Patent Application
20230105368
The subject matter herein relates generally to communication systems.
Some communication systems utilize transceivers or plug modules as I/O modules for data communication. The plug module is pluggably received in a receptacle cage of a receptacle assembly to interconnect the plug module with another component, such as a circuit board through a receptacle module mounted to the circuit board. Due to the high speed of data transmission and the length of the traces on the circuit board between the receptacle module and other components mounted to the circuit board, some known communication systems bypass data transmission on the circuit board using a cable receptacle connector. The communication system includes an electronic package on the circuit board electrically connected to the receptacle assembly. Due to the high heat generated by the electronic package, the communication system typically includes a heat sink coupled to the electronic package. The height allowed for the heat sink within the communication system is typically constrained, leading to the heat sink having a larger footprint to achieve the necessary heat transfer capacity, which increases the overall size of the system and/or reduces the number of other electrical components that may be utilized in the communication system.
A need remains for a communication system having a reduced footprint for mating plug modules.
In one embodiment, a receptacle connector assembly is provided including a receptacle cage having cage walls defining a first module channel, a second module channel stacked above the first module channel, and a third module channel stacked above the second module channel. The receptacle cage extends between a front end and a rear end. The cage walls include a top wall, a first side wall, a second side wall, a first separator panel, and a second separator panel. The first side wall extends along the first, second and third module channels. The second side wall extends along the first, second and third module channels. The first separator panel is located between the first and second module channels. The second separator panel is located between the second and third module channels. The receptacle connector assembly includes a first receptacle module in the first module channel for mating with a first plug module, a second receptacle module in the second module channel for mating with a second plug module, and a third receptacle module in the third module channel for mating with a third plug module.
In another embodiment, a receptacle connector assembly is provided including a receptacle cage configured to be mounted to a circuit board. The receptacle cage has cage walls defining a first module channel, a second module channel stacked above the first module channel, a third module channel stacked above the second module channel, and a fourth module channel stacked above the third module channel. The receptacle cage extends between a front end and a rear end. The cage walls include a top wall, a first side wall, and a second side wall. The first side wall extending along the first, second, third, and fourth module channels. The second side wall extending along the first, second, third, and fourth module channels. The receptacle connector assembly includes a first receptacle module in the first module channel for mating with a first plug module being a board module mounted directly to the circuit board. The receptacle connector assembly includes a second receptacle module in the second module channel for mating with a second plug module. The receptacle connector assembly includes a third receptacle module in the third module channel for mating with a third plug module being a cable module having cables extending from the third receptacle module remote from the receptacle cage. The receptacle connector assembly includes a fourth receptacle module in the fourth module channel for mating with a fourth plug module being a cable module having cables extending from the fourth receptacle module remote from the receptacle cage.
In another embodiment, a communication system is provided including a circuit board having an upper surface and a lower surface and including a cage mounting area and a package mounting area remote from the cage mounting area. An electronic package is mounted to the circuit board at the package mounting area. A receptacle cage is mounted to the circuit board at the cage mounting area. The receptacle cage includes cage walls defining a first module channel, a second module channel stacked above the first module channel, and a third module channel stacked above the second module channel. The receptacle cage extends between a front end and a rear end. The cage walls include a top wall, a first side wall, a second side wall, a first separator panel, and a second separator panel. The first side wall extends along the first, second and third module channels. The second side wall extends along the first, second and third module channels. The first separator panel is located between the first and second module channels. The second separator panel is located between the second and third module channels. The communication system includes a first receptacle module in the first module channel for mating with a first plug module being electrically connected to the circuit board and being mounted to the circuit board within the cage mounting area. The communication system includes a second receptacle module in the second module channel for mating with a second plug module being electrically connected to the circuit board. The communication system includes a third receptacle module in the third module channel for mating with a third plug module being electrically connected to the circuit board at a connection area remote from the cage mounting area by one or more cables.
