Claims
- 1. A rapid curing adhesive composition comprising
- a. an amine-modified condensation polymer comprising the reaction product of a ketone-formaldehyde condensation polymer containing reactive alkylol groups with a primary aromatic amine of the formula ##SPC4##
- wherein X.sub.1 is --NH.sub.2 or --CH.sub.2 NH.sub.2 ; X.sub.2 is --NH.sub.2, --CH.sub.2 NH.sub.2 or --OH; X.sub.3 is --NH.sub.2, --CH.sub.2 NH.sub.2, --NO.sub.2, --OH, alkyl of 1 to 5 carbon atoms, hydrogen, halogen, halogenated alkyl, alkyoxy or ##SPC5##
- X.sub.4 is hydrogen, alkyl of 1 to 4 carbon atoms or aryl; and A is --SO.sub.2 --, --NH--, --O--, --S--, --C=c--, --S--S--, --N=N-- or ##EQU4## where Y.sub.1 and Y.sub.2 are hydrogen or alkyl of 1 to 3 carbon atoms and z is 0, 1 or 2; the amount of said amine being at least 0.1 part by weight per part of said ketone-formaldehyde condensation polymer; and
- b. a curing agent reactable with said modified condensation polymer at ambient temperatures, the amounts of said modified polymer and curing agent being sufficient to cause said composition to rapidly become insoluble and infusible at ambient temperatures.
- 2. The composition of claim 1 wherein said amine is m-hydroxyaniline.
- 3. The composition of claim 1 wherein said amine is a phenylenediamine.
- 4. The composition of claim 1 wherein said curing agent comprises an alkylene donating compound, a diisocyanate, a polyisocyanate or an epoxide.
- 5. The composition of claim 1 wherein said curing agent comprises an alkylene donating compound.
- 6. The composition of claim 1 wherein said curing agent comprises formaldehyde.
- 7. The composition of claim 1 wherein the amount of curing agent is from 0.02 to 2.0 parts by weight per part by weight of said modified condensation polymer.
- 8. The composition of claim 1 wherein the amount of said amine is from 0.1 to 1.0 part by weight per part of said ketone-formaldehyde condensation polymer.
- 9. The composition of claim 1 wherein said ketone-formaldehyde condensation polymer is an acetone-formaldehyde polymer.
- 10. The composition of claim 9 wherein the amount of said amine is from 0.1 to 1.0 part by weight per part of said ketone-formaldehyde condensation polymer.
- 11. The composition of claim 10 wherein said amine is m-hydroxyaniline.
- 12. The composition of claim 10 wherein said amine is a phenylenediamine.
- 13. The composition of claim 1 wherein said ketone-formaldehyde condensation polymer is an acetone-formaldehyde polymer, a methyl ethyl ketone-formaldehyde polymer, or a methyl isobutyl ketone-formaldehyde polymer.
- 14. The composition of claim 13 wherein the amount of said amine is from 0.1 to 1.0 part by weight per part of said ketone-formaldehyde condensation polymer.
- 15. The composition of claim 14 wherein said amine is m-hydroxyaliline.
- 16. The composition of claim 14 wherein said amine is a phenylenediamine.
- 17. The process of claim 1 wherein said amine is m-hydroxyaniline, a phenylenediamine, a triaminobenzene, a diaminotoluene or xylylenediamine.
- 18. The composition of claim 17 wherein the amount of said amine is from 0.1 to 1.0 part by weight per part of said ketone-formaldehyde condensation polymer.
- 19. The composition of claim 18 wherein the ketone-formaldehyde condensation polymer is an acetone-formaldehyde polymer.
- 20. The composition of claim 19 wherein said curing agent comprises an alkylene donating compound.
