Reclamation system for additive manufacturing

Information

  • Patent Grant
  • 11958250
  • Patent Number
    11,958,250
  • Date Filed
    Friday, June 10, 2022
    2 years ago
  • Date Issued
    Tuesday, April 16, 2024
    8 months ago
Abstract
An additive manufacturing apparatus can include a stage configured to hold one or more cured layers of resin that form a component. A radiant energy device can be operable to generate and project radiant energy in a patterned image. An actuator can be configured to change a relative position of the stage relative to the radiant energy device. A reclamation system can be downstream of the stage and can be configured to remove at least a portion of the resin from a resin support. The reclamation system can include a first collection structure configured to accept a resin support therethrough along a resin support movement direction. A first scraper is positioned within the first collection structure. The first scraper has an elongation axis that is offset from the resin support movement direction by an offset angle that is less than 90 degrees.
Description
FIELD

The present subject matter relates generally to an additive manufacturing apparatus, and more particularly to a reclamation system for the additive manufacturing apparatus.


BACKGROUND

Additive manufacturing is a process in which material is built up layer-by-layer to form a component. Stereolithography (SLA) is a type of additive manufacturing process, which employs a tank of radiant-energy curable photopolymer “resin” and a curing energy source such as a laser. Similarly, Digital Light Processing (DLP) three-dimensional (3D) printing employs a two-dimensional image projector to build components one layer at a time. For each layer, the energy source draws or flashes a radiation image of the cross section of the component onto the surface of the resin. Exposure to the radiation cures and solidifies the pattern in the resin and joins it to a previously cured layer.


In some instances, additive manufacturing may be accomplished through a “tape casting” process. In this process, a resin is deposited onto a flexible resin support, such as a radiotransparent tape or foil, that is fed out from a supply reel to a build zone. Radiant energy is used to cure the resin to a component that is supported or held by a stage in the build zone. Once the curing of the first layer is complete, the stage and the resin support are separated from one another. The resin support is then advanced and fresh resin is provided to the build zone. In turn, the first layer of the cured resin is placed onto the fresh resin and cured through the energy device to form an additional layer of the component. Subsequent layers are added to each previous layer until the component is completed.


In operation, as each layer of the component is formed, various amounts of resin may be unused and retained on the resin support. Accordingly, it may be beneficial for the additive manufacturing apparatus to include a system that reclaims at least a portion of the unused resin.


BRIEF DESCRIPTION

Aspects and advantages of the present disclosure will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the present disclosure.


In some embodiments of the present disclosure, an additive manufacturing apparatus can include a stage configured to hold one or more cured layers of resin that form a component. A radiant energy device can be operable to generate and project radiant energy in a patterned image. An actuator can be configured to change a relative position of the stage relative to the radiant energy device. A reclamation system can be downstream of the stage and can be configured to remove at least a portion of the resin from a resin support. The reclamation system can include a first collection structure configured to accept a resin support therethrough along a resin support movement direction. A first scraper is positioned within the first collection structure. The first scraper has an elongation axis that is offset from the resin support movement direction by an offset angle that is less than 90 degrees.


In some embodiments of the present disclosure, a method of operating a reclamation system for use with an additive manufacturing apparatus is provided. The additive manufacturing apparatus is configured to cure a first portion of a resin to create a layer of a component. The method includes translating a resin support between a first plate and a second plate of a first collection structure at a first resin support translation speed. The method also includes removing a second portion of the resin from the resin support with a first scraper attached to the second plate as the resin support is translated between the first plate and the second plates.


In some embodiments of the present disclosure, a reclamation system for use with an additive manufacturing apparatus that includes a stage configured to support a component and a radiant energy device positioned opposite to the stage such that it is operable to generate and project radiant energy in a patterned image is provided. The reclamation system includes a first plate and a second plate separated from the first plate. A scraper is attached to the second plate. A resin support is configured to be compressed between the scraper and the first plate.


These and other features, aspects, and advantages of the present disclosure will become better understood with reference to the following description and appended claims. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.





BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure of the present disclosure, including the best mode thereof, directed to one of ordinary skill in the art, is set forth in the specification, which makes reference to the appended figures.



FIG. 1 is a schematic side view of an additive manufacturing apparatus in accordance with various aspects of the present disclosure;



FIG. 2 is a front perspective view of a take-up module of the additive manufacturing apparatus having a reclamation system therein in accordance with various aspects of the present disclosure;



FIG. 3 is a front perspective view of the reclamation system in accordance with various aspects of the present disclosure;



FIG. 3A is an enhanced view of area IIIA-IIIA of FIG. 3 in accordance with various aspects of the present disclosure;



FIG. 4A is a cross-sectional view of a standoff of the reclamation system in accordance with various aspects of the present disclosure;



FIG. 4B is a cross-sectional view of a standoff of the reclamation system in accordance with various aspects of the present disclosure;



FIG. 5 is a front perspective view of a reclamation system in accordance with various aspects of the present disclosure;



FIG. 6 is a top plan view of the reclamation system of FIG. 5 in accordance with various aspects of the present disclosure;



FIG. 7 is a front perspective view of a collection structure of the reclamation system in accordance with various aspects of the present disclosure;



FIG. 8 is a front perspective view of a first plate of the collection structure in accordance with various aspects of the present disclosure;



FIG. 9 is a rear perspective view of a second plate of the collection stricture in accordance with various aspects of the present disclosure;



FIG. 10 is a method of operating the manufacturing apparatus in accordance with various aspects of the present disclosure; and



FIG. 11 depicts an exemplary computing system for an additive manufacturing apparatus in accordance with various aspects of the present disclosure.





Repeat use of reference characters in the present specification and drawings is intended to represent the same or analogous features or elements of the present disclosure.


DETAILED DESCRIPTION

Reference will now be made in detail to present embodiments of the present disclosure, one or more examples of which are illustrated in the accompanying drawings. The detailed description uses numerical and letter designations to refer to features in the drawings. Like or similar designations in the drawings and description have been used to refer to like or similar parts of the present disclosure.


As used herein, the terms “first,” “second,” and “third” may be used interchangeably to distinguish one component from another and are not intended to signify a location or importance of the individual components. The terms “coupled,” “fixed,” “attached to,” and the like refer to both direct coupling, fixing, or attaching, as well as indirect coupling, fixing, or attaching through one or more intermediate components or features, unless otherwise specified herein. The terms “upstream” and “downstream” refer to the relative direction with respect to a flexible resin support, such as a radiotransparent tape or foil, movement along the manufacturing apparatus. For example, “upstream” refers to the direction from which the resin support moves, and “downstream” refers to the direction to which the resin support moves. The term “selectively” refers to a component's ability to operate in various states (e.g., an ON state and an OFF state) based on manual and/or automatic control of the component.


The singular forms “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise.


Approximating language, as used herein throughout the specification and claims, is applied to modify any quantitative representation that could permissibly vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about,” “approximately,” “generally,” and “substantially,” is not to be limited to the precise value specified. In at least some instances, the approximating language may correspond to the precision of an instrument for measuring the value, or the precision of the methods or apparatus for constructing or manufacturing the components and/or systems. For example, the approximating language may refer to being within a ten percent margin.


Moreover, the technology of the present application will be described in relation to exemplary embodiments. The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments. Additionally, unless specifically identified otherwise, all embodiments described herein should be considered exemplary.


Here and throughout the specification and claims, range limitations are combined and interchanged, such ranges are identified and include all the sub-ranges contained therein unless context or language indicates otherwise. For example, all ranges disclosed herein are inclusive of the endpoints, and the endpoints are independently combinable with each other.


As used herein, the term “and/or,” when used in a list of two or more items, means that any one of the listed items can be employed by itself, or any combination of two or more of the listed items can be employed. For example, if a composition or assembly is described as containing components A, B, and/or C, the composition or assembly can contain A alone; B alone; C alone; A and B in combination; A and C in combination; B and C in combination; or A, B, and C in combination.


The present disclosure is generally directed to an additive manufacturing apparatus that implements various manufacturing processes such that successive layers of material(s) (e.g., resins) are provided on each other to “build-up,” layer-by-layer, a three-dimensional component. The successive layers generally cure together to form a monolithic component which may have a variety of integral sub-components. Although additive manufacturing technology is described herein as enabling the fabrication of complex objects by building objects point-by-point, layer-by-layer, variations of the described additive manufacturing apparatus and technology are possible and within the scope of the present subject matter.


The additive manufacturing apparatus can include a support plate, a window supported by the support plate, and a stage moveable relative to the window. The additive manufacturing apparatus further includes a flexible resin support, such as a radiotransparent tape or foil, that supports a resin. The resin support, with the resin thereon, is positioned between the stage and the support plate. A radiant energy device is configured to cure a portion of the resin forming the component, which is translated towards and away from the resin support by stage between successive curing operations.


In operation, as each layer of the component is formed, various amounts of resin may be unused and retained on the resin support after the resin support exits a build zone of the apparatus. In some instances, a reclamation system may be used to reclaim at least a portion of the unused resin. For example, the reclamation system may be used to remove a portion of the resin downstream of the stage.


