The disclosure described herein generally relates to substrate-integrated waveguide (SIW) cavity antennas and, in particular, to broadband SIW cavity antennas that implement radio frequency interference (RFI) shielding and facilitate dual frequency band operation.
Electronic devices commonly implement one or more antennas to facilitate wireless communications. However, the platform noise (such as RFI) present in such electronic devices causes significant impact on the wireless communications by decreasing the carrier-to-noise ratio (and also signal-to-noise ratio). Such RFI may be a particular concern for electronic devices that utilize emerging high-speed double data rate (DDR) memory technology. The existence of such platform noise delays time-to-market (TTM) and increases manufacturing costs. Thus, current antenna implementations in electronic devices are prone to performance degradation caused by platform RFI, and function inadequately as a result.
The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the present disclosure and, together with the description, further serve to explain the principles and to enable a person skilled in the pertinent art to make and use the techniques discussed herein.
In the drawings, like reference characters generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the disclosure. In the following description, reference is made to the following drawings, in which:
The present disclosure will be described with reference to the accompanying drawings. The drawing in which an element first appears is typically indicated by the leftmost digit(s) in the corresponding reference number.
The following detailed description refers to the accompanying drawings that show, by way of illustration, exemplary details in which the disclosure may be practiced. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be apparent to those skilled in the art that the various designs, including structures, systems, and methods, may be practiced without these specific details. The description and representation herein are the common means used by those experienced or skilled in the art to most effectively convey the substance of their work to others skilled in the art. In other instances, well-known methods, procedures, components, and circuitry have not been described in detail to avoid unnecessarily obscuring the disclosure.
Again, and as noted above, the platform noise in electronic devices causes significant impact on the wireless communications. Current solutions to mitigate platform noise include passive, reactive, and standard approaches. These approaches include placing antennas far from the noise sources, such as placing antennas in a laptop lid, which are then interconnected with long RF cables. However, such solutions introduce additional complexity and cost. Other existing solutions include shielding the noise sources with shielding “cans,” although this is also an expensive solution that requires extra space and adds weight. Moreover, the excessive use of such shielding can introduce thermal issues and, particularly when a high-performance graphics processing unit (GPU) is in use, may introduce significant design challenges. Finally, typical mitigation solutions require printed circuit board (PCB) re-spins, which are implemented using extensive RFI debugging processes of the particular electronic device platform to mitigate noise prior to product launch due to FCC certification failures, malfunctions, etc., thus adding cost and time to production.
In addition to platform noise issues, conventional antenna performance is also impacted by placement locations as well as the materials proximate to the antennas within the electronic device. Antenna performance degradation is especially critical for broadband applications such as the Institute of Electrical and Electronics Engineers (IEEE) 802.11 Wi-Fi applications, which require customized tuning and modifications and thus increases antenna SKUs dramatically and causes additional TTM delay and costs. That is, the antennas used in electronic device platforms are designed to function in accordance with particular frequency bands to facilitate wireless communications, and typical solutions to attempt to ensure robust broadband antenna performance include the use of platform- and form factor-customized antenna designs, which increases SKUs, time-to-market (TTM), and cost. Moreover, current antenna solutions require an extensive debugging and tuning process. For instance, variations of locations and materials need to be considered for every different platform in which the antennas will be implemented. Thus, the current solutions to mitigate platform noise, to implement antenna designs to operate in the presence of such electronic device platform noise, and the customization of antennas on a per-platform basis are expensive, as current solutions often require the use of RF shielded cables, on-board shielding, and PCB re-spins.
Therefore, the designs described herein address these issues by providing an RFI-shielded substrate integrated waveguide (SIW) cavity antenna design. The proposed solution results in substantial benefits such as cost savings, high speed wireless performance, the removal of on-board shields, and the opportunity for form factor miniaturization. The designs described herein provide a scalable plug-n-play type solution that provide robust antenna performance that addresses the aforementioned issues with conventional antennas impacted by RFI, adjacent objects within an electronic device platform, and other parameters that may change between different platforms.
