The characteristics and the advantages of the method and of the device according to the disclosure will be apparent from the following description of an embodiment thereof given by way of indicative and non limiting example with reference to the annexed drawings.
With reference to these figures, the structure and the operation of the device according to the disclosed embodiments will be described in detail.
Multilevel FLASH memories store at least two information bits for each FLASH cell. The correct re-reading of the stored content requires the accurate comparison of the current of the FLASH cell with a similar current supplied by three references represented by the same number of FLASH cells arranged at suitable voltage thresholds.
The three different voltage thresholds Vth identify in fact the four states in which the matrix cell can be found, then coding the above two information bits.
In the case of
For carrying out, with the highest precision, the multilevel reading it is necessary to pay particular attention to the dynamic effects of the reading and to the equalization (matching) of the reading paths of the matrix and the reference.
Each unevenness or difference between the reference and the matrix values results in a reading error that reduces the difference between matrix cells and references. When this margin becomes greater than the variability and the offsets introduced by the circuitry, there is a reading error.
Another element to be taken into consideration in the realization of a flash memory is the area occupied by the circuitry for the references. Generally, small matrixes of reference cells, of sense amplifiers, and of other necessary components are preferred. As already said, the overall area must be kept at the minimum for matters of cost.
Advantageously, according to the present disclosure, both the requisites of matching and area can be well solved by using, for the reading of a memory bank, three references that are read by means of corresponding sub-groups or arrays of sense amplifiers of the other bank that is not involved in the reading step.
The matrix 2 includes two distinct banks, 3 and 4, of memory cells. Nothing obviously forbids the organization of the device with a plurality of banks. The columns of each bank 3, 4 refer to respective groups or arrays of sense amplifiers 5, 6 that have the respective outputs connected to a data bus DBUS.
A small sector 10 of each bank 3, 4 is used for housing the reference cells; as it will be seen hereafter for this small sector 10, an array corresponding to a single word line of a matrix bank is enough.
Each group 5, 6 of sense amplifiers shows a first input connected to a column of a matrix bank and a second input connected to a first potential reference. In the case of multilevel memories, further inputs connected to further potential references are added. In the example of a multilevel memory with two bits per cell, there is a total of three potential references. Each group of sense amplifiers 5, 6 then has a first input connected to a column of a matrix bank, a second input connected to a first potential reference, a third input connected to a second potential reference and a fourth input connected to a third potential reference.
According to the embodiment here described, these potential references are supplied by a memory bank not in use. In
For this aim a connection 7 is provided between the output of a first sub-group of sense amplifiers of the bank 4 and between the second input of the sense amplifiers of the bank 3. In this way the output of the sub-group of sense amplifiers of the bank 4 is used as a potential reference for the sense amplifiers of the bank 3. In the case as per the embodiment of a multilevel memory cell with two bits per cell it is necessary to arrange three potential levels. In a similar way, a connection 8 is thus provided between the output signal of at least one second sub-group of sense amplifiers of the bank 4 and between the third input of the sense amplifiers of the bank 3 and a connection 9 between a third sense amplifier of the bank 4 and between the fourth input of the sense amplifiers of the bank 3.
This configuration ensures a perfect ‘matching’ of matrix/reference reading; also the wordline of the small sector 10 of the references has been chosen with the same length of the matrix sectors of the banks 3 and 4, although only three groups of sense amplifiers are necessary (and thus a very narrow horizontal portion of array) for reading the references; this measure makes it identical also the dynamic response of the matrix and reference wordline.
Once the wordline corresponding to the small sector 10 containing the reference cells has been raised, the above connections 7, 8, 9 are supplied by the respective sense amplifiers of the bank 4, which thus bring back the potential references. At this point it is possible to carry out a reading on the bank 3.
It is to be observed that the situation indicated in
Another proper observation to be made is that the three sense amplifiers used also as a reference are not necessarily those at the ends, for avoiding unevenness due to edge effects.
The small sector 10 with the reference cells is part of the memory matrix 2. It is suitable to have a logic of the memory device that makes this small sector 10 only accessible through reading and non modifiable by the user of the device. Advantageously, this small sector 10 is programmed during the manufacturing of the memory device with the suitable values.