In various examples, the reclamation system may include a collection structure that includes a scraper that is configured to contact the resin support and direct the resin to a channel. The channel may define a drain that then directs the resin from the channel to a reservoir. In some instances, the scraper may be implemented as a wiper that extends in a non-perpendicular direction relative to a resin support movement direction. The non-perpendicular direction may distribute the amount of force on the resin support to a larger area when the wiper is in contact with the resin support and/or alter an interaction between the resin support and the wiper when compared to embodiments in which the scraper extends in a perpendicular direction relative to a resin support movement direction.


In various examples, the collection structure may be “inline,” meaning that the scraper contacts downstream of a material depositor with a common resin support to that which is translated through one or more build zones. Additionally or alternatively, the collection structure may be “remote” meaning that the resin support is wound about a take-up mandrel, removed from the take-up mandrel, and positioned on a first reclamation mandrel. The resin support may then be directed through the collection structure and wrapped about a second reclamation mandrel. In such instances, the resin may contact two opposing sides of the resin support. As such, the scraper may include a first wiper on a first side of the resin support and a second wiper on a second side of the resin support. The collection structure provided herein may be capable of reclaiming at least a portion of the unused resin. By reclaiming the resin, the cost of operation of the apparatus may be reduced.


Referring to the drawings wherein identical reference numerals denote the similar elements throughout the various views, FIG. 1 schematically illustrates an example of one type of suitable apparatus 10 for forming a component 12 created through one or more cured layers 14 of resin. The apparatus 10 can include one or more of a support plate 16, a window 18, a stage 20 that is movable relative to the window 18, and a radiant energy device 22, which, in combination, may be used to form any number (e.g., one or more) of additively manufactured components 12.


In the illustrated example, the apparatus 10 includes a feed module 24, which may include a first mandrel 24A, and a take-up module 26, which may include a second mandrel 26A, that are spaced-apart and configured to couple with respective end portions of a flexible resin support 28, such as a radiotransparent tape, foil, or another type of resin support, extending therebetween. A first portion 30 (e.g., unused) of the resin support 28 may be supported by the first mandrel 24A, an intermediate portion 32 of the resin support 28 can be supported from underneath by the support plate 16, and a second portion 34 of the resin support 28 (e.g., used) may be supported by the second mandrel 26A. Suitable mechanical supports (frames, brackets, etc.) may be provided for the mandrels 24A, 26A and the support plate 16. The first mandrel 24A and/or the second mandrel 26A can be configured to control the resin support translation speed and direction of the resin support 28 such that the desired tension and speed is maintained in the resin support 28 through a drive system 36. By way of example and not limitation, the drive system 36 can be configured as one or more control devices 38, 40 associated with the first mandrel 24A and/or the second mandrel 26A. Moreover, the drive system 36 may include various components, such as motors, actuators, feedback sensors, and/or controls can be provided for driving the mandrels 24A, 26A in such a manner so as to move at least a portion of the resin support 28 between the mandrels 24A.


In various embodiments, the window 18 is transparent and can be operably supported by the support plate 16. Further, the window 18 and the support plate 16 can be integrally formed such that one or more windows 18 are integrated within the support plate 16. Likewise, the resin support 28 is also transparent or includes portions that are transparent. As used herein, the terms “transparent” and “radiotransparent” refer to a material that allows at least a portion of radiant energy of a selected wavelength to pass through. For example, the radiant energy that passes through the window 18 and the resin support 28 can be in the ultraviolet spectrum, the infrared spectrum, the visible spectrum, or any other practicable radiant energy. Non-limiting examples of transparent materials include polymers, glass, and crystalline minerals, such as sapphire or quartz.


The resin support 28 extends between the feed module 24 and the take-up module 26 and defines a “resin surface” 42, which is shown as being planar, but could alternatively be arcuate (depending on the shape of the support plate 16). In some instances, the resin surface 42 may be defined by a first side 44 of the resin support 28 that can be positioned to face the stage 20 with the window 18 on an opposing side of the resin support 28 from the stage 20. A second side 46 of the resin support 28 may be defined as a side that the resin support 28 that is opposite the stage 20. For purposes of convenient description, the resin surface 42 may be considered to be oriented parallel to an X-Y plane of the apparatus 10, and a direction perpendicular to the X-Y plane is denoted as a Z-axis direction (X, Y, and Z being three mutually perpendicular directions). As used herein, the X-axis refers to the machine direction along the length of the resin support 28. As used herein, the Y-axis refers to the transverse direction across the width of the resin support 28 and generally perpendicular to the machine direction. As used herein, the Z-axis refers to the stage 20 direction that can be defined as the direction of movement of the stage 20 relative to the window 18.


The resin surface 42 may be configured to be “non-stick,” that is, resistant to adhesion of a cured resin R. The non-stick properties may be embodied by a combination of variables such as the chemistry of the resin support 28, its surface finish, and/or applied coatings. For instance, a permanent or semi-permanent non-stick coating may be applied. One non-limiting example of a suitable coating is polytetrafluoroethylene (“PTFE”). In some examples, all or a portion of the resin surface 42 may incorporate a controlled roughness or surface texture (e.g. protrusions, dimples, grooves, ridges, etc.) with nonstick properties. Additionally or alternatively, the resin support 28 may be made in whole or in part from an oxygen-permeable material.


For reference purposes, an area or volume immediately surrounding the location of the resin support 28 and the window 18 or transparent portion defined by the support plate 16 may be defined as a “build zone,” labeled 48.


In some instances, a material depositor 50 may be positioned along the resin support 28. The material depositor 50 may be any device or combination of devices that is operable to apply a layer of the resin R on the resin support 28. The material depositor 50 may optionally include a device or combination of devices to define a height of the resin R on the resin support 28 and/or to level the resin R on the resin support 28. Nonlimiting examples of suitable material deposition devices include chutes, rollers, hoppers, pumps, spray nozzles, spray bars, or printheads (e.g. inkjets). In some examples, a doctor blade may be used to control the thickness of resin R applied to the resin support 28, as the resin support 28 passes the material depositor 50.


In some embodiments, a reclamation system 52 may be configured to remove at least a portion of resin R that remains on the resin support 28 after the resin support 28 is downstream from a build zone 48. As will be described in greater detail below, the reclamation system 52 may include a collection structure 88 and a reservoir 114 for collecting the resin R that is removed from the resin support 28. In various examples, the reclamation system 52 may be inline such that the collection structure 88 contacts a portion of the resin support 28 while another portion of the resin support also is positioned between one or more build zones 48. Additionally or alternatively, the reclamation system 52 may be remote such that the resin support 28 is wound about the take-up mandrel 26A, removed from the take-up mandrel 26A, and positioned within the reclamation system 52 external from the apparatus 10. The resin support 28 may then be directed along the collection structure 88 within the reclamation system 52.


The resin R includes any radiant-energy curable material, which is capable of adhering or binding together the filler (if used) in the cured state. As used herein, the term “radiant-energy curable” refers to any material which solidifies or partially solidifies in response to the application of radiant energy of a particular frequency and energy level. For example, the resin R may include a photopolymer resin containing photo-initiator compounds functioning to trigger a polymerization reaction, causing the resin R to change from a liquid (or powdered) state to a solid state. Alternatively, the resin R may include a material that contains a solvent that may be evaporated out by the application of radiant energy. The resin R may be provided in solid (e.g. granular) or liquid form, including a paste or slurry.


Furthermore, the resin R can have a relatively high viscosity fluid that will not “slump” or run off during the build process. The composition of the resin R may be selected as desired to suit a particular application. Mixtures of different compositions may be used. The resin R may be selected to have the ability to out-gas or burn off during further processing, such as a sintering process.


The resin R may incorporate a filler. The filler may be pre-mixed with the resin R, then loaded into the material depositor 50. Alternatively, the filler may be mixed with the resin R on the apparatus 10. The filler includes particles, which are conventionally defined as “a small bit of matter.” The filler may include any material that is chemically and physically compatible with the selected resin R. The particles may be regular or irregular in shape, may be uniform or non-uniform in size, and may have variable aspect ratios. For example, the particles may take the form of powder, of small spheres or granules, or may be shaped like small rods or fibers.


The composition of the filler, including its chemistry and microstructure, may be selected as desired to suit a particular application. For example, the filler may be metallic, ceramic, polymeric, and/or organic. Other examples of potential fillers include diamond, silicon, and graphite. Mixtures of different compositions may be used. In some examples, the filler composition may be selected for its electrical or electromagnetic properties, e.g. it may specifically be an electrical insulator, a dielectric material, an electrical conductor, and/or magnetic.


The filler may be “fusible,” meaning it is capable of consolidation into a mass upon via application of sufficient energy. For example, fusibility is a characteristic of many available powders including, but not limited to, polymeric, ceramic, glass, and/or metallic materials. The proportion of filler to resin R may be selected to suit a particular application. Generally, any amount of filler may be used so long as the combined material is capable of flowing and being leveled, and there is sufficient resin R to hold together the particles of the filler in the cured state.