The antenna designs as discussed herein are illustrated as operating in accordance with specific bands that correspond to the 2.4 GHz and 5-7 GHz frequency bands, which may be implemented as part of the IEEE 802.11ax (Wi-Fi 6 and Wi-Fi 6E) standard published Feb. 21, 2021 and/or the IEEE 802.11be Wi-Fi (Wi-Fi 7), which is not yet released or otherwise published as of this writing. Thus, the designs described herein may be particularly useful for the implementation of antennas that provide broadband performance within the 2.4 GHz and 5-7 GHz frequency bands used for WiFi 6/6E/7 applications while offering built-in RFI mitigation solutions. However, the antenna designs as discussed herein are not limited to Wi-Fi frequencies or implementation in accordance with Wi-Fi communication standards, and may be implemented in accordance with any suitable number and/or type of frequencies, frequency bands, and/or communication protocols.
Thus, the SIW cavity antenna as further described herein offers a cost-effective and immediate solution to address the RFI challenges between wireless communications and RFI sources (such as high-speed DDR memory technology implementation) in electronic devices such as computing devices, laptops, desktops, etc., without causing additional thermal issues. Moreover, the described SIW cavity antenna design 200 provides a plug-and-play solution that is largely platform-agnostic, which provides a significant savings in both development cost and time to market by reducing engineering efforts and avoiding multiple design iterations based on adjacent structural modifications during the development cycle.
The SIW cavity antenna described herein is thus an excellent candidate for Wi-Fi antennas used in desktop PCs and workstations. In such implementations, Wi-Fi applications such as cloud gaming are increasingly important, but performance may be significantly impacted by DDR platform noises and many add-in cards (AICs). In such PC form factors, on-board EMI shields are not popular because of the use of 4-layer PCBs, but there remains ample space to accommodate the RFI shielded SIW cavity antenna design as further described below.
Each of the
Furthermore, unless otherwise noted, the various components of the SIW cavity antenna design 200 may be implemented as any suitable type of electrically-conductive materials such as copper, brass, gold-plated metals, electrically-conductive alloys, etc., and the entirety of the SIW cavity antenna design 200 may be manufactured using any suitable type of manufacturing process such as etching, lithography, known PCB manufacturing techniques, etc. Thus, although not shown in the Figures for clarity and ease of explanation, the SIW cavity antenna design 200 may include a substrate of any suitable dielectric value between each of the layers. The electrically-conductive materials as shown in the Figures may be bonded to, etched from, deposited on, etc., the substrate materials. The substrate may be implemented as any suitable type of material such as an FR4 substrate commonly used for PCB fabrication, Benzocyclobutane, Bakelite, etc. Therefore, in one scenario the different layers of the SIW cavity antenna design 200 may be implemented as different layers of a multi-layered PCB.
With reference to
Thus, the structure of the SIW cavity antenna design 200 as shown in the Figures includes four closed sides and two open sides, which are used as the radiating apertures. The lower plate 210.1 is identified with a first closed side, the upper plate 210.6 is identified with a second closed side, the side plates 210.2, 210.3 are identified with a third closed side, and the side plates 210.4, 210.5 are identified with a fourth closed side. As shown in the Figures, the third closed side and the fourth closed side (i.e. the monopole sides as shown in
The antenna feed 202 may be electrically coupled to any suitable antenna feed structure (not shown) identified with the platform (i.e. the electronic device) in which the SIW cavity antenna 200 is implemented, such as an inner conductor of a coaxial cable, a microstrip line, etc. Thus, the antenna feed 202 functions to electrically couple the SIW cavity antenna design 200 to any suitable type of transmitter, receiver, transceiver, etc. This enables the SIW cavity antenna design 200 may facilitate the electronic device in which it is implemented to transmit and/or receive signals via radiated and/or received electromagnetic energy, respectively, via the open sides of the SIW cavity antenna design 200.
Regardless of the particular implementation, the antenna feed 202 is electrically coupled to an electrically-conductive disk 204, which is disposed on a second layer of the SIW cavity antenna design 200, referred to herein as a feed layer. The Figures illustrate the feed 202 being coupled to the center of the disk 204. However, this is a non-limiting scenario, and the feed 202 may be coupled to the disk 204 at any suitable location, which may be varied as a tuning parameter based upon other adjustments to the components of the SIW cavity antenna design 200 and/or depending upon the particular frequencies and/or frequency bands of operation.