The communication system 100 includes a receptacle connector assembly 102 and one or more plug modules 200 (two plug modules 200 shown in
In an exemplary embodiment, the receptacle connector assembly 102 is mounted to a support structure 104. For example, in the illustrated embodiment, the support structure 104 may include a circuit board 106. The receptacle connector assembly 102 is mounted to the circuit board 106. The circuit board 106 may provide a ground reference for the receptacle connector assembly 102. The receptacle modules 300 are electrically connected to the circuit board 106 to electrically connect the plug modules 200 to the circuit board 106 through the receptacle modules 300. In an exemplary embodiment, one or more of the receptacle modules 300 are board modules 304 configured to be board mounted to the circuit board 106. The board modules 304 are directly mounted to the circuit board 106, such as within the footprint of the receptacle connector assembly 102. In an exemplary embodiment, one or more of the receptacle modules 300 are cable modules 306 configured to be provided at ends of cables 308. The cable modules 306 are not connected to the circuit board 106 within the footprint of the receptacle connector assembly 102, but rather may be electrically connected to the circuit board 106 (either direct attach or through a connector) remote from the footprint of the receptacle connector assembly 102. One or more of the receptacle modules 300 may be electrically connected to other electrical components via the cables 308 rather than connecting to the circuit board 106.
In an exemplary embodiment, the support structure 104 may additionally, or alternatively, include a panel 108. The panel 108 may be a rack panel in a server in various embodiments. The plug modules 200 may be plugged into the receptacle connector assembly 102 through an opening(s) in the panel 108. In various embodiments, the panel 108 may have greater than a 1U height, such as a 2U height. In other various embodiments, the panel 108 may include a cabinet or chassis of an electrical device, such as a computer. The panel 108 may be another type of support structure in alternative embodiments. The panel 108 may be a metal plate or sheet in various embodiments.
In an exemplary embodiment, the receptacle connector assembly 102 includes a receptacle cage 120. The receptacle modules 300 are positioned in a rear of the receptacle cage 120. The plug modules 200 are configured to be loaded into a front of the receptacle cage 120 to mate with the receptacle modules 300 inside the receptacle cage 120. In various embodiments, the receptacle cage 120 is enclosed and provides electrical shielding for the receptacle modules 300 and the plug modules 200.
The receptacle cage 120 includes a plurality of cage walls 124 that define a cavity 126. The cage walls 124 may be walls defined by solid sheets, perforated walls to allow airflow therethrough, or walls with cutouts, such as for a heat transfer device such as a heatsink, heat spreader, cold plate, and the like to pass therethrough. In the illustrated embodiment, the cage walls 124 are stamped and formed walls defining shielding walls. The cavity 126 may be subdivided by corresponding cage walls 124 to form a plurality of module channels 128 that are stacked (for example, stacked vertically) for receipt of corresponding plug modules 200 and receptacle modules 300. The cage walls 124 form rectangular shaped module channels 128 in an exemplary embodiment extending along a longitudinal axis between the front and the rear. In an exemplary embodiment, the cavity 126 is divided into greater than two stacked module channels 128 to house greater than two receptacle modules 300 and receive greater than two plug modules 200. For example, the receptacle cage 120 may include three stacked module channels 128, four stacked module channels 128, or more. In various embodiments, the cavity 126 may include additional module channels 128 side-by-side or ganged to further increase the amount of receptacle modules 300 held within the receptacle cage 120 (for example, 3 H×2 W, 3 H×3 W, 4 H×2 W, 4 H×4 W, and the like).
In an exemplary embodiment, the cage walls 124 of the receptacle cage 120 include a top wall 130, a bottom wall 132, a first side wall 134, and a second side wall 136 for each module channel 128. The walls 130, 132, 134, 136 are the outer or exterior walls. The bottom wall 132 may rest on the circuit board 106 when the circuit board 106 is provided. In various embodiments, the cage walls 124 may include a rear wall 138 extending along at least a portion of the rear o the receptacle cage 120. In an exemplary embodiment, the cage walls 124 include cage mounting tabs for mounting the receptacle cage 120 to the circuit board 106. For example, the cage mounting tabs may be press-fit pins configured to be press-fit into vias in the circuit board 106. Other types of cage mounting tabs may be used in alternative embodiments.
The receptacle cage 120 extends between a front end 140 and a rear end 142. Front ports 144 are provided at the front end 140 providing access to the corresponding module channels 128 for the plug modules 200. Rear ports 146 may be provided at the rear end 142 providing access to the corresponding module channels 128 for the receptacle modules 300. The rear ports 146 may pass through the rear wall 138. Alternatively, the rear ports 146 may be defined between the side walls 134, 136 rearward of the module channels 128 that do not include the rear wall 138. For example, the rear wall 138 may be located behind the lower module channel(s) 128 but not behind the upper module channel(s) 128.