With further reference to FIG. 1, the stage 20 is capable of being oriented parallel to the resin surface 42 or the X-Y plane. Various devices may be provided for moving the stage 20 relative to the window 18 parallel to the Z-axis direction. For example, as illustrated in FIG. 1, the movement may be provided through an actuator 54 connected between the stage 20 and a static support 56 and configured to change a relative position of the stage 20 relative to the radiant energy device 22, the support plate 16, the window 18, and/or any other static component of the apparatus 10. The actuator 54 may be configured as a ballscrew electric actuator, linear electric actuator, pneumatic cylinder, hydraulic cylinder, delta drive, or any other practicable device may additionally or alternatively be used for this purpose. In addition to, or as an alternative to, making the stage 20 movable, the resin support 28 could be movable parallel to the Z-axis direction.


The radiant energy device 22 may be configured as any device or combination of devices operable to generate and project radiant energy on the resin R in a suitable pattern and with a suitable energy level and other operating characteristics to cure the resin R during the build process. For example, as shown in FIG. 1, the radiant energy device 22 may include a projector 58, which may generally refer to any device operable to generate a radiant energy patterned image of suitable energy level and other operating characteristics to cure the resin R. As used herein, the term “patterned image” refers to a projection of radiant energy comprising an array of one or more individual pixels. Non-limiting examples of patterned imaged devices include a DLP projector or another digital micromirror device, a two-dimensional array of LEDs, a two-dimensional array of lasers, and/or optically addressed light valves. In the illustrated example, the projector 58 includes a radiant energy source 60 such as a UV lamp, an image forming apparatus 62 operable to receive a source beam 64 from the radiant energy source 60 and generate a patterned image 66 to be projected onto the surface of the resin R, and optionally focusing optics 68, such as one or more lenses.


The image forming apparatus 62 may include one or more mirrors, prisms, and/or lenses and is provided with suitable actuators, and arranged so that the source beam 64 from the radiant energy source 60 can be transformed into a pixelated image in an X-Y plane coincident with the surface of the resin R. In the illustrated example, the image forming apparatus 62 may be a digital micro-mirror device.


The projector 58 may incorporate additional components, such as actuators, mirrors, etc. configured to selectively move the image forming apparatus 62 or another part of the projector 58 with the effect of rastering or shifting the location of the patterned image on the resin surface 42. Stated another way, the patterned image may be moved away from a nominal or starting location.


In addition to other types of radiant energy devices 22, the radiant energy device 22 may include a “scanned beam apparatus” used herein to refer generally to any device operable to generate a radiant energy beam of suitable energy level and other operating characteristics to cure the resin R and to scan the beam over the surface of the resin R in a desired pattern. For example, the scanned beam apparatus can include a radiant energy source 60 and a beam steering apparatus. The radiant energy source 60 may include any device operable to generate a beam of suitable power and other operating characteristics to cure the resin R. Non-limiting examples of suitable radiant energy sources include lasers or electron beam guns.


The apparatus 10 may be operably coupled with a computing system 70. The computing system 70 in FIG. 1 is a generalized representation of the hardware and software that may be implemented to control the operation of the apparatus 10, including some or all of the stage 20, the radiant energy device 22, the actuator 54, and the various parts of the apparatus 10 described herein. The computing system 70 may be embodied, for example, by software running on one or more processors embodied in one or more devices such as a programmable logic controller (“PLC”) or a microcomputer. Such processors may be coupled to process sensors and operating components, for example, through wired or wireless connections. The same processor or processors may be used to retrieve and analyze sensor data, for statistical analysis, and for feedback control. Numerous aspects of the apparatus 10 may be subject to closed-loop control.


Optionally, the components of the apparatus 10 may be surrounded by a housing 72, which may be used to provide a shielding or inert gas (e.g., a “process gas”) atmosphere using gas ports 74. Optionally, pressure within the housing 72 could be maintained at a desired level greater than or less than atmospheric. Optionally, the housing 72 could be temperature and/or humidity controlled. Optionally, ventilation of the housing 72 could be controlled based on factors such as a time interval, temperature, humidity, and/or chemical species concentration. In some embodiments, the housing 72 can be maintained at a pressure that is different than an atmospheric pressure.


Referring to FIGS. 2 and 3, exemplary perspective views of the take-up module 26 are illustrated in accordance with exemplary embodiments of the present disclosure. As illustrated, the take-up module 26 may include a take-up plate 80 that supports second mandrel 26A and may support the second portion 34 of the resin support 28. In various embodiments, one or more rollers 82 may also be anchored to the take-up plate 80. For example, a set of three rollers 82A, 82B, 82C may be positioned on various portions of the take-up plate 80. In some instances, each roller 82A, 82B, 82C may have an axis of rotation 84 that is generally parallel to an axis of rotation 86 of the second mandrel 26A. In operation, the resin support 28 may generally follow a resin support path illustrated by line 76. Accordingly, as the resin support 28 is translated, the resin support 28 may move along the first roller, then the second roller, the third roller, and towards a rolled portion of the resin support 28 that is wrapped about the second mandrel 26A.


The resin reclamation system 52 may be positioned anywhere along the resin support path downstream of at least one build zone 48 and may be configured to remove at least a portion of resin R that remains on the resin support 28 after the resin support 28 is removed from the build zone 48. In some examples, the reclamation system 52 may include a collection structure 88 that is configured to contact the resin support 28 and direct the resin R to a channel 90. For example, the collection structure 88 may include a base support 92 and a first plate 94 extending from the base support 92. In some instances the collection structure 88 may be integrally formed with and/or attached to the take-up plate 80 via fixed, pivoting, or floating connections. In some instances, the first plate 94 may be generally perpendicular to the base support 92. One or more braces 96 may extend between the first plate 94 and the base support 92. In some instances, the base support 92 and the first plate 94 may be integrally formed with one another or attached to one another through any practicable attachment fixture. Moreover, the braces 96 may be integrally formed with the first plate 94 and/or the base support 92 or later attached thereto. Moreover, the first plate 94 along with attached or integral braces 96 may be integrally formed with or anchored to the take-up plate 80.


A second plate 98 may be held in a separated manner from the first plate 94 by one or more standoffs 100. The standoffs 100 may be configured to maintain a predefined distance d between the first and second plates 94, 98 and may be positioned to accept the resin support 28 between the standoffs 100. In various examples, the standoffs 100 may be hard fixed spacers and/or compliant standoffs such as screws, springs, elastomeric material, and/or pneumatically or otherwise adjustable actuators. These actuators can be controlled via on board sensors detecting tension and/or pressure on the resin support to automatically adjust scraper contact.


In various examples, the collection structure 88 may include a scraper 102 that is configured to contact the resin support 28 and direct the resin R to the channel 90. In various examples, the scraper 102 may be capable of contacting the resin support 28 and/or the resin R provided on the resin support 28. In some instances, the resin support 28 is configured to be compressed between the scraper 102 and the first plate 94. Through contact with the resin support 28 and/or the resin R, the resin R may be separated from the resin support 28 and directed to the channel 90. In some instances, the scraper 102 may be configured as a wiper assembly, a blade assembly, and/or any other removal assembly, which may at least partially be formed from an elastomeric material, a polymeric material, a metallic material, a combination thereof, and/or any other material. In some instances, the scraper 102 may be configured to remove at least 40%, at least 50%, at least 60%, at least 70%, at least 80%, or at least 90% of the remaining resin R as the resin support 28 is between the first plate 94 and the second plate 98.


As illustrated in FIGS. 3 and 3A, in various embodiments, the scraper 102 may be fixed to the second plate 98 through one or more fasteners 104 and/or be integral to the second plate 98. In addition, the one or more fasteners 104 may be configured to maintain the scraper 102 at an offset angle θ that is defined between a resin support movement direction fmd and the elongation axis es of the scraper 102. In some examples, the offset angle θ may be greater than 0 degrees and less than 90 degrees. For instance, the offset angle θ may be between 10 and 80 degrees, 20 and 70 degrees, 30 and 60 degrees, 40 and 50 degrees, 40 and 45 degrees, and/or any other practicable angle. In other instances, the scraper 102 may be a series of scrapers arranged in a linear, mirrored, and/or chevron pattern at any practicable angle to direct resin R to either side of the resin support into separate or one collection channel 90. As the resin R is separated from the resin support 28, the resin R may run along the scraper 102 to a position outward of the first edge portion 106 and/or the second edge portion 108 of the resin support 28 and towards the channel 90.


Referring back to FIGS. 2 and 3, in some instances, the first plate 94 may define a groove 116 (or any other structure) to route the resin R from a position proximate to an end portion of the scraper 102 to the channel 90. In some examples, the groove 116 may have a first width proximate to a top portion thereof and a second width proximate to the bottom portion or more proximate to the channel 90. In several examples, the second width may be less than the first width.