Thus, unlike the conventional SIW cavity antenna as noted above, the antenna feed 202 of the SIW cavity antenna design 200 is not directly connected to the upper plate 210.6, and is instead coupled to the disk 204, which is capacitively coupled to the upper plate 210.6 as depicted in
To further reduce the Q of the cavity, distributed, inductive transmission lines are implemented. More specifically, to support a dual frequency band operation (such as the 2.4 GHz band and 5-7 GHz band, as discussed in further detail herein), two distributed, inductive transmission lines with different lengths are implemented within the cavity volume. That is, although the reduced Q achieved via the use of the capacitively-coupled disk 204 increases the impedance bandwidth of the SIW cavity antenna design 200, it is desirable to further increase the bandwidth for some applications, such as to cover the entire 5-7 GHz band as discussed herein. Thus, the geometric symmetry inside the cavity is “broken” by implementing distributed inductive transmission lines, thereby enabling “continuous” multiple resonances (or multiple cavity mode excitations) to cover a larger impedance bandwidth than would otherwise be possible.
The first of these distributed inductive transmission lines includes an impedance tuning stub 208, which is coupled to the disk 204 as shown in
The second of the distributed inductive transmission lines includes meander line monopole radiator 206, which is coupled to the disk 204 and is configured to enable the SIW cavity antenna design 200 to further transmit or receive electromagnetic energy in accordance with an additional frequency band. The meander line monopole radiator 206 includes a segment 206.1 that is disposed within the feed layer, a segment 206.2 that is oriented vertically (i.e. monopoley) between the feed layer and the capacitive layer, and a segment 206.3 that is disposed within the capacitive layer. The length, width, shape, routing, etc. of the meander line monopole radiator 206 and/or the segments 206.1, 206.2, 206.3 may deviate from those shown in the Figures depending upon the particular frequencies and/or frequency bands of operation. In the scenarios as discussed herein, the meander line monopole radiator 206 functions to enable the SIW cavity antenna design 200 to operate within the 2.4 GHz band (which may cover frequencies from 2.40-2.49 GHz in accordance with the Wi-Fi 6E standard) in addition to the 5-7 GHz band of operation for which the SIW cavity antenna 200 is otherwise designed to operate. That is, the SIW cavity antenna design 200 optionally includes the meander line monopole radiator 206 to support an additional frequency band of operation.
Regardless of the presence of the meander line monopole radiator 206, the SIW cavity antenna design 200 may support broadband operation in accordance with a primary frequency band, with the design further supporting dual band and broadband operation when the meander line monopole radiator 206 is present. In this way, when the meander line monopole radiator 206 is present, the SIW cavity antenna design 200 implements the disk 204 as a shared feed to excite two different radiating portions of the SIW cavity antenna design 200, one being the SIW cavity itself that enables operation (i.e. the transmission and reception of electromagnetic signals) over a first frequency band, and the other radiating portion being the meander line monopole radiator 206, which enables operation over a second frequency band.
Thus, and as shown in
The feed layer also includes an electrically-conductive tuning plate 212, which is shown in greater detail in
Although shown in the Figures as having 8 segments 212.1-212.8 arranged about a circle, the tuning plate 212 may include any suitable number N of segments 212.1-212.N, which may be arranged in any suitable pattern, have any suitable shape, and be of any suitable size based upon other adjustments to the components of the SIW cavity antenna design 200 and/or depending upon the particular frequencies and/or frequency bands of operation. In one alternative scenario, the tuning plate 212 may include segments 212.1-212.N arranged about other shapes, which may or may not match the shape and/or contour of the disk 204. The tuning plate 212 functions to provide impedance matching for the SIW cavity antenna design 200 by way of the segments 212.1-212.8, which act as perturbations to create additional impedance bandwidth. The additional impedance bandwidth is achieved as a result of the interaction between the segments 212.1-212.8 with the disk 204, which causes additional excitation modes in the SIW cavity. That is, the excitation of the disk 204 via the antenna feed 202 introduces a mode of excitation into the SIW cavity, and the additional reflections caused by these interaction between the segments 212.1-212.8 and the disk 204 within the SIW cavity results in the introduction of additional excitation modes, thus expanding the bandwidth of operation.
Again, to cover a larger impedance bandwidth, the geometric symmetry inside the SIW cavity is broken by implementing distributed inductive transmission lines. The geometric symmetry may be further broken to increase the impedance bandwidth by offsetting the centers of the electrically-conductive disk 204 and the tuning plate 212 from one another. Thus, and regardless of the implementation of the tuning plate 212, the disk 204 may have a center that is offset from the center of both the lower plate 210.1 and the tuning plate 212. That is, the lower plate 210.1 and the tuning plate 212 are assumed to be parallel with one another in this scenario and share a common center. This offset is shown in further detail in
This offset arrangement between the center of the disk 204 and the center of the tuning plate 212 and the lower plate 210.1 is a non-limiting scenario, and the centers of the disk 204 and the tuning plate 212 may have any suitable arrangement with respect to one another. In other alternate scenarios, the center of the electrically-conductive disk 204, the center of the tuning plate 212, and the center of the lower plate 210.1 may be offset from one another in only one direction or aligned with one another. The number of offset directions and/or the amount of the offset(s) may be varied as a tuning parameter based upon other adjustments to the components of the SIW cavity antenna design 200 and/or depending upon the particular frequencies and/or frequency bands of operation.
