Patent Application
20240141644
The present invention is directed to a dropped ceiling tile system capable of mitigating or eliminating radio frequency (RF) and acoustic transmissions therethrough.
Dropped ceiling tile systems are a common choice for the ceilings of offices, laboratories, retail establishments, and many other types of commercial buildings. Dropped tile ceilings are affordable and easily configurable. Further, the space above the ceiling system may house duct work, electrical wiring, fire-suppression systems, etc. If any of the equipment located above the ceiling must be repaired or modified, the tiles of the ceiling may easily be removed during repairs or modifications and then replaced when the work is done. Lastly, due to the modular nature of a dropped ceiling tile system, if part of the ceiling is damaged, then the damaged tiles can be removed and replaced without replacing the entire ceiling.
Where electronic and audible privacy is a concern such as in military, defense, government, embassy, and technical installations, it is preferable that a dropped ceiling tile system may be utilized while maintaining a high level of electronic and audible privacy.
It would therefore be desirable to provide a traditional dropped ceiling tile system with radio frequency mitigation capabilities.
It would also be desirable to provide a dropped ceiling tile system capable of mitigating the transmission of both radio frequency and acoustic waves through the ceiling.
It would also be desirable to provide such a dropped ceiling tile system without compromising the impermanent, modular, and replaceable qualities of traditional dropped ceiling tile systems.
It would also be desirable to provide a dropped ceiling tile system which can be installed by retrofitting a traditional ceiling tile system.
The present invention is directed to a ceiling tile system adapted to mitigate radio-frequency and acoustic waves from passing therethrough comprising: a set of conductive grid bars; and a set of ceiling tiles each having a layer of conductive material and a layer of acoustic insulation.
The conductive grid bars and the layer of conductive material of each ceiling tile may be conductively connected. Further, a conductive connecting mechanism may facilitate a reliable conductive connection between the conductive grid bars and the layer of conductive material of each ceiling tile. The conductive connecting mechanism may comprise a strip of foam wrapped in a conductive fabric or conductive foil. Alternatively, the conductive connecting mechanism may comprise a conductive contact strip such as fingerstock.
The ceiling tile system may further comprise conductive wall angles such that the ceiling tile system may be conductively connected to a conductive layer of an adjacent wall.
The ceiling tile system may further comprise a set of hold-down clips mounted on the top bulb of the conductive grid bars to firmly hold each of the ceiling tiles against the conductive grid bars.
The layer of conductive material in each ceiling tile may be exposed only along an outer edge of a bottom face of the ceiling tile.
The ceiling tile system may further comprise a set of hanger wires to support said ceiling tile system.
The ceiling tile system may further comprise a layer of mineral wool either positioned above each ceiling tile or incorporated therein.
The embodiments discussed herein are merely illustrative of specific manners in which to make and use the invention and are not to be interpreted as limiting the scope.
While the invention has been described with a certain degree of particularity, it is to be noted that many modifications may be made in the details of the invention's construction and the arrangement of its components without departing from the scope of this disclosure. It is understood that the invention is not limited to the embodiments set forth herein for purposes of exemplification.
Referring to the drawings in detail,
The dropped ceiling tile system 1 capable of mitigating the transmission of radio frequency and acoustic waves therethrough may include conductive grid bars 6, conductive wall angle bars 14, conductive ceiling tile panels 5, and a conductive connecting mechanism 7 located between the grid bars and the ceiling panels.
The conductive grid bars 6 may be composed of typical commercially available drop ceiling grid bars. The grid bars may be all uniform. Alternatively, the grid bars may consist of main beams 11 running in parallel along the length of a room and a series of cross tees 12 creating a grid between the main beams for placing tiles 5. The grid bars may be constructed with a conductive material which is at least exposed on the upward facing surface upon which the ceiling panels rest.