Some of the cage walls 124 may be interior cage walls that separate or divide the cavity 126 into the various module channels 128. For example, the cage walls 124 may include a divider 148 separating the module channels 128 (for example, a horizontal divider or a vertical divider). The divider 148 may define the top wall, the bottom wall, the first side wall, or the second side wall of one or more of the module channels 128, but not an exterior wall. The divider 148 may be a single wall or a double wall with a gap between the walls forming a space for a heat sink, airflow, or light pipes.
In an exemplary embodiment, the receptacle cage 120 includes one or more EMI gaskets providing EMI shielding at the front end 140 and/or the rear end 142. The EMI gasket provides EMI shielding between the cage walls 124 and the plug modules 200. The EMI gaskets prevent EMI leakage along the cage walls 124 or along the modules 200, 300.
In an exemplary embodiment, the communication system 100 includes an electronic package 150 coupled to the circuit board 106. The electronic package 150 may be a chip, an integrated circuit, a processor, a memory module, or another electronic component. In various embodiments, the electronic package 150 is an ASIC. The electronic package 150 is coupled to an upper surface 152 of the circuit board 106 at a package mounting area 154. The package mounting area 154 is remote from a cage mounting area 156, which is the area that the receptacle cage 120 is mounted. The cage mounting area 156 may be located proximate to an edge (for example, front edge) of the circuit board 106, whereas the package mounting area 154 may be located in a center of the circuit board 106 or at another edge (for example, rear edge) of the circuit board 106. Optionally, the package mounting area 154 may be spaced apart from the cage mounting area 156 by a distance greater than a length of the package mounting area 154 and/or greater than a length of the cage mounting area 156. Other electrical components may be mounted in the space between the package mounting area 154 and the cage mounting area 156.
In an exemplary embodiment, the circuit board 106 includes a connection area 158 remote from the cage mounting area 156. The connection area 158 may be located between the package mounting area 154 and the cage mounting area 156, such as proximate to the package mounting area 154. The connection area 158 may be located closer to the package mounting area 154 in various embodiments. The receptacle modules 300 are configured to be connected to the circuit board 106 at the connection area 158. For example, the cables from the receptacle modules 300 may be terminated directly to the circuit board 106 at the connection area 158 (for example, soldered). In other embodiments, a connector may be provided at the end of the cables, which is coupled to the circuit board 106 or to a connector mounted to the circuit board 106.
The plug housing 210 includes a top wall 220, a bottom wall 222, a first side wall 224 extending between the top wall 220 and the bottom wall 222, and a second side wall 226 extending between the top wall 220 and the bottom wall 222. The plug housing 210 surrounds a plug module cavity 228. The plug module cavity 228 houses electrical components of the plug module 200. The cables 202 may extend into the plug module cavity 228 for termination to the electrical components.
In an exemplary embodiment, the plug module 200 includes a plug module circuit board 230 in the plug module cavity 228. The plug module circuit board 230 may be accessible at the mating end 216. The plug module circuit board 230 is configured to be communicatively coupled to the receptacle module 300 (shown in
The receptacle housing 310 includes a top wall 320, a bottom wall 322, a first side wall 324 extending between the top wall 320 and the bottom wall 322, and a second side wall 326 extending between the top wall 320 and the bottom wall 322. The receptacle housing 310 surrounds a receptacle module cavity 328. The receptacle module cavity 328 houses electrical components of the cable module 306. The cables 308 may extend into the receptacle module cavity 328 for termination to the electrical components.
In an exemplary embodiment, the cable module 306 includes a receptacle connector 330 coupled to the mating end 316 of the receptacle housing 310. The receptacle connector 330 may be at the end of the receptacle housing 310. In other embodiments, the receptacle connector 330 may be housed in the receptacle housing 310.
The receptacle connector 330 includes a receptacle connector housing 332 having a card slot 334 (
The receptacle housing 410 includes a top wall 420, a bottom wall 422, a first side wall 424 extending between the top wall 420 and the bottom wall 422, and a second side wall 426 extending between the top wall 420 and the bottom wall 422. The receptacle housing 410 surrounds a contact cavity 428. The contact cavity 428 houses electrical components of the board module 304, such as contact modules or individual contacts.