The channel 90 may include any structure that may maintain and/or direct the resin R to a specified location. For example, the channel 90 may maintain the resin R therein while directing the resin R from the channel 90 through a drain 110. A resin conduit 112 may be operably coupled with the drain 110 and direct the resin R to a reservoir 114. In some examples, the reservoir 114 may be positioned below the first plate 94 in the Z-axis direction. Further, the reservoir 114 may be separated from the first plate 94 in the Z-axis direction.


In various embodiments, the channel 90 may include a forward surface 118, a rearward surface 120, a first end surface 122, a second end surface 124, and a bottom surface 126. The rearward surface 120 may be positioned under a portion of at least one of the first and second plates 94, 98 in the Z-axis direction. The terms used herein to describe the various surfaces of the channel 90 are for reference to the illustrated embodiment. It will be appreciated that any of the surfaces described may be oriented in any manner without departing from the teachings provided herein.


The rearward surface 120 may have a first height h1. The first end surface 122 may be positioned proximate to one end portion of the rearward surface 120 and may have a second height h2. In various embodiments, the first end surface 122 may extend beyond the first plate 94 and/or the second plate 98 in the X-axis direction and below the first plate 94 and/or the second plate 98 in the Z-axis direction.


The forward surface 118 may include a first segment 128 at least partially on a first side of the scraper 102 in the X-axis direction and a second segment 130 at least partially on a second side of the scraper 102 in the X-axis direction. The first segment 128 may have a third height h3. In some instances, the third height h3 may be generally equal to the first height h1 and/or the second height h2. The second segment 130 may have a fourth height h4 that may be greater than at least one of the first height h1, the second height h2, and/or the third height h3. In some instances, the fourth height h4 may extend from the bottom surface 126 to a position above at least a portion of the scraper 102 in the Z-axis direction.


The second end surface 124 may be positioned on an opposing side of the forward surface 118 and the rearward surface 120 from the first end surface 122. Moreover, the second end surface 124 may be positioned on an opposing side of the first plate 94 from the first end surface 122 in an X-axis direction. In various embodiments, the second end surface 124 may have a fifth height fourth height h5 that may be generally equal to the fourth height fourth height h4. The second surface may extend along at least a portion of the first plate 94 and/or be attached to the first plate 94. As such, the channel 90 may be supported on or integral to the first plate 94 and/or the second plate 98.


Referring to FIGS. 4A and 4B, various cross-sectional views of exemplary standoffs 100 are illustrated in accordance with exemplary embodiments of the present disclosure. For instance, as illustrated in FIG. 4A, the standoff 100 can include a boss 134, a fastener 136, and a spring 138. The fastener 136 can include a head 140 adapted to receive a driver, a shank 142 adapted to pass through the second plate 98, and a threaded portion 144 at the end of the shank 142 opposite the head 140. The threaded portion 144 of the fastener 136 is configured to secure the fastener 136 in a preformed aperture 146 formed the boss 134, which may be integrally formed with or attached to the first plate 94.


In some embodiments, the fastener 136 may be positioned repeatedly relative to the boss 134 by virtue of a collar 148 formed on the shank 142 of the fastener 136. The collar 148 limits the depth of penetration of the fastener 136 into the aperture. Alternatively, the threaded portion 144 of the fastener 136 can be fastened into a preformed, threaded aperture of the boss 134. By coming into contact with the threads of threaded aperture, the fastener 136 is being rotationally driven into the boss 134.


In some examples, the spring 138 may be positioned between the head 140 of the fastener 136 and the second plate 98. The spring 138 may be configured to absorb vibrations and/or allow for a minimal amount of movement of the second plate 98 relative to the first plate 94. By allowing for a small amount of movement, the scraper 102 may also move slightly relative to the first plate 94. The movement may also allow for a defined amount of tension to be placed on the resin support 28 by the scraper 102 based on the tension of the spring 138.


In the example illustrated in FIG. 4B, in various embodiments, the standoff 100 can include an actuator 186. The actuator 186 can be operably coupled with the first plate 94 and the second plate 98. Further, the actuator 186 may be configured to adjust and define a gap between the first plate 94 and the second plate 94.


In various examples, the actuator 186 can include a slide 188 movingly linked to a base 190. A control signal can be utilized to controllably connect the actuator 186 with the computing system 70. Accordingly, the gap can be adjusted by a control action such as movement of the slide 188 in response to signals from the computing system 70. In various embodiments, suitable control signals can be electrical, pneumatic, sonic, electromagnetic, a combination thereof, and/or any other type of signal.


In some examples, the spring 138 may be positioned between a head 192 of the slide 188 and the second plate 98. The spring 138 may be configured to absorb vibrations and/or allow for a minimal amount of movement of the second plate 98 relative to the first plate 94. By allowing for a small amount of movement, the scraper 102 may also move slightly relative to the first plate 94. The movement may also allow for a defined amount of tension to be placed on the resin support 28 by the scraper 102 based on the tension of the spring 138. It will be appreciated that the standoff 100 may be any other adjustable structure capable of adjusting and defining the gap between the first plate 94 and the second plate 98 without departing from the scope of the present disclosure.


Referring now to FIGS. 5 and 6, an exemplary perspective view and an exemplary top plan view of the remote reclamation system 52 are illustrated in accordance with various embodiments of the present disclosure. The remote reclamation system 52 may be used in conjunction with and/or in lieu of the inline reclamation system 52. In some examples, a first portion of the resin R may be separated from the resin support 28 by the inline reclamation system 52 and a second portion of the resin R may be separated from the resin support 28 by the remote reclamation system 52. In several embodiments, the resin support 28 may be translated through the first reclamation at a first translational speed, and the resin support 28 may be translated through the second reclamation system 52 at a second translational speed with the second translational speed being different from the first translational speed. The inline and/or the remote reclamation systems 52 provided herein may include any of the components described herein without departing from the teachings provided herein. By passing the resin support 28 through both a first reclamation system 52 (e.g., an inline reclamation system) and a second recommendation system 52 (e.g., a remote reclamation system), additional resin R may be removed from the resin support 28. In some instances, the second translational speed may be slower than the first translation speed to allow for harder to remove resin/slurry to be removed from the resin support 28 by the second reclamation system 52. Additionally or alternatively, the second reclamation system 52 may apply a varied amount of force from that applied by the first reclamation system 52. For example, the second reclamation system 52 may apply more force than the first reclamation system 52.


In some instances, the first reclamation system 52 may include a first type of scraper 102, which may be positioned at a first offset angle θ that is defined between a resin support movement direction fmd and the elongation axis es of the scraper 102. The second reclamation system 52 may include a second scraper 102 (that may have a different construction from the first scraper), which may be positioned at a second offset angle θ, to remove the residual resin R on the resin support 28 after the resin support 28 passes through the first reclamation system 52.


As illustrated in FIGS. 5 and 6, the second portion 34 (FIG. 3) of the resin support 28 may be wrapped about the second mandrel 26A to form a recovered segment 150 that may be transported to the remote reclamation system 52. In various embodiments, a first portion of the resin R originally deposited by the material depositor 50 may be cured to form a portion of the component 12, a second portion of the resin R may be removed by the first reclamation system 52, and a third portion of the resin R may remain on the resin support 28 thereby forming the recovered segment 150. Since the third portion of resin R may be rolled into the recovered segment, in some instances, the recovered segment 150 of resin support 28 may have resin Ron both the first side 44 of the resin support 28 and the second side 46 of the resin support 28. The transportation may be accomplished with or without operator interaction. As the resin R was rolled with the resin support 28, the resin R may be attached to either the first side 44 of the resin support 28 and/or the second side 46 of the resin support 28. As such, in some examples, the collection structure 88 may include a first scraper 102A on a first plate 94 and a second scraper 102B on a second plate 98 with the resin support 28 positioned between the first and second scrapers 102A, 102B.


In some embodiments, the recovered segment 150 of the resin support 28 may be positioned on a first reclamation mandrel 154. The resin support 28 may be directed through the collection structure 88 and wrapped about a second reclamation mandrel 156. A cleaned segment 152 of the resin support 28 may be disposed about the second mandrel 156. As used herein, the “cleaned segment” of the resin support 28 is a portion of the resin support 28 that may have less resin R attached thereto than the recovered segment 150, which may occur by translating the resin support 28 through the collection structure 88.


The first mandrel 154 and/or the second mandrel 156 can be configured to control the resin support 28 translation speed and direction of the resin support 28 such that the desired tension and resin support translation speed is maintained in the resin support 28 through a drive assembly 158. By way of example and not limitation, the drive assembly 158 can be configured as one or more control devices 160, 162 associated with the first mandrel 154 and/or the second mandrel 156. Moreover, the control devices 160, 162 may include various components, such as motors, actuators, feedback sensors, and/or controls can be provided for driving the mandrels 154, 156 in such a manner so as to maintain the resin support 28 tensioned between the mandrels 154, 156 and to wind the resin support 28 from the first mandrel 154 to the second mandrel 156. Further, in various embodiments, the control devices 160, 162 may include a transmission in the form of a belt system, a gear system, and/or any other practicable system.


