 24 heat-dissipation holes 11, which are symmetrically distributed in an array at four corners of the heat-dissipation fin 1.
The 24 heat dissipation holes 11 are divided into four groups with 6 holes in each group, and the 6 heat-dissipation holes in each group are distributed in a 2 (row)×3 (column) array. The four groups of heat dissipation holes 11 are symmetrically distributed at four corners of the heat-dissipation fin 1 along the X-axis direction and Y-axis direction.
In an embodiment, the heat-dissipation fin 1 has 24 heat-dissipation holes 11, which are symmetrically distributed at four corners of the heat-dissipation fin 1 in a staggered manner.
The 24 heat-dissipation holes 11 are divided into four groups with 6 holes in each group, and the 6 holes in each group are distributed in a 2 (row)×3 (column) array. The four groups of heat-dissipation holes 11 are symmetrically distributed at four corners of the heat-dissipation fin 1 in a staggered manner along the X-axis direction and Y-axis direction. The staggered arrangement can prevent air flows of the heat-dissipation holes from interfering with each other, making the wind flow smoother.
In an embodiment, an angle between the third sheet 12 and the top surface 13 of the heat-dissipation fin 13 is 20-30 degrees.
The angle of 20-30 degrees can not only facilitate the formation of air channels to control the air flow, but also avoid the flow guide assembly from excessively protruding from the heat-dissipation fin 1, such that it is compatible with the existing heat-dissipation fins.
In an embodiment, an opening of the flow guide assembly faces towards outside of the heat-dissipation fin 1.
By adopting the technical solution above, the flow guide assembly can swirl the air flow passing therethrough, extending the time for the air flow to pass through the heat-dissipation fin 1 and taking away more heat.
In an embodiment, at least two heat-dissipation fins 1 are stacked on the heat pipe 2. A spacing between adjacent two heat-dissipation fins 1 is larger than a height of the highest point of the flow guide assembly.
By adopting the technical solution above, the heat-dissipation fins 1 can be stacked according to the existing specification, and the spacing between adjacent two heat-dissipation fins 1 is larger than a height of the highest point of the flow guide assembly, which can not affect the height of the existing radiators and adapt to the existing devices better.
In an embodiment, a fixing base 4 is arranged on the bottom of the heat pipe 2, and is made of aluminum. The fixing base 4 has a T-shaped structure. Each side of the fixing base 4 is provided with a screw hole 41.
By adopting the technical scheme above, additional accessories, such as fan and light strip, can be fixed on the fixing base 4. The fixing base 4 is made of aluminum for its lower cost and good plasticity. The fixing base 4 has a T-shaped structure and easy to mount. The screw hole 41 can facilitate the fixing.
In an embodiment, the bottom surface of the fixing base 4 is provided with at least one first groove 42. The number of the first groove 42 is more than or equal to the number of the heat pipe 2. The top surface of the fixing base 4 is provided with at least one second groove 43.
By adopting the technical solution above, multiple first grooves 42 are arranged closely in parallel on the bottom surface of the fixing base 4. The number of the first grooves 42 is more than or equal to the number of the heat pipes 2 such that every heat pipe 2 can be held, and the number of the heat pipes 2 can be adjusted according the demand. The multiple second grooves 43 are arranged closely in parallel on the top surface of the fixing base 4. The second grooves 43 can be used with additional accessories to achieve the fixing functions.
In an embodiment, a heat conduction base 3 is arranged at the bottom of the heat pipes 2. The heat conduction base 3 is provided with at least one third groove 31. The number of the third grooves 31 is more than or equal to the number of the heat pipes 2.
By adopting the technical scheme above, the heat conduction base 3 under the bottom of the heat pipes 2 is in direct contact with the heat source, and can quickly transfer heat to the heat pipes 2. The top surface of the heat conduction base has multiple third grooves 31, which are arranged closely in parallel. The number of the third grooves 31 is more than or equal to the number of the heat pipes 2 so that every heat pipe 2 has a fitting and holding position, and the number of the heat pipes 2 can be adjusted according to demand.
In an embodiment, the heat conduction base 3 is made of copper.
By adopting the technical scheme above, the heat conduction base 3 takes advantage of the high heat conductivity coefficient of copper to achieve the great heat conduction effect.
The working principle is described as follows. The arrangement of heat-dissipation holes 11 on the heat-dissipation fin 1 can introduce air channels for the heat-dissipation fin 1 and optimize the boundary layer. During operation, the air flow is blown by the fan towards the heat-dissipation fin 1, and a part of the air flow flows out through the heat-dissipation hole 11 and the flow guide assembly to form a return flow, which prolongs the time for the flow to pass through the heat-dissipation fin 1 so as to take away more heat, thereby improving the cooling efficiency and heat dissipation efficiency of the radiator with the size of the fin remaining unchanged.
In the practical application, the heat conduction base 3 is installed on the heat-generating spot, and the fan or light strip can be additionally fixed on the fixing base 4.
Described above are only several embodiments of the disclosure, and are not intended to limit the disclosure. It should be pointed out that various variations and improvements made by those of ordinary skill in the art without departing from the spirit of the disclosure shall also fall within the scope of the disclosure defined by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202321571516.2 | Jun 2023 | CN | national |