Again, the SIW cavity antenna design 200 as discussed herein may be configured to operate in accordance with specific bands that correspond to the 2.4 GHz and 5-7 GHz frequency bands that are implemented as part of the Wi-Fi 6, Wi-Fi 6E, and Wi-Fi 7 standards, but are not limited to Wi-Fi frequencies or implementation in accordance with Wi-Fi communication standards. With this in mind, the operation of the SIW cavity antenna design 200 is further discussed in the context of the aforementioned 2.4 GHz and 5-7 GHz frequencies in a non-limiting sense. The dimensions of an implementation the SIW cavity antenna design 200 for Wi-Fi frequency band operation as discussed herein is shown in further detail in
The performance as shown in
Broadband Antenna Performance
To provide an illustrative scenario demonstrating the performance of the SIW cavity antenna design 200, a sample antenna requirements/recommendations for laptops in accordance with Wi-Fi 6E are listed below in Table 1.
The SIW cavity antenna 200 design as discussed herein meets all these requirements, and the calculated results are described in further detail below with respect to these metrics.
As shown in
Thus, the antenna patterns in an electronic device such as a laptop should mitigate RFI noise introduced into the laptop when transmitting while shielding SIW cavity antenna design 200 from RFI caused by the laptop while receiving, thereby maintaining wireless communication performance. Therefore, total signal-to-noise ratio (SNR) is thereby improved by reducing the noise level at the receiver.
With reference to
RFI Noise Mitigation Performance
Port 1: SIW antenna design 200 port
Port 2: Conventional PIFA port
Port 3: Noise source (noise model)
Therefore, |S11| represents the reflection coefficient of the SIW antenna design 200, |S22| represents the reflection coefficient of the conventional PIFA, |S13| represents the platform noise level onto the SIW antenna design 200, and |S23| represents the platform noise level onto a conventional PIFA.
It is noted that the SIW cavity antenna design 200 provides protection against RFI that may be present in an environment to mitigate noise that may otherwise be coupled into the SIW cavity antenna, resulting in reduced wireless performance. The SIW cavity antenna design 200, and in particular the four closed sides of the cavity antenna structure, also function to shield such components from electromagnetic signal transmissions originating from the SIW cavity antenna. Thus, the closed sides of the SIW cavity antenna design 200 function to isolate or shield the SIW cavity antenna from the components of the particular platform in which the SIW cavity antenna design 200 may be implemented Advantageously, the closed sides of the SIW cavity antenna design 200 may additionally function as a heat sink or heat shield to obviate (or at least reduce) the need for conventional heat sinking structures. Thus, the closed sides of the SIW cavity antenna design 200 may function to shield the components of the SIW cavity antenna design 200 and other components coupled thereto (such as transceivers, impedance matching devices, etc.) from heat generated by nearby components of the particular platform in which the SIW cavity antenna design 200 may be implemented (such as those in a laptop, a mobile device, etc.).
Plug-and-Play Antenna Performance
Due to the structure of the SIW cavity antenna design 200, an advantageous benefit of the design is the “plug-and-play” implementation. In other words, the performance of the SIW cavity antenna design 200 is not largely affected by the size of the ground plane onto which the SIW cavity antenna design 200 is mounted. This is observed in the plots shown in
The “port 1” as shown in
It is noted that because the variations are minimal for the 5-7 GHz band as shown in
Thus,
Feasibility of Thickness Reduction
As discussed herein with reference to
Thus,
In any event, the reduction in the thickness of the SIW cavity antenna 200 negatively impacts the reflection coefficient performance, but this may be considered an acceptable tradeoff in some implementations in which the reduced profile is more desirable. The impact of the reduction in the height of the SIW cavity antenna 200 on antenna performance is observed in the plots shown in
As shown in
As further discussed herein, the electronic device 2200 may implement any suitable number of SIW cavity antennas 200, which may be coupled to the transceiver 2204 via the antenna feed 202 to enable the electronic device 2200 to transmit and/or receive signals. Although a single SIW cavity antenna design 200 is shown in
The processing circuitry 2202 may be configured as any suitable number and/or type of computer processors, which may function to control the electronic device 2200 and/or other components of the electronic device 2200. The processing circuitry 2202 may be identified with one or more processors (or suitable portions thereof) implemented by the electronic device 2200. The processing circuitry 2202 may be identified with one or more processors such as a host processor, a digital signal processor, one or more microprocessors, graphics processors, baseband processors, microcontrollers, an application-specific integrated circuit (ASIC), part (or the entirety of) a field-programmable gate array (FPGA), etc.