The conductive connecting mechanism 7 may be composed of a thin strip of foam wrapped in a conductive fabric or a conductive contact strip such as fingerstock. The fingerstock may be plated in tin or any other suitable material. The gasket may be attached to and span the entirety of the upward facing surface of the grid bars upon which the ceiling panels typically rest. The purpose of the gasket is to ensure a reliable conductive contact at all points between the grid bars 6 and the ceiling panels 5. Further, hold-down clips 9 may be employed on the grid bars 6 to hold down the bottom surface of the ceiling panels 5 in contact with the conductive connecting mechanism 7.
The wall angle bars 14 may be composed of the typical commercially available drop ceiling wall edge bars. The wall angle bars 14 are commonly constructed using a conductive material. The upward facing surface of the lip upon which the ceiling panels rest may be an exposed conductive surface which will ensure a reliable conductive connection between the wall angle and the conductive gasket. If the surface of the wall angle bar that comes into contact with the wall is coated in a non-conductive material, the non-conductive coating is removed to ensure a reliable conductive connection between the wall angle bar and the surface of the wall. Even further, conductive tape can be installed over the top seam of the wall angle and the surface of the wall to ensure no non-conductive gap exists at any point along the seam.
At least the exposed, or downward facing, surface of the ceiling panels 5 may be composed entirely of a conductive material. The surface may, however, be coated with a non-conductive material so long as the outer edges of the surface which rest atop the conductive gasket are conductive. Exposing the conductive material at the outer edges of surface ensures a reliable conductive connection between the outer edges of the lower face of the ceiling tile and the conductive connecting mechanism.
When installed, the ceiling tile system 1 may constitute a unified conductive surface which shields the entire ceiling from radio frequency wave penetration. Further, the system may allow for conductive contact with the surface of the walls along the entire perimeter of the ceiling system. When installed with RF shielded walls, ceilings, and doors, a room with complete RF shielding from outside waves can be attained.
Alternatively, the ceiling tiles may not have an uninterrupted conductive material therethrough or thereon such that the ceiling acts as a waveguide and merely mitigates that transmission of radio frequency waves instead of eliminating their transmission altogether.
Previous attempts at creating an RF shielding drop ceiling system include use of conductive spray-paint, use of a conductive caulk, and cardboard covered in foil used as ceiling tiles. The first attempt merely consists of coating the entire upper surface of a drop ceiling with conductive spray-paint. This first alternative system does not provide a consistent enough layer of conductive material to ensure radio frequency shielding. The second attempt consisted of placing conductive caulk between the ceiling tiles and the ceiling tile grid bars to ensure a seamless conductive connection. Neither alternative system allows for subsequent physical access through the ceiling tile system because the ceiling tiles are permanently affixed to the ceiling tile grid bars. Further, silicone based conductive caulking is commonly banned from use in electronic testing laboratories where these drop ceiling systems would typically be installed.
One benefit of the presently disclosed invention over the prior art is a more reliable conductive connection at every junction and seam in the system. Another benefit of the presently disclosed invention is the ability to access above the drop ceiling for repairing wiring or any other purpose by easily removing and replacing ceiling tiles. Finally, another benefit to the presently disclosed system is the ability to retrofit previously installed ceiling tile systems to be RF shielded.
Lastly, the tiles may be acoustically insulated to prevent acoustic waves from transmitting through the ceiling or to mitigate acoustic waves from transmitting through the ceiling. The acoustic insulation 4 may be on either the top or bottom layers of the ceiling tile 5 or may be embedded therein.
The embodiment of the present invention shown in
The embodiment of the present invention shown in
The embodiment of the present invention shown in
The dual faced RF panels 8 may alternately each be a single faced panel or a single sheet of conductive material.
Whereas, the invention has been described in relation to the drawings attached hereto, it should be understood that other and further modifications, apart from those shown or suggested herein, may be made within the scope of this invention.
This application is based on and claims priority to U.S. Provisional Patent Application Ser. No. 63/301,605, filed Jan. 21, 2022, which is incorporated herein in its entirety by reference.
| Number | Date | Country | |
|---|---|---|---|
| 63301605 | Jan 2022 | US |
