Patent Application
20230038584
This application claims the benefit under 35 USC § 119(a) of Korean Patent Application No. 10-2021-0102377, filed on Aug. 4, 2021, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes.
The present disclosure relates to a real wood skin capable of automatic wrapping, and a process and apparatus for manufacturing the same.
A conventional real wood skin used for vehicles is produced by preforming a real wood sheet on decorative veneer wood, performing insert injection (rear injection) molding on the preformed real wood sheet, trimming the end of the injected real wood sheet, and then curling and coating the trimmed real wood sheet in this order.
Such a conventional real wood skin product may provide a real wood surface with excellent visual and tactile sense due to rear injection molding applied thereto, but feels cheep when pressed by consumers since it comprises high-hardness real wood attached on the injected surface thereof.
Of course, some customers may assume that the skin product is hard due to high-hardness real wood. However, this product may not satisfy customers who want the interior material thereof to be soft.
This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
In one general aspect, here is provided a real wood crash pad including a real wood sheet including a wood layer, a mesh layer laminated under the wood layer, the mesh layer being configured to provide reinforcement, and an elastic layer laminated under the mesh layer, the elastic layer being configured to provide elasticity, a filament cross pad provided in an area of a vehicle desk where a real wood layer is to be applied, the filament cross pad being laminated under the elastic layer, and a core mounted on the vehicle desk, wherein the real wood sheet is configured for automatic wrapping.
The real wood crash pad may include a protective film laminated on the wood layer, the protective film being configured to protect the wood layer, and the protective film being configured to be removed after processing.
The wood layer may have a thickness of 0.1 t to 0.2 t.
The mesh layer may have a thickness of 0.2 t.
The elastic layer may be formed of PP foam or TPO foam.
The elastic layer may have a thickness of 1 t to 2 t.
The protective film may have a thickness of 0.1 t.
The filament cross pad may have a thickness of 2 to 5 t.
The filament cross pad may be applied to an area of 3 mm or less from an injected end of the real wood sheet, which is configured to be touched by a hand.
The filament cross pad may be either a PP pad or a TPO pad.
The core may have a thickness of 0.3 t.
The wood grains may be formed on the wood layer by a sanding machine.
The wood layer may be configured to give the same visual impression as wood.
In another general aspect, here is provided a method of manufacturing real wood crash pads, including applying a glue following application of a primer to a core, attaching a filament cross pad to the core using the glue, applying a glue to the top of the filament cross pad, and compressing a real wood sheet, which comprises a mesh layer, a wood layer, and a protective film, to the filament cross pad.
Other features and aspects will be apparent from the following detailed description, the drawings, and the claims.
Throughout the drawings and the detailed description, unless otherwise described or provided, the same drawing reference numerals will be understood to refer to the same elements, features, and structures. The drawings may not be to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.
The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the disclosure of this application. For example, the sequences of operations described herein are merely examples, and are not limited to those set forth herein, but may be changed as will be apparent after an understanding of the disclosure of this application, with the exception of operations necessarily occurring in a certain order.
The features described herein may be embodied in different forms and are not to be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways of implementing the methods, apparatuses, and/or systems described herein that will be apparent after an understanding of the disclosure of this application.
Advantages and features of the present disclosure and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. The present disclosure may, however, be embodied in different forms, and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. The present disclosure should be defined based on the entire content set forth in the appended claims. Meanwhile, the terms used herein are for the purpose of describing the embodiments and are not intended to limit the disclosure.
Terms, such as first, second, A, B, (a), (b) or the like, may be used herein to describe components. Each of these terminologies is not used to define an essence, order or sequence of a corresponding component but used merely to distinguish the corresponding component from other component(s). For example, a first component may be referred to as a second component, and similarly the second component may also be referred to as the first component.
Throughout the specification, when a component is described as being “connected to,” or “coupled to” another component, it may be directly “connected to,” or “coupled to” the other component, or there may be one or more other components intervening therebetween. In contrast, when an element is described as being “directly connected to,” or “directly coupled to” another element, there can be no other elements intervening therebetween.
The singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises/comprising” and/or “includes/including” when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.
As illustrated in
The wood layer 101 is a layer that gives the same visual impression as wood material. The wood layer 101 preferably has a thickness of 0.1 t to 0.2 t, and may have wood grain formed by a sanding machine.
The mesh layer 102 is a layer that is laminated under the wood layer 101 to reinforce the sheet. It is preferable that the mesh layer 102 have a thickness of 0.2 t.