In any event, the processing circuitry 2202 may be configured to carry out instructions to perform arithmetical, logical, and/or input/output (I/O) operations, and/or to control the operation of one or more components of electronic device 2200 to perform various functions as described herein. The processing circuitry 2202 may include one or more microprocessor cores, memory registers, buffers, clocks, etc., and may generate electronic control signals associated with the components of the device 2200 to control and/or modify the operation of these components. The processing circuitry 2202 may communicate with and/or control functions associated with the transceiver 2204 and/or the memory 2206.
The transceiver 2204 may be implemented as any suitable number and/or type of components configured to transmit and/or receive data and/or wireless signals in accordance with any suitable number and/or type of communication protocols. The transceiver 2204 may include any suitable type of components to facilitate this functionality, including components associated with known transceiver, transmitter, and/or receiver operation, configurations, and implementations. Although depicted in
The memory 2206 stores data and/or instructions such that, when executed by the processing circuitry 2202, cause the electronic device 2200 to perform various functions such as controlling, monitoring, and/or regulating the operation of the SIW cavity antenna design(s) 200, providing data to be transmitted to the SIW cavity antenna design(s) 200, and/or processing signals received via the SIW cavity antenna design(s) 200 as discussed herein. The memory 2206 may be implemented as any suitable type of volatile and/or non-volatile memory, including read-only memory (ROM), random access memory (RAM), flash memory, a magnetic storage media, an optical disc, erasable programmable read only memory (EPROM), programmable read only memory (PROM), etc. The memory 2206 may be non-removable, removable, or a combination of both. The memory 2206 may be implemented as a non-transitory computer readable medium storing one or more executable instructions such as, for example, logic, algorithms, code, etc.
As further discussed below, the instructions, logic, code, etc., stored in the memory 2206 are represented by the various modules as shown, which may enable the functionality disclosed herein to be functionally realized. Alternatively, the modules as shown in
The executable instructions stored in the MIMO operation module 2207 may facilitate, in conjunction with execution via the processing circuitry 2202, the electronic device 2200 transmitting and/or receiving signals via the SIW cavity antenna design(s) 200. The MIMO operation module 2207 is optional, and may be omitted when MIMO operation is not utilized or when the electronic device 2200 implements a single SIW cavity antenna design 200. The executable instructions stored in the MIMO operation module 2207 may facilitate, in conjunction with execution via the processing circuitry 2202, the electronic device 2200 implementing any suitable type of MIMO control operations to perform beam steering, antenna diversity, etc., with respect to the implemented SIW cavity antenna design(s) 200.
The executable instructions stored in the impedance matching module 2209 may facilitate, in conjunction with execution via the processing circuitry 2202, the execution of any suitable number and/or type of electronically-tunable components that may monitor the performance of (such as the return loss, radiation efficiency, etc.) and/or tune the SIW cavity antenna design(s) 200 as discussed herein. The impedance matching module 2209 may facilitate the control of one or more tunable components as discussed herein with respect to impedance matching device as shown in
General Configuration of a SIW Cavity Antenna
A cavity antenna is provided. With reference to
General Configuration of an Electronic Device
An electronic device is provided. With reference to
The following examples pertain to various techniques of the present disclosure.
An example (e.g. example 1) relates to a cavity antenna. The cavity antenna includes a conductive disk coupled to an antenna feed; a conductive structure including (i) a conductive upper plate, (ii) a conductive lower plate that is parallel with the conductive upper plate, and (iii) a plurality of conductive side plates; wherein the conductive structure forms four closed sides of the cavity antenna, and wherein the cavity antenna is configured to transmit or receive electromagnetic energy in accordance with a first frequency band via two open sides of the cavity antenna.
Another example (e.g. example 2) relates to a previously-described example (e.g. example 1), wherein the conductive disk is electrically insulated from the conductive structure.