In an exemplary embodiment, the receptacle housing 410 includes a mating shroud 432 having a card slot 434 configured to receive the plug module circuit board 230 (shown in
In the illustrated embodiment, the communication system 100 includes three of the receptacle modules 300, including a first receptacle module 300a in the first module channel 128a for mating with a first plug module; a second receptacle module 300b in the second module channel 128b for mating with a second plug module; and a third receptacle module 300c in the third module channel 128c for mating with a third plug module. The first receptacle module 300a is considered an “inner” receptacle module because the first receptacle module 300a is closest to the circuit board 106, the third receptacle module 300c is considered an “outer” receptacle module because the third receptacle module 300c is furthest from the circuit board 106, and the second receptacle module 300b is considered a “central” receptacle module because the second receptacle module 300b is located between the inner and outer receptacle modules. In the illustrated embodiment, the first receptacle module 300a is a board module 304, the second receptacle module 300b is a cable module 306, and the third receptacle module 300c is a cable module 306.
The board module 304 is coupled to the upper surface 152 of the circuit board 106. In the illustrated embodiment, the board module 304 is a single-height board module 304 (for example, shown in
The cable modules 306 are received in the module channels 128b, 128c. The cables 308 extend from the cable modules 306 and extend exterior of the receptacle cage 120. The cables 308 are connected to the circuit board 106 at the connection areas 158. The cables 308 provide signal paths from the cable modules 306 to locations near the electronic package 150. The signal paths may be shielded along the lengths of the cables 308 to improve signal integrity. The cables 308 eliminate trace routing through portions of the circuit board 106, making trace routing from the receptacle mounting area 154 easier.
In the illustrated embodiment, the communication system 100 includes a lower receptacle cage 120b mounted to the lower surface of the circuit board 106. The lower receptacle cage 120b includes a single module channel in the illustrated embodiment. However, the lower receptacle cage 120b may include multiple module channels, such as two module channels, three module channels, four module channels, and the like.
In an exemplary embodiment, the communication system 100 has a high density for connection with the plug modules 200. For example, four plug modules 200 may be coupled to the receptacle modules 300 to electrically connect with the electronic package 150 (three above the circuit board 106 and one below the circuit board 106). By providing the tall receptacle cage 120, having more than two module channels 128, above the circuit board 106 provides a tall space above the electronic package 150 for a heat transfer device 160. For example, the circuit board 106 may be off-centered, such as closer to the bottom. The heat transfer device 160 may be a heat sink or cold plate in various embodiments. The triple high receptacle cage allows for a taller heat sink as compared to a communication system having a double height receptacle cage. For example, the heat transfer fins of the heat sink may be taller allowing for greater heat dissipation from the heat sink. As such, the heat transfer device 160 may have greater heat dissipation capacity for cooling the electronic package 150 or the heat transfer device may have a smaller footprint allowing for a greater number of electronic components or a smaller overall circuit board 106 to be used. In an exemplary embodiment, the heat transfer device 160 has a height 162 greater than a height of two module channels 128. For example, the bottom of the heat transfer device 160 may be located below a top of the first module channel 128a and the top of the heat transfer device 160 may be located above a top of the third module channel 128c.
In the illustrated embodiment, the board module 304 is a double-height board module 304 (for example, shown in
The cable modules 306 are received in the module channels 128c, 128d. The cables 308 extend from the cable modules 306 and extend exterior of the receptacle cage 120. The cables 308 are connected to the circuit board 106 at the connection areas 158.
In an exemplary embodiment, the communication system 100 has a high density for connection with the plug modules 200. For example, four plug modules 200 may be coupled to the receptacle modules 300 above the circuit board 106 to electrically connect with the electronic package 150. However, additional modules may be below the circuit board 106 in alternative embodiments). By providing the tall receptacle cage 120, having more than two module channels 128, above the circuit board 106 provides a tall space above the electronic package 150 for the heat transfer device 160. The quad-high receptacle cage allows for a taller heat sink as compared to a communication system having a double height receptacle cage or a triple height receptacle cage. The heat transfer fins of the heat sink may be taller allowing for greater heat dissipation from the heat sink. As such, the heat transfer device 160 may have greater heat dissipation capacity for cooling the electronic package 150 or the heat transfer device may have a smaller footprint allowing for a greater number of electronic components or a smaller overall circuit board 106 to be used.
It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. § 112(f), unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