The elastic layer 103 is a layer that is laminated under the mesh layer 102 to provide elasticity. The elastic layer 103 may be formed of polypropylene (PP) foam or thermoplastic polyolefin (TPO) foam. It is preferable that the elastic layer 103 have a thickness of 1 t to 2 t.
According to the first embodiment of the present disclosure, the real wood skin may further include a protective film 104 laminated on the wood layer 101 to protect the wood layer. It is preferable that the protective film 104 have a thickness of 0.1 t.
In the real wood sheet of the first embodiment of the present disclosure, the mash layer 102 is laminated under the wood layer 101 as illustrated in
As illustrated n
The filament cross pad 140 is provided in a partial area of a vehicle desk to allow that area to be cushioned.
As such, the filament cross pad 140 provided in one area of the desk is laminated under the elastic layer 103. Here, it is preferable that the filament cross pad 140 have a thickness of 2 to 5 t. In this case, as illustrated in
The core 150 is mounted on the vehicle desk, and preferably has a thickness of 0.3 t.
As illustrated in
That is, after an additional bonding operation of applying a glue to the top of the filament cross pad 140 is performed, a real wood sheet 100, which includes a wood layer 101, a mesh layer 102, and an elastic layer 103 is compressed with a compression jig (S530).
As such, it is possible to make the real wood sheet 100, constituting the vehicle desk, visually feel the same as real wood, and to provide a certain degree of cushioning when the real wood sheet is touched by an occupant as illustrated in
In the conventional case of manufacturing a real wood sheet through injection molding, it is impossible to implement the effect of the present disclosure. However, according to the first embodiment of the present disclosure, it is possible to supplement the elongation of the real wood sheet and improve the surface quality of the real wood sheet by applying PP foam/TPO foam to the rear surface of the wood, and to make a real wood wrapping product to be soft by applying the filament cross pad used for existing natural or artificial leather to the core.
As is apparent from the above description, according to the first embodiment of the present disclosure, it is possible to make the real wood sheet, constituting the vehicle desk, visually feel the same as real wood, and to provide a, certain degree of cushioning when the real wood sheet is touched by an occupant.
Each step included in the method described above may be implemented as a software module, a hardware module, or a combination thereof, which is executed by a computing device.
Also, an element for performing each step may be respectively implemented as first to two operational logics of a processor.
The software module may be provided in RAM, flash memory, ROM, erasable programmable read only memory (EPROM), electrical erasable programmable read only memory (EEPROM), a register, a hard disk, an attachable/detachable disk, or a storage medium (i.e., a memory and/or a storage) such as CD-ROM.
An exemplary storage medium may be coupled to the processor, and the processor may read out information from the storage medium and may write information in the storage medium. In other embodiments, the storage medium may be provided as one body with the processor.
The processor and the storage medium may be provided in application specific integrated circuit (ASIC). The ASIC may be provided in a user terminal. In other embodiments, the processor and the storage medium may be provided as individual components in a user terminal.
Exemplary methods according to embodiments may be expressed as a series of operation for clarity of description, but such a step does not limit a sequence in which operations are performed. Depending on the case, steps may be performed simultaneously or in different sequences.
In order to implement a method according to embodiments, a disclosed step may additionally include another step, include steps other than some steps, or include another additional step other than some steps.
Various embodiments of the present disclosure do not list all available combinations but are for describing a representative aspect of the present disclosure, and descriptions of various embodiments may be applied independently or may be applied through a combination of two or more.
Moreover, various embodiments of the present disclosure may be implemented with hardware, firmware, software, or a combination thereof. In a case where various embodiments of the present disclosure are implemented with hardware, various embodiments of the present disclosure may be implemented with one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), general processors, controllers, microcontrollers, or microprocessors.
The scope of the present disclosure may include software or machine-executable instructions (for example, an operation system (OS), applications, firmware, programs, etc.), which enable operations of a method according to various embodiments to be executed in a device or a computer, and a non-transitory computer-readable medium capable of being executed in a device or a computer each storing the software or the instructions.
A number of exemplary embodiments have been described above. Nevertheless, it will be understood that various modifications may be made. For example, suitable results may be achieved if the described techniques are performed in a different order and/or if components in a described system, architecture, device, or circuit are combined in a different manner and/or replaced or supplemented by other components or their equivalents. Accordingly, other implementations are within the scope of the following claims.
Various embodiments are directed to a real wood crash pad that can provide elasticity while giving a visual impression like real wood.
While this disclosure includes specific examples, it will be apparent after an understanding of the disclosure of this application that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2021-0102377 | Aug 2021 | KR | national |