Another example (e.g. example 3) relates to a previously-described example (e.g. one or more of examples 1-2), wherein the conductive disk has a center that is offset from a center of the conductive lower plate.
Another example (e.g. example 4) relates to a previously-described example (e.g. one or more of examples 1-3), wherein the center of the conductive disk is offset from the center of the conductive lower plate in two directions that are orthogonal to one another.
Another example (e.g. example 5) relates to a previously-described example (e.g. one or more of examples 1-4), further comprising: a meander line monopole radiator coupled to the conductive disk and configured to enable the cavity antenna to further transmit or receive electromagnetic energy in accordance with a second frequency band.
Another example (e.g. example 6) relates to a previously-described example (e.g. one or more of examples 1-5), wherein the first frequency band comprises a frequency band of 5.15-7.125 GHz, and wherein the second frequency band comprises a frequency band of 2.40-2.49 GHz.
Another example (e.g. example 7) relates to a previously-described example (e.g. one or more of examples 1-6), further comprising: an impedance tuning stub coupled to the conductive disk.
Another example (e.g. example 8) relates to a previously-described example (e.g. one or more of examples 1-7), wherein the meander line monopole radiator coupled to the conductive disk at a first location, and further comprising: an impedance tuning stub coupled to the conductive disk at a second location that is offset 90 degrees from the first location.
Another example (e.g. example 9) relates to a previously-described example (e.g. one or more of examples 1-8), wherein the plurality of conductive side plates identified with the four closed sides of the cavity antenna include (i) a first set of conductive side plates identified with a first side from among the four closed sides of the cavity antenna, and (ii) a second set of conductive side plates identified with a second side from among the four closed sides of the cavity antenna, and wherein the first side of the cavity antenna and the second side of the cavity antenna are orthogonal to one another and to each of the conductive lower plate and the conductive upper plate.
Another example (e.g. example 10) relates to a previously-described example (e.g. one or more of examples 1-9), further comprising: a conductive tuning plate disposed in a same plane as the conductive disk, the conductive tuning plate comprising a plurality of conductive segments arranged outside a circle having a larger radius than that of the conductive disk.
An example (e.g. example 11) relates to an electronic device. The electronic device includes a housing; and a substrate integrated waveguide (SIW) cavity antenna disposed within the housing, the SIW cavity antenna including: a conductive disk coupled to an antenna feed; a conductive structure including (i) an upper plate, (ii) a lower plate that is parallel with the conductive upper plate, and (iii) a plurality of conductive side plates; wherein the conductive structure is identified with four closed sides of the cavity antenna, and wherein the cavity antenna is configured to transmit or receive electromagnetic energy in accordance with a first frequency band via two open sides of the cavity antenna.
Another example (e.g. example 12) relates to a previously-described example (e.g. example 11), wherein the electrically-conductive disk antenna is electrically insulated from the electrically-conductive structure.
Another example (e.g. example 13) relates to a previously-described example (e.g. one or more of examples 11-12), wherein the conductive disk has a center that is offset from a center of the conductive lower plate.
Another example (e.g. example 14) relates to a previously-described example (e.g. one or more of examples 11-13), wherein the center of the conductive disk identified with the SIW cavity antenna is offset from the center of the conductive lower plate in two directions that are orthogonal to one another.
Another example (e.g. example 15) relates to a previously-described example (e.g. one or more of examples 11-14), wherein the SIW cavity antenna further comprises:
a meander line monopole radiator coupled to the conductive disk and configured to enable the cavity antenna to further transmit or receive electromagnetic energy in accordance with a second frequency band.
Another example (e.g. example 16) relates to a previously-described example (e.g. one or more of examples 11-15), wherein the first frequency band comprises a frequency band of 5.15-7.125 GHz, and wherein the second frequency band comprises a frequency band of 2.40-2.49 GHz.
Another example (e.g. example 17) relates to a previously-described example (e.g. one or more of examples 11-16), wherein the SIW cavity antenna further comprises: an impedance tuning stub coupled to the conductive disk.
Another example (e.g. example 18) relates to a previously-described example (e.g. one or more of examples 11-17), wherein the meander line monopole radiator coupled to the conductive disk at a first location, the SIW cavity antenna further comprising: an impedance tuning stub coupled to the conductive disk at a second location that is offset 90 degrees from the first location.