As illustrated, the recovered segment 150 and the cleaned segment 152 may be positioned on a support structure 164. A frame 166 can extend between the recovered segment 150 and the cleaned segment 152 of the resin support 28 and supports the collection structure 88. In some embodiments, the frame 166 may be supported by the support structure 164. The support structure 164 may further define an opening 168 therethrough which may be at least partially aligned with the collection structure 88 in the X-axis and/or the Y-axis directions. A reservoir 114 may be positioned on an opposite side of the opening 168 from the collection structure 88 that may be at least partially aligned with the collection structure 88 in the X-axis and/or the Y-axis directions. As the resin support 28 is translated from the first mandrel 154 to the second mandrel 156, the resin support 28 passes through the collection structure 88 thereby separating at least a portion of the resin R from the resin support 28. The resin R may then fall and/or be otherwise directed into the reservoir 114 positioned below the collection structure 88.


The reclamation system 52 may further include a sensor system 170 that may be able to detect one or more conditions of the reclamation system 52. For example, the sensor system 170 may include a sensor 172 for detecting a distance between the resin support 28 and the sensor 172. Based on the distance, the computing system 70 may compute the amount of the resin support 28 positioned about each of the mandrels. Additionally or alternatively, the sensor system 170 may include a sensor 172 for detecting the resin R on the resin support 28. In some instances, once the sensor 172 determines that a predefined length of resin support 28 has been translated from the recovered segment 150 to the cleaned segment 152, the drive assembly 158 may be reversed and the resin support 28 wrapped about the second mandrel 156 may be translated to a position about the first mandrel 154. As the resin support 28 is translated, the resin support 28 is again translated through the collection structure 88 to further remove resin R disposed on the resin support 28.


With reference to FIGS. 5-9, in various embodiments, the collection structure 88 can include a bracket 176 that can include one or more beams 178. For example, the first and second plates 94, 98 may each be operably coupled with a first beam 178 on a top portion thereof and a second beam 178 on a bottom portion thereof. The first beam 178 and/or the second beam 178 may be operably coupled with a pivot member 180. The pivot member 180 may slidably engage the frame 166 or any other structure.


In some embodiments, the first plate 94 and/or the second plate 98 may include a brace 184 fixed to an outer portion thereof. The brace 184 may be configured to prevent outward bending of the first plate 94 and/or the second plate 98.


With further reference to FIGS. 6-9, in various embodiments, the first scraper 102A may include a pair of removal assemblies that are spaced apart from one another. Likewise, the second scraper 102B may include a pair of removal assemblies that are spaced apart from one another. As provided herein, each removal assembly may be configured as a wiper assembly, a blade assembly, and/or any other removal assembly, which may at least partially be formed from an elastomeric material, a polymeric material, a metallic material, a combination thereof, and/or any other material.


Now that the construction and configuration of the additive manufacturing apparatus having one or more accumulators have been described according to various examples of the present subject matter, various method 200 for operating an additive manufacturing apparatus are provided. The method 200 can be used to operate the additive manufacturing apparatus and the one or more reclamation systems (e.g., an inline reclamation system and/or a remote reclamation system), or any other suitable additive manufacturing apparatus having any type and configuration of positioning assembly. It should be appreciated that the example method 200 is discussed herein only to describe example aspects of the present subject matter and is not intended to be limiting.


Referring now to FIG. 10, the method 200 may include, at step 202, depositing a layer of resin onto a resin support. As provided herein, a material depositor may be positioned along the resin support and is operable to apply a layer of resin R over the resin support. At step 204, the method includes translating the resin support having the resin deposited thereon to a position within a build zone.


At step 206, the method can include moving the stage to contact the resin on a first side of the resin support, and, at step 208, the method includes curing at least a portion of the uncured layer of resin to create a newly cured layer of the component through the use of a radiant energy device.


At step 210, the method can include translating the resin support through a first collection structure of a reclamation system at a first resin support translation speed measured by a resin support translation speed as the resin support passes the scraper. The collection structure may support one or more scrapers that may be configured to remove at least a first portion of the resin that remains on the resin support after the resin support has been translated out of the build zone. In various embodiments, an offset angle θ defined between an elongation axis of the scraper and the movement direction of the resin support may be greater than 0 degrees and less than or equal to 90 degrees.


In various embodiments, the scraper may include first and second plates that are separated by an initial distance that is defined by a standoff. In various embodiments, the resin support can be translated between at least first and second standoffs.


In some instances, the standoff may include a boss, a fastener, and a spring positioned about a portion of the fastener and/or an actuator. As the resin support is translated through the collection structure of the reclamation system, the distance between the first plate and the second plate may be varied with the spring providing a predefined amount of resistance for returning the second plate to the initial distance from the first plate.


Once removed by the scraper, at step 212, the method includes directing the resin along the scraper to a position outwardly of the resin support and into a channel. The channel may define a drain. At step 214, the method includes directing the resin from the collection structure to a remote reservoir, which may be accomplished through gravity assistance. The remote reservoir is separated from the channel and may be fluidly coupled with the reservoir through a resin conduit. From the reservoir, the resin may be refreshed for reuse and/or recertification and returned to a material depositor. Additionally or alternatively, the resin retained within the reservoir may be removed from the apparatus as waste.


In some instances, the method, at step 216, can include translating the resin support through a second collection structure of the reclamation system at a second resin support translation speed measured by a resin support translation speed as the resin support passes the first scraper and/or the second scraper. In various embodiments, the first resin support translation speed may be less than or greater than the first resin support translation speed. Alternatively, the first resin support translation speed may be generally equal to the second resin support translation speed.


The second reclamation system may be remote such that the resin support is removed from a second mandrel within a take-up module and transferred to a mandrel of the remote reclamation system. In various examples, translating the resin support through a second collection structure of the reclamation system can further include translating the resin support past a first scraper on a first side of the resin support and a second scraper on a second side of the resin support at step 218.



FIG. 11 depicts certain components of the computing system 70 according to example embodiments of the present disclosure. The computing system 70 can include one or more computing device(s) 70A which may be used to implement the method 200 such as described herein. The computing device(s) 70A can include one or more processor(s) 70B and one or more memory device(s) 70C. The one or more processor(s) 70B can include any suitable processing device, such as a microprocessor, microcontroller, integrated circuit, an application specific integrated circuit (ASIC), a digital signal processor (DSP), a field-programmable gate array (FPGA), logic device, one or more central processing units (CPUs), graphics processing units (GPUs) (e.g., dedicated to efficiently rendering images), processing units performing other specialized calculations, etc. The memory device(s) 70C can include one or more non-transitory computer-readable storage medium(s), such as RAM, ROM, EEPROM, EPROM, flash memory devices, magnetic disks, etc., and/or combinations thereof.


The memory device(s) 70C can include one or more computer-readable media and can store information accessible by the one or more processor(s) 70B, including instructions 70D that can be executed by the one or more processor(s) 70B. The instructions 70D may include one or more steps of the method 200 described above, such as to execute operations of the additive manufacturing apparatus 10 described above. For instance, the memory device(s) 70C can store instructions 70D for running one or more software applications, displaying a user interface, receiving user input, processing user input, etc. In some implementations, the instructions 70D can be executed by the one or more processor(s) 70B to cause the one or more processor(s) 70B to perform operations, e.g., such as one or more portions of the method described herein. The instructions 70D can be software written in any suitable programming language or can be implemented in hardware. Additionally, and/or alternatively, the instructions 70D can be executed in logically and/or virtually separate threads on processor(s) 70B.


The one or more memory device(s) 70C can also store data 70E that can be retrieved, manipulated, created, or stored by the one or more processor(s) 70B. The data 70E can include, for instance, data to facilitate performance of the method 200 described herein. The data 70E can be stored in one or more database(s). The one or more database(s) can be connected to computing system 70 by a high bandwidth LAN or WAN, or can also be connected to the computing system 70 through network(s) (not shown). The one or more database(s) can be split up so that they are located in multiple locales. In some implementations, the data 70E can be received from another device.


The computing device(s) 70A can also include a communication module or interface 70F used to communicate with one or more other component(s) of computing system 70 or the additive manufacturing apparatus 10 over the network(s). The communication interface 70F can include any suitable components for interfacing with one or more network(s), including, for example, transmitters, receivers, ports, controllers, antennas, or other suitable components.


As provided herein, the computing system 70 may be operably coupled with one or more of the drive system 36, the sensor system 170, and/or the drive assembly. The computing system 70 may be configured to control the actuation of the drive system 36 based on the information from one or more sensors 172 of the sensor system 170. Likewise, the computing system 70 may be configured to control the actuation of the drive assembly 158 based on the information from one or more sensors 172 of the sensor system 170.