For several reasons, which can be for example of technical nature or related to manufacturing difficulties, but are often more simply due to manufacturing specifications, often, a memory bank of a non-volatile electronic device is further divided. This case is shown in
Each group or subgroup of sense amplifiers should be equipped with connections with the potential references REF1, REF2, REF3 and thus, having a plurality of sense amplifiers and of memory banks, the number of necessary connections increases significantly.
In order to avoid a plurality of these connections, in
The inputs of the references of each sense amplifier 5, 6, 7 and 8 are connected to said bus RFBUS for the potential references through the connections 9, 10, 11 and 12. The outputs of the three groups of sense amplifiers corresponding to the bitlines connected to the cells containing the reference values of the small reference sectors 15 or 16 are provided with means EN for the connection to said bus RFBUS for the potential references. Said means EN carry out a connection to the bus only when the references contained in the small sector of the memory bank at issue are used. For example, as shown in
At this point it is suitable to deepen some details of the operation of a sense amplifier, since not in all microchip architectures is it possible to use the normal output of a sense amplifier for the connection of the potential references to the bus.
In particular,
A sense amplifier normally includes a plurality of components for giving a digital value to the current of the cell connected to the bitline. In
The other three sense amplifiers 26, 27 and 28 of
In a multilevel reading architecture the first input stage 31 of the sense amplifier maintains the bitline at a suitable reading voltage (about 0.8 Volt) and produces a voltage proportional to the current consumed by the flash cell under test, i.e., it operates as converter I/V.
The output of this first stage 31 is thus a voltage that is proportional to the current consumed by the flash cell. This voltage is then compared by a second stage 32 with the three voltages generated in a similar way by the three references. As shown in
The signals ENABLE_REF_R and ENABLE_REF_L thus change the state of the sense amplifier, forcing from a use for the sole reading to a use for supplying a reference voltage.
Three groups of sense amplifiers of a given bank 3, 4 can operate also as reference and transmit the reading voltage on said bidirectional bus with three wires. It is obvious that if the sense amplifiers of the right bank drive the bus while the sense amplifiers of the left bank will be disconnected and vice versa.
As it is then seen in
The block 33 downstream of the sense amplifier in reading on the left finally attends to the decoding of the result of the comparison from the output of the second stage 32 with the three reference currents two-bit digital information (00, 01, 10, 11) are obtained on the two digital lines MSB and LSB.
This architecture is suitable for a non-ramp reading mode. In the reading mode described in
Instead, in the case of a ramp reading the scheme of
For this reading mode instead of applying a constant voltage, an increasing voltage is applied, which increases in a linear way with the time, thus starting from 0V and reaching the highest voltage (5V . . . 7V, depending on the process) in a very reduced time (about 40/50 ns).
When a flash cell is subjected to a gate voltage being variable and linearly increasing, what occurs is that as long as the wordline voltage is lower than the threshold voltage of the flash cell (i.e., the voltage at which it enters in conduction and consumes current) no current is observed on the bitline. As soon as the voltage exceeds the threshold then an increasing current is observed on the bitline.
In the case of a reading with ramp mode on the bidirectional bus with three wires, only one-bit digital signals flow, and according to the time instant of a one-bit digital signal, the reference voltage associated therewith is established.
In conclusion, the device according to the embodiments described herein allows the reading of the memory cells without additional circuitry for the references and results to be matched with the structure of the matrix, in particular same bitline, same sense amplifier, same distances, and circuit topology.
The various embodiments described above can be combined to provide further embodiments. All of the U.S. patents, U.S. patent application publications, U.S. patent applications, foreign patents, foreign patent applications and non-patent publications referred to in this specification and/or listed in the Application Data Sheet, are incorporated herein by reference, in their entirety. Aspects of the embodiments can be modified, if necessary to employ concepts of the various patents, applications and publications to provide yet further embodiments.
These and other changes can be made to the embodiments in light of the above-detailed description. In general, in the following claims, the terms used should not be construed to limit the claims to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which such claims are entitled. Accordingly, the claims are not limited by the disclosure.
Number | Date | Country | Kind |
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MI2006A001037 | May 2006 | IT | national |