Another example (e.g. example 19) relates to a previously-described example (e.g. one or more of examples 11-18), wherein the plurality of conductive side plates identified with the four closed sides of the cavity antenna include (i) a first set of conductive side plates identified with a first side from among the four closed sides of the cavity antenna, and (ii) a second set of conductive side plates identified with a second side from among the four closed sides of the cavity antenna, and wherein the first side of the cavity antenna and the second side of the cavity antenna are orthogonal to one another and to each of the conductive lower plate and the conductive upper plate.
Another example (e.g. example 20) relates to a previously-described example (e.g. one or more of examples 11-19), wherein the SIW cavity antenna further comprises: a conductive tuning plate disposed in a same plane as the conductive disk, the conductive tuning plate comprising a plurality of conductive segments arranged outside a circle having a larger radius than that of the conductive disk.
An example (e.g. example 21) relates to a cavity antenna. The cavity antenna includes a conductive disk means coupled to an antenna feeding means; a conductive means including (i) a conductive upper plate, (ii) a conductive lower plate that is parallel with the conductive upper plate, and (iii) a plurality of conductive side plates; wherein the conductive means forms four closed sides of the cavity antenna, and wherein the cavity antenna is configured to transmit or receive electromagnetic energy in accordance with a first frequency band via two open sides of the cavity antenna.
Another example (e.g. example 22) relates to a previously-described example (e.g. example 21), wherein the conductive disk means is electrically insulated from the conductive means.
Another example (e.g. example 23) relates to a previously-described example (e.g. one or more of examples 21-22), wherein the conductive disk means has a center that is offset from a center of the conductive lower plate.
Another example (e.g. example 24) relates to a previously-described example (e.g. one or more of examples 21-23), wherein the center of the conductive disk means is offset from the center of the conductive lower plate in two directions that are orthogonal to one another.
Another example (e.g. example 25) relates to a previously-described example (e.g. one or more of examples 21-24), further comprising: a meander line monopole means coupled to the conductive disk means and configured to enable the cavity antenna to further transmit or receive electromagnetic energy in accordance with a second frequency band.
Another example (e.g. example 26) relates to a previously-described example (e.g. one or more of examples 21-25), wherein the first frequency band comprises a frequency band of 5.15-7.125 GHz, and wherein the second frequency band comprises a frequency band of 2.40-2.49 GHz.
Another example (e.g. example 27) relates to a previously-described example (e.g. one or more of examples 21-26), further comprising: an impedance tuning means coupled to the conductive disk means.
Another example (e.g. example 28) relates to a previously-described example (e.g. one or more of examples 21-27), wherein the meander line monopole means coupled to the conductive disk means at a first location, and further comprising: an impedance tuning means coupled to the conductive disk means at a second location that is offset 90 degrees from the first location.
Another example (e.g. example 29) relates to a previously-described example (e.g. one or more of examples 21-28), wherein the plurality of conductive side plates identified with the four closed sides of the cavity antenna include (i) a first set of conductive side plates identified with a first side from among the four closed sides of the cavity antenna, and (ii) a second set of conductive side plates identified with a second side from among the four closed sides of the cavity antenna, and wherein the first side of the cavity antenna and the second side of the cavity antenna are orthogonal to one another and to each of the conductive lower plate and the conductive upper plate.
Another example (e.g. example 30) relates to a previously-described example (e.g. one or more of examples 21-29), further comprising: a conductive tuning plate disposed in a same plane as the conductive disk means, the conductive tuning plate comprising a plurality of conductive segments arranged outside a circle having a larger radius than that of the conductive disk means.
An example (e.g. example 31) relates to an electronic device. The electronic device includes a housing means; and a substrate integrated waveguide (SIW) cavity antenna disposed within the housing, the SIW cavity antenna including: a conductive disk means coupled to an antenna feeding means; a conductive means including (i) an upper plate, (ii) a lower plate that is parallel with the conductive upper plate, and (iii) a plurality of conductive side plates; wherein the conductive means is identified with four closed sides of the cavity antenna, and wherein the cavity antenna is configured to transmit or receive electromagnetic energy in accordance with a first frequency band via two open sides of the cavity antenna.
Another example (e.g. example 32) relates to a previously-described example (e.g. example 31), wherein the conductive disk antenna is electrically insulated from the conductive means.
Another example (e.g. example 33) relates to a previously-described example (e.g. one or more of examples 31-32), wherein the conductive disk means has a center that is offset from a center of the conductive lower plate.