It should be appreciated that the additive manufacturing apparatus is described herein only for the purpose of explaining aspects of the present subject matter. In other example embodiments, the additive manufacturing apparatus may have any other suitable configuration and may use any other suitable additive manufacturing technology. Further, the additive manufacturing apparatus and processes or methods described herein may be used for forming components using any suitable material. For example, the material may be plastic, metal, concrete, ceramic, polymer, epoxy, photopolymer resin, or any other suitable material that may be embodied in a layer of slurry, resin, or any other suitable form of sheet material having any suitable consistency, viscosity, or material properties. For example, according to various embodiments of the present subject matter, the additively manufactured components described herein may be formed in part, in whole, or in some combination of materials including but not limited to pure metals, nickel alloys, chrome alloys, titanium, titanium alloys, magnesium, magnesium alloys, aluminum, aluminum alloys, iron, iron alloys, stainless steel, and nickel or cobalt-based superalloys (e.g., those available under the name Inconel® available from Special Metals Corporation). These materials are examples of materials suitable for use in the additive manufacturing processes described herein, and may be generally referred to as “additive materials.”


Further aspects are provided by the subject matter of the following clauses:


A reclamation system for use with an additive manufacturing apparatus, the additive manufacturing apparatus including a stage configured to support one or more cured layers of resin that form a component, a radiant energy device operable to generate and project radiant energy in a patterned image, and an actuator configured to change a relative position of the stage relative to the radiant energy device, the system comprising: a first collection structure configured to accept a resin support therethrough along a resin support movement direction; and a first scraper positioned within the first collection structure, wherein the first scraper has an elongation axis that is offset from the resin support movement direction by an offset angle, and wherein the offset angle is less than 90 degrees.


The reclamation system of one or more of these clauses, wherein the first collection structure further comprises a first plate and a second plate separated from the first plate, and wherein the resin support is translated between the first plate and the second plate.


The reclamation system of one or more of these clauses, further comprising: a channel fluidly coupled with the first scraper, the channel at least partially supported by the first plate.


The reclamation system of one or more of these clauses, further comprising: a drain defined by the channel and configured to direct the resin from the channel to a reservoir.


The reclamation system of one or more of these clauses, wherein the first scraper is attached to the second plate and extends towards the first plate.


The reclamation system of one or more of these clauses, further comprising: an actuator operably coupled with the first plate and the second plate, the actuator configured to adjust and define a gap between the first plate and the second plate.


The reclamation system of one or more of these clauses, wherein the first scraper extends outwardly of at least one edge portion of the resin support and wherein a forward surface of the channel extends upwardly of a portion of the first scraper in a Z-axis direction.


The reclamation system of one or more of these clauses, wherein the reclamation system includes a first plate that defines a groove proximate to an end portion of the first scraper and configured to route the resin from the first scraper to the channel.


The reclamation system of one or more of these clauses, wherein the first scraper is attached to a first plate and a second scraper is attached to a second plate, the first plate separated from the second plate and configured to accept the resin support between the first scraper and the second scraper.


The reclamation system of one or more of these clauses, further comprising: a bracket supporting each of a first plate and a second plate, wherein the first scraper is attached to the first plate and a second scraper is attached to the second plate, the bracket including a pivot member that is configured to rotate the first plate and the second plate relative to a mandrel.


The reclamation system of one or more of these clauses, wherein the reclamation system includes a first reclamation system supporting the first scraper and a second collection structure supporting a second scraper, and wherein the resin support translates past the first scraper at a first resin support translation speed and the resin support translates past the second scraper at a second resin support translation speed, the second resin support translation speed different than the first resin support translation speed.


A method of operating a reclamation system for use with an additive manufacturing apparatus, the additive manufacturing apparatus configured to cure a first portion of a resin to create a layer of a component, the method comprising: translating a resin support between a first plate and a second plate of a first collection structure at a first resin support translation speed; and removing a second portion of the resin from the resin support with a first scraper attached to the second plate as the resin support is translated between the first plate and the second plates.


The method of one or more of these clauses, further comprising: translating the resin support through a second collection structure at a second resin support translation speed, the second speed different than the first speed.


The method of one or more of these clauses, wherein the second collection structure includes a second scraper attached to the first plate, and wherein the first scraper and the second scraper are positioned on opposing sides of the resin support.


The method of one or more of these clauses, wherein the resin support is wound about a feed mandrel and a take-up mandrel when translated through the first collection structure and the resin support is wound about a first reclamation mandrel and a second reclamation mandrel when translated through the second collection structure.


The method of one or more of these clauses, wherein the first collection structure is configured to contact the resin support and direct the resin to a channel, and wherein the channel defines a drain that directs the resin from the channel to a reservoir.


A reclamation system for use with an additive manufacturing apparatus that includes a stage configured to support a component and a radiant energy device positioned opposite to the stage such that it is operable to generate and project radiant energy in a patterned image, the system comprising: a first plate; a second plate separated from the first plate; and a scraper attached to the second plate, wherein a resin support is configured to be compressed between the scraper and the first plate.


The reclamation system of one or more of these clauses, wherein the scraper has an elongation axis that is offset from a resin support movement direction of the resin support through the reclamation system by an offset angle, and wherein the offset angle is less than 90 degrees.


The reclamation system of one or more of these clauses, wherein the offset angle is between 40 and 50 degrees.


The reclamation system of one or more of these clauses, further comprising: a reservoir positioned below the first plate in a Z-axis direction, the reservoir separated from the first plate in the Z-axis direction.


This written description uses examples to disclose the concepts presented herein, including the best mode, and also to enable any person skilled in the art to practice the present disclosure, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the present disclosure is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they include structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.

Claims
  • 1. A reclamation system for use with an additive manufacturing apparatus, the additive manufacturing apparatus including a stage configured to support one or more cured layers of resin that form a component, a radiant energy device operable to generate and project radiant energy in a patterned image, and an actuator configured to change a relative position of the stage relative to the radiant energy device, the system comprising: a first collection structure configured to accept a resin support therethrough along a resin support movement direction; anda first scraper positioned within the first collection structure, wherein the first scraper has an elongation axis that is offset from the resin support movement direction by an offset angle, and wherein the offset angle is less than 90 degrees.
  • 2. The system of claim 1, wherein the first collection structure further comprises a first plate and a second plate separated from the first plate, and wherein the resin support is translated between the first plate and the second plate.
  • 3. The system of claim 2, further comprising: a channel fluidly coupled with the first scraper, the channel at least partially supported by the first plate.
  • 4. The system of claim 3, further comprising: a drain defined by the channel and configured to direct the resin from the channel to a reservoir.
  • 5. The system of claim 2, wherein the first scraper is attached to the second plate and extends towards the first plate.
  • 6. The system of claim 2, further comprising: an actuator operably coupled with the first plate and the second plate, the actuator configured to adjust and define a gap between the first plate and the second plate.
  • 7. The system of claim 4, wherein the first scraper extends outwardly of at least one edge portion of the resin support and wherein a forward surface of the channel extends upwardly of a portion of the first scraper in a Z-axis direction.
  • 8. The system of claim 4, wherein the first plate defines a groove proximate to an end portion of the first scraper and configured to route the resin from the first scraper to the channel.
  • 9. The system of claim 1, wherein the first scraper is attached to a first plate and a second scraper is attached to a second plate, the first plate separated from the second plate and configured to accept the resin support between the first scraper and the second scraper.
  • 10. The system of claim 1, wherein the reclamation system includes a first reclamation system supporting the first scraper and a second collection structure supporting a second scraper, and wherein the resin support translates past the first scraper at a first resin support translation speed and the resin support translates past the second scraper at a second resin support translation speed, the second resin support translation speed different than the first resin support translation speed.
  • 11. A reclamation system for use with an additive manufacturing apparatus that includes a stage configured to support a component and a radiant energy device positioned opposite to the stage such that it is operable to generate and project radiant energy in a patterned image, the system comprising: a first plate;a second plate separated from the first plate;a scraper attached to the second plate, wherein a resin support is configured to be compressed between the scraper and the first plate, wherein the scraper has an elongation axis that is offset from a resin support movement direction of the resin support through the reclamation system by an offset angle, and wherein the offset angle is less than 90 degrees, and wherein the scraper has a first end portion that is positioned vertically below a second end portion; anda channel fluidly coupled with the first scraper, the channel at least partially supported by the first plate, wherein the channel is positioned below the first and portion of the scraper and extends above the first end portion of the scraper.
  • 12. The additive manufacturing apparatus of claim 11, wherein the offset angle is between 40 and 50 degrees.
  • 13. The additive manufacturing apparatus of claim 11, further comprising: a reservoir positioned below the first plate in a Z-axis direction, the reservoir separated from the first plate in the Z-axis direction.
  • 14. The additive manufacturing apparatus of claim 11, further comprising: a standoff operably coupled with the first plate and the second plate, the standoff configured to retain the second plate in a separated manner from the first plate.
  • 15. The additive manufacturing apparatus of claim 11, further comprising: an actuator configured to adjust and define a gap between the first plate and the second plate.
CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to U.S. Provisional Patent Application Ser. No. 63/214,309, filed on Jun. 24, 2021, the contents of which are hereby incorporated by reference in their entirety.