- 21. A process for the preparation of a rapid curing adhesive comprising:
- 1. blending together at ambient temperatures
- a. an amine-modified condensation polymer comprising the reaction produce of a ketone-formaldehyde condensation polymer containing reactive alkylol groups with a primary aromatic amine of the formula ##SPC6##
- wherein X.sub.1 is --NH.sub.2 or --CH.sub.2 NH.sub.2 ; X.sub.2 is --NH.sub.2, --CH.sub.2 NH.sub.2 or --OH; X.sub.3 is --NH.sub.2, --CH.sub.2 NH.sub.2, --NO.sub.2, --OH, alkyl of 1 to 5 carbon atoms, hydrogen, halogen, halogenated alkyl, alkyoxy or ##SPC7##
- X.sub.4 is hydrogen, alkyl of 1 to 4 carbon atoms or aryl; and A is --SO.sub.2 --, --NH--, --O--, --S--, --C=C--, --S--S--, --N=N-- or ##EQU5## where Y.sub.1 and Y.sub.2 are hydrogen or alkyl of 1 to 3 carbon atoms and z is 0, 1 or 2, the amount of said amine being at least 0.1 part by weight per part of said ketone-formaldehyde condensation polymer; and
- b. a curing agent reactable with said modified condensation polymer at ambient temperatures, the amounts of said modified polymer and curing agent being sufficient to cause said composition to rapidly become insoluble and infusible at ambient temperatures and
- 2. allowing the resulting blend to cure to an insoluble, infusible state at ambient temperatures.
- 22. The process of claim 21 wherein said amine is m-hydroxyaniline.
- 23. The process of claim 21 wherein said amine is a phenylenediamine.
- 24. The process of claim 21 wherein said curing agent comprises an alkylene donating compound, a diisocyanate, a polyisocyanate or an epoxide.
- 25. The process of claim 21 wherein said curing agent comprises an alkylene donating compound.
- 26. The process of claim 21 wherein said curing agent comprises formaldehyde.
- 27. The process of claim 21 wherein the amount of curing agent is from 0.02 to 2.0 parts by weight per part by weight of said modified condensation polymer.
- 28. The process of claim 21 wherein said ketone-formaldehyde condensation polymer is an acetone-formaldehyde resin, a methyl ethyl ketone-formaldehyde resin or a methyl isobutyl ketone-formaldehyde resin.
- 29. The process of claim 28 wherein said amine is m-hydroxyaniline, a phenylenediamine, a triaminobenzene, a diaminotoluene or xylylenediamine.
- 30. The process of claim 28 wherein said amine is m-hydroxyaniline.
- 31. The process of claim 28 wherein said amine is a phenylenediamine.
- 32. The process of claim 21 wherein the amount of said amine is from 0.1 to 1.0 part by weight per part of said ketone-formaldehyde condensation polymer.
- 33. The process of claim 32 wherein said amine is m-hydroxyaniline.
- 34. The process of claim 32 wherein said amine is a phenylenediamine.
CROSS REFERENCE
This application is a divisional of copending application Ser. No. 174,942, filed Aug. 25, 1971 (now U.S. Pat. No. 3,784,515) which application was a continuation-in-part of earlier copending application Ser. No. 113,681, filed on Feb. 8, 1971 (now abandoned), and entitled "Rapid Curing Resin Compositions Comprising The Reaction Product of an Aldehyde Condensation Polymer With a Primary Aromatic Amine Further Reacted With a Curing Agent." Application Ser. No. 113,681 was a continuation-in-part of earlier copending application Ser. No. 821,996, filed on May 5, 1969, now abandoned, and entitled "Rapid Curing Resin Compositions Comprising the Reaction Product of an Aldehyde Condensation Polymer With a Primary Aromatic Amine Further Reacted With Additional Aldehyde." Application Ser. No. 821,996 was itself a continuation-in-part of application Ser. No. 639,270, filed May 18, 1967, entitled "Method of Making a Fast-Curing Adhesive and a Method of Bonding Members Utilizing Said Adhesives", now U.S. Pat. No. 3,518,159. While this application is directed to certain new methods of preparation of rapid curing resin compositions, to certain resin compositions per se, and to certain use of these resin compositions as adhesives, other methods, compositions and uses for the same purposes are disclosed and claimed in the copending application having a common assignee, Ser. No. 164,927, filed July 21, 1971 (now U.S. Pat. No. 3,773,721), and having a title identical to that of this application.
US Referenced Citations (8)
Divisions (1)
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Date |
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174942 |
Aug 1971 |
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Continuation in Parts (3)
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113681 |
Feb 1971 |
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821996 |
May 1969 |
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Parent |
639270 |
May 1967 |
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