Another example (e.g. example 34) relates to a previously-described example (e.g. one or more of examples 31-33), wherein the center of the conductive disk means identified with the SIW cavity antenna is offset from the center of the conductive lower plate in two directions that are orthogonal to one another.
Another example (e.g. example 35) relates to a previously-described example (e.g. one or more of examples 31-34), wherein the SIW cavity antenna further comprises: a meander line monopole means coupled to the conductive disk means and configured to enable the cavity antenna to further transmit or receive electromagnetic energy in accordance with a second frequency band.
Another example (e.g. example 36) relates to a previously-described example (e.g. one or more of examples 31-35), wherein the first frequency band comprises a frequency band of 5.15-7.125 GHz, and wherein the second frequency band comprises a frequency band of 2.40-2.49 GHz.
Another example (e.g. example 37) relates to a previously-described example (e.g. one or more of examples 31-36), wherein the SIW cavity antenna further comprises: an impedance tuning means coupled to the conductive disk means.
Another example (e.g. example 38) relates to a previously-described example (e.g. one or more of examples 31-37), wherein the meander line monopole radiator means is coupled to the conductive disk means at a first location, the SIW cavity antenna further comprising: an impedance tuning means coupled to the conductive disk means at a second location that is offset 90 degrees from the first location.
Another example (e.g. example 39) relates to a previously-described example (e.g. one or more of examples 31-38), wherein the plurality of conductive side plates identified with the four closed sides of the cavity antenna include (i) a first set of conductive side plates identified with a first side from among the four closed sides of the cavity antenna, and (ii) a second set of conductive side plates identified with a second side from among the four closed sides of the cavity antenna, and wherein the first side of the cavity antenna and the second side of the cavity antenna are orthogonal to one another and to each of the conductive lower plate and the conductive upper plate.
Another example (e.g. example 40) relates to a previously-described example (e.g. one or more of examples 31-39), wherein the SIW cavity antenna further comprises: a conductive tuning plate disposed in a same plane as the conductive disk means, the conductive tuning plate comprising a plurality of conductive segments arranged outside a circle having a larger radius than that of the conductive disk means.
An apparatus as shown and described.
A method as shown and described.
The aforementioned description will so fully reveal the general nature of the implementation of the disclosure that others can, by applying knowledge within the skill of the art, readily modify and/or adapt for various applications such specific implementations without undue experimentation and without departing from the general concept of the present disclosure. Therefore, such adaptations and modifications are intended to be within the meaning and range of equivalents of the disclosed implementations, based on the teaching and guidance presented herein. It is to be understood that the phraseology or terminology herein is for the purpose of description and not of limitation, such that the terminology or phraseology of the present specification is to be interpreted by the skilled artisan in light of the teachings and guidance.
Each implementation described may include a particular feature, structure, or characteristic, but every implementation may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same implementation. Further, when a particular feature, structure, or characteristic is described in connection with an implementation, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other implementations whether or not explicitly described.
The exemplary implementations described herein are provided for illustrative purposes, and are not limiting. Other implementations are possible, and modifications may be made to the exemplary implementations. Therefore, the specification is not meant to limit the disclosure. Rather, the scope of the disclosure is defined only in accordance with the following claims and their equivalents.
Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures, unless otherwise noted.
The terms “at least one” and “one or more” may be understood to include a numerical quantity greater than or equal to one (e.g., one, two, three, four, [ . . . ], etc.). The term “a plurality” may be understood to include a numerical quantity greater than or equal to two (e.g., two, three, four, five, [ . . . ], etc.).
The words “plural” and “multiple” in the description and in the claims expressly refer to a quantity greater than one. Accordingly, any phrases explicitly invoking the aforementioned words (e.g., “plural [elements]”, “multiple [elements]”) referring to a quantity of elements expressly refers to more than one of the said elements. The terms “group (of)”, “set (of)”, “collection (of)”, “series (of)”, “sequence (of)”, “grouping (of)”, etc., and the like in the description and in the claims, if any, refer to a quantity equal to or greater than one, i.e., one or more. The terms “proper subset”, “reduced subset”, and “lesser subset” refer to a subset of a set that is not equal to the set, illustratively, referring to a subset of a set that contains less elements than the set.
The phrase “at least one of” with regard to a group of elements may be used herein to mean at least one element from the group consisting of the elements. The phrase “at least one of” with regard to a group of elements may be used herein to mean a selection of: one of the listed elements, a plurality of one of the listed elements, a plurality of individual listed elements, or a plurality of a multiple of individual listed elements.