US Referenced Citations (527)
Number Name Date Kind
1990749 Phillips et al. Feb 1935 A
2259517 Drenkard, Jr. Oct 1941 A
3264103 Cohen et al. Aug 1966 A
3395014 Cohen et al. Jul 1968 A
3486482 Hunger Dec 1969 A
3710846 Properzi Jan 1973 A
3875067 DeSorgo et al. Apr 1975 A
3991149 Hurwitt Nov 1976 A
4041476 Swainson Aug 1977 A
4292827 Waugh Oct 1981 A
4575330 Hull Mar 1986 A
4752498 Fudim Jun 1988 A
4945032 Murphy et al. Jul 1990 A
5015312 Kinzie May 1991 A
5026146 Hug et al. Jun 1991 A
5031120 Pomerantz et al. Jul 1991 A
5058988 Spence et al. Oct 1991 A
5059021 Spence et al. Oct 1991 A
5088047 Bynum Feb 1992 A
5094935 Vassiliou et al. Mar 1992 A
5096530 Cohen Mar 1992 A
5104592 Hull et al. Apr 1992 A
5123734 Spence et al. Jun 1992 A
5126259 Weiss et al. Jun 1992 A
5126529 Weiss et al. Jun 1992 A
5133987 Spence et al. Jul 1992 A
5162167 Minh et al. Nov 1992 A
5174931 Almquist et al. Dec 1992 A
5175077 Grossa Dec 1992 A
5182055 Allison et al. Jan 1993 A
5192559 Hull et al. Mar 1993 A
5203944 Prinz et al. Apr 1993 A
5204055 Sachs et al. Apr 1993 A
5207371 Prinz et al. May 1993 A
5236326 Grossa Aug 1993 A
5236637 Hull Aug 1993 A
5236812 Vassiliou et al. Aug 1993 A
5247180 Mitcham et al. Sep 1993 A
5248456 Evans, Jr. et al. Sep 1993 A
5258146 Almquist et al. Nov 1993 A
5314711 Baccini May 1994 A
5340656 Sachs et al. Aug 1994 A
5387380 Cima et al. Feb 1995 A
5432045 Narukawa et al. Jul 1995 A
5447822 Hull et al. Sep 1995 A
5454069 Knapp et al. Sep 1995 A
5460758 Langer et al. Oct 1995 A
5496682 Quadir et al. Mar 1996 A
5610824 Vinson et al. Mar 1997 A
5626919 Chapman et al. May 1997 A
5650260 Onishi Jul 1997 A
5660621 Bredt Aug 1997 A
5665401 Serbin et al. Sep 1997 A
5688464 Jacobs et al. Nov 1997 A
5693144 Jacobs et al. Dec 1997 A
5697043 Baskaran et al. Dec 1997 A
5717599 Menhennett et al. Feb 1998 A
5718279 Saoth et al. Feb 1998 A
5746833 Gerhardt May 1998 A
5764521 Batchelder et al. Jun 1998 A
5807437 Sachs et al. Sep 1998 A
5824184 Kamijo et al. Oct 1998 A
5851465 Bredt Dec 1998 A
5866058 Batchelder et al. Feb 1999 A
5895547 Kathrein et al. Apr 1999 A
5900207 Danforth et al. May 1999 A
5939008 Comb et al. Aug 1999 A
5940674 Sachs et al. Aug 1999 A
5945058 Manners et al. Aug 1999 A
5968561 Batchelder et al. Oct 1999 A
5980813 Narang et al. Nov 1999 A
5985204 Otsuka et al. Nov 1999 A
6051179 Hagenau Apr 2000 A
6067480 Stuffle et al. May 2000 A
6068367 Fabbri May 2000 A
6110411 Clausen et al. Aug 2000 A
6146567 Sachs et al. Nov 2000 A
6193923 Leyden et al. Feb 2001 B1
6200646 Neckers et al. Mar 2001 B1
6206672 Grenda Mar 2001 B1
6363606 Johnson et al. Apr 2002 B1
6375451 Robinson et al. Apr 2002 B1
6376148 Liu et al. Apr 2002 B1
6391245 Smith May 2002 B1
6399010 Guertin et al. Jun 2002 B1
6401002 Jang et al. Jun 2002 B1
6403002 van der Geest Jun 2002 B1
6436520 Yamamoto Aug 2002 B1
6450393 Doumanidis et al. Sep 2002 B1
6463349 White et al. Oct 2002 B2
6471800 Jang et al. Oct 2002 B2
6500378 Smith Dec 2002 B1
6512869 Imayama et al. Jan 2003 B1
6543506 Phillips Apr 2003 B1
6575218 Burns et al. Jun 2003 B1
6596224 Sachs et al. Jul 2003 B1
6641897 Gervasi Nov 2003 B2
6649113 Manners et al. Nov 2003 B1
6660209 Leyden et al. Dec 2003 B2
6668892 Vasilakes et al. Dec 2003 B2
6682598 Steinmueller et al. Jan 2004 B1
6780368 Liu et al. Aug 2004 B2
6786711 Koch et al. Sep 2004 B2
6838035 Ederer et al. Jan 2005 B1
6850334 Gothait Feb 2005 B1
6852272 Artz et al. Feb 2005 B2
6896839 Kubo et al. May 2005 B2
6914406 Wilkes et al. Jul 2005 B1
6930144 Oriakhi Aug 2005 B2
6947058 Elmquist Sep 2005 B1
6966960 Boyd et al. Nov 2005 B2
6974521 Schermer Dec 2005 B2
6986654 Imiolek et al. Jan 2006 B2
7008209 Iskra et al. Mar 2006 B2
7016738 Karunasiri Mar 2006 B1
7022207 Hirsch Apr 2006 B2
7045738 Kovacevic et al. May 2006 B1
7052263 John May 2006 B2
7070250 Lester et al. Jul 2006 B2
7074029 Stockwell et al. Jul 2006 B2
7084875 Plante Aug 2006 B2
7087109 Bredr et al. Aug 2006 B2
7158849 Huang et al. Jan 2007 B2
7164420 Ard Jan 2007 B2
7195472 John Mar 2007 B2
7261542 Hickerson et al. Aug 2007 B2
7270528 Sherwood Sep 2007 B2
7300613 Sano et al. Nov 2007 B2
7351304 Liang et al. Apr 2008 B2
7402219 Graf Jul 2008 B2
7438846 John Oct 2008 B2
7455804 Patel et al. Nov 2008 B2
7520740 Wahlstrom et al. Apr 2009 B2
7550518 Bredt et al. Jun 2009 B2
7555726 Kurtenbach et al. Jun 2009 B2
7569174 Ruatta et al. Aug 2009 B2
7572403 Gu et al. Aug 2009 B2
7575682 Olsta et al. Aug 2009 B2
7578958 Patel et al. Aug 2009 B2
7614866 Sperry et al. Nov 2009 B2
7614886 Sperry et al. Nov 2009 B2
7636610 Schillen et al. Dec 2009 B2
7698947 Sarr Apr 2010 B2
7706910 Hull et al. Apr 2010 B2
7742060 Maillot Jun 2010 B2
7758799 Hull et al. Jul 2010 B2
7767132 Patel et al. Aug 2010 B2
7771183 Hull et al. Aug 2010 B2
7780429 Kikuchi Aug 2010 B2
7783371 John et al. Aug 2010 B2
7785093 Holmboe et al. Aug 2010 B2
7790093 Shkolnik et al. Sep 2010 B2
7795349 Bredt et al. Sep 2010 B2
7815826 Serdy et al. Oct 2010 B2
7845930 Shkolnik et al. Dec 2010 B2
7867302 Nevoret et al. Jan 2011 B2
7892474 Shkolnik et al. Feb 2011 B2
7894921 John et al. Feb 2011 B2
7931460 Scott et al. Apr 2011 B2
7962238 Shkolnik et al. Jun 2011 B2
7964047 Ishida Jun 2011 B2
7995073 Shemanarev et al. Aug 2011 B1
8003040 El-Siblani Aug 2011 B2
8071055 Davidson et al. Sep 2011 B2
8029642 Hagman Oct 2011 B2
8048261 McCowin Nov 2011 B2
8070473 Kozlak Dec 2011 B2
8105066 Sperry et al. Jan 2012 B2
8110135 El-Siblani Feb 2012 B2
8126580 El-Siblani et al. Feb 2012 B2
8157908 Williams Apr 2012 B2
8185229 Davidson May 2012 B2
8096262 Ederer et al. Jun 2012 B2
8191500 Dohring et al. Jun 2012 B2
8211226 Bredt et al. Jul 2012 B2
8232444 Bar Nathan et al. Jul 2012 B2
8259103 Glueck et al. Sep 2012 B2
8269767 Glueck et al. Sep 2012 B2
8282866 Hiraide Oct 2012 B2
8326024 Shkolnik Dec 2012 B2
8372330 El-Siblani et al. Feb 2013 B2
8394313 El-Siblani et al. Mar 2013 B2
8413578 Doyle Apr 2013 B2
8424580 Anderson et al. Apr 2013 B2
8444903 Lyons et al. May 2013 B2
8454879 Kuzusako et al. Jun 2013 B2
8475946 Dion et al. Jul 2013 B1
8506862 Giller et al. Aug 2013 B2
8506870 Hochsmann et al. Aug 2013 B2
8513562 Bichsel Aug 2013 B2
8522159 Kurtenbach et al. Aug 2013 B2
8540501 Yasukochi Sep 2013 B2
8568646 Wang et al. Oct 2013 B2
8568649 Balistreri et al. Oct 2013 B1
8593083 Firhoj et al. Nov 2013 B2
8616872 Matsui et al. Dec 2013 B2
8623264 Rohner et al. Jan 2014 B2
8636494 Gothait et al. Jan 2014 B2
8636496 Das et al. Jan 2014 B2
8658076 El-Siblani Feb 2014 B2
8663568 Bar Nathan et al. Mar 2014 B2
8666142 Shkolnik et al. Mar 2014 B2
8703037 Hull et al. Apr 2014 B2
8715832 Ederer et al. May 2014 B2
8718522 Chillscyzn et al. May 2014 B2
8737862 Manico et al. May 2014 B2
8741194 Ederer et al. Jun 2014 B1
8741203 Liska et al. Jun 2014 B2
8744184 Ameline et al. Jun 2014 B2
8761918 Silverbrook Jun 2014 B2
8801418 El-Siblani et al. Aug 2014 B2
8805064 Ameline et al. Aug 2014 B2
8815143 John et al. Aug 2014 B2
8844133 Fuller Aug 2014 B2
8845316 Schillen et al. Sep 2014 B2
8845953 Balistreri et al. Sep 2014 B1
8862260 Shkolnik et al. Oct 2014 B2
8872024 Jamar et al. Oct 2014 B2
8873024 Jamar et al. Oct 2014 B2
8876513 Lim et al. Nov 2014 B2
8877115 Elsey Nov 2014 B2
8888480 Yoo et al. Nov 2014 B2
8915728 Mironets et al. Dec 2014 B2
8926304 Chen Jan 2015 B1
8932511 Napendensky Jan 2015 B2
8968625 Tan Mar 2015 B2
8974717 Maguire et al. Mar 2015 B2
8991211 Arlotti et al. Mar 2015 B1
8992816 Jonasson et al. Mar 2015 B2
8998601 Busato Apr 2015 B2
9011982 Muller et al. Apr 2015 B2
9031680 Napadensky May 2015 B2
9063376 Mizumura Jun 2015 B2
9064922 Nakajima et al. Jun 2015 B2
9067359 Rohner et al. Jun 2015 B2
9067360 Wehning et al. Jun 2015 B2
9067361 El-Siblani Jun 2015 B2
9073260 El-Siblani et al. Jul 2015 B2
9079357 Ebert et al. Jul 2015 B2
9101321 Kiesser Aug 2015 B1
9149986 Huang et al. Oct 2015 B2
9150032 Roof et al. Oct 2015 B2
9153052 Ameline et al. Oct 2015 B2
9159155 Andersen Oct 2015 B2
9186847 Fruth et al. Nov 2015 B2
9193112 Ohkusa et al. Nov 2015 B2
9205601 DeSimone et al. Dec 2015 B2
9211678 DeSimone et al. Dec 2015 B2
9216546 DeSimone et al. Dec 2015 B2
9221100 Schwarze et al. Dec 2015 B2
9233504 Douglas et al. Jan 2016 B2
9248600 Goodman et al. Feb 2016 B2
9259880 Chen Feb 2016 B2
9308690 Boyer et al. Apr 2016 B2
9327385 Webb et al. May 2016 B2
9346217 Huang et al. May 2016 B2
9346218 Chen et al. May 2016 B2
9360757 DeSimone et al. Jun 2016 B2
9364848 Silverbrook Jun 2016 B2
9403322 Das et al. Aug 2016 B2
9403324 Ederer et al. Aug 2016 B2
9415443 Ljungblad et al. Aug 2016 B2
9415544 Kerekes et al. Aug 2016 B2
9415547 Chen et al. Aug 2016 B2
9429104 Fuller Aug 2016 B2
9434107 Zenere Sep 2016 B2
9446557 Zenere et al. Sep 2016 B2
9453142 Rolland et al. Sep 2016 B2
9456884 Uckelmann et al. Oct 2016 B2
9457374 Hibbs et al. Oct 2016 B2
9463488 Ederer et al. Oct 2016 B2
9469074 Ederer et al. Oct 2016 B2
9486944 El-Siblani et al. Nov 2016 B2
9486964 Joyce Nov 2016 B2
9487443 Watanabe Nov 2016 B2
9498920 DeSimone et al. Nov 2016 B2
9498921 Teulet Nov 2016 B2
9511546 Chen et al. Dec 2016 B2
9517591 Yoo et al. Dec 2016 B2
9517592 Yoo et al. Dec 2016 B2
9527244 El-Siblani Dec 2016 B2
9527272 Steele Dec 2016 B2
9529371 Nakamura Dec 2016 B2
9533450 El-Siblani et al. Jan 2017 B2
9539762 Durand et al. Jan 2017 B2
9545753 Costabeber Jan 2017 B2
9545784 Nakamura Jan 2017 B2
9550326 Costabeber Jan 2017 B2
9561622 Das et al. Feb 2017 B2
9561623 El-Siblani et al. Feb 2017 B2
9578695 Jerby et al. Feb 2017 B2
9579852 Okamoto Feb 2017 B2
9581530 Guthrie et al. Feb 2017 B2
9592635 Ebert et al. Mar 2017 B2
9604411 Rogren Mar 2017 B2
9610616 Chen et al. Apr 2017 B2
9616620 Hoechsmann et al. Apr 2017 B2
9632037 Chen et al. Apr 2017 B2
9632420 Allanic Apr 2017 B2
9632983 Ueda et al. Apr 2017 B2
9636873 Joyce May 2017 B2
9649812 Hartmann et al. May 2017 B2
9649815 Atwood et al. May 2017 B2
9656344 Kironn et al. May 2017 B2
9670371 Pervan et al. Jun 2017 B2
9676143 Kashani-Shirazi Jun 2017 B2
9676963 Rolland et al. Jun 2017 B2
9682166 Watanabe Jun 2017 B2
9682425 Xu et al. Jun 2017 B2
9688027 Batchelder et al. Jun 2017 B2
9707720 Chen et al. Jul 2017 B2
9720363 Chillscyzn et al. Aug 2017 B2
9738034 Gruber et al. Aug 2017 B2
9738564 Capobianco et al. Aug 2017 B2
9751292 Jamar et al. Sep 2017 B2
9764513 Stampfl et al. Sep 2017 B2
9764535 Xie et al. Sep 2017 B2
9821546 Schaafsma et al. Nov 2017 B2
9862146 Driessen et al. Jan 2018 B2
9862150 Chen et al. Jan 2018 B2
9868255 Comb et al. Jan 2018 B2
9885987 Chillscysn et al. Feb 2018 B2
9895843 Lobovsky et al. Feb 2018 B2
9901983 Hovel et al. Feb 2018 B2
9908293 Yoo et al. Mar 2018 B2
9919474 Napadensky Mar 2018 B2
9919515 Daniell et al. Mar 2018 B2
9950368 Lampenscherf et al. Apr 2018 B2
9956727 Steele May 2018 B2
9962767 Buller et al. May 2018 B2
9981411 Green et al. May 2018 B2
10000023 El-Siblani et al. Jun 2018 B2
10011076 El-Siblani et al. Jul 2018 B2
10061302 Jacobs et al. Aug 2018 B2
10071422 Buller et al. Sep 2018 B2
10124532 El-Siblani et al. Nov 2018 B2
10150254 Bauman et al. Dec 2018 B2
10155345 Ermoshkin et al. Dec 2018 B2
10155882 Rolland et al. Dec 2018 B2
10183330 Buller et al. Jan 2019 B2
10183444 Campbell Jan 2019 B2
10240066 Rolland et al. Mar 2019 B2
10245784 Teken et al. Apr 2019 B2
10317882 de Pena et al. Jun 2019 B2
10336055 Das et al. Jul 2019 B2
10336057 Moore et al. Jul 2019 B2
10350823 Rolland et al. Jul 2019 B2
10357956 Usami et al. Jul 2019 B2
10406748 Honda Sep 2019 B2
10612112 Yang et al. Apr 2020 B2
10639843 Yuan et al. May 2020 B2
10682808 Fujita et al. Jun 2020 B2
10695988 Hanyu et al. Jun 2020 B2
10717212 Parkinson et al. Jul 2020 B2
10737479 El-Siblani et al. Aug 2020 B2
20020164069 Nagano et al. Nov 2002 A1
20030180171 Artz et al. Sep 2003 A1
20030209836 Sherwood Nov 2003 A1
20050012239 Nakashima Jan 2005 A1
20050019016 Ishikawa et al. Sep 2005 A1
20060230984 Bredt et al. Oct 2006 A1
20060248062 Libes et al. Nov 2006 A1
20070063366 Cunningham et al. Mar 2007 A1
20070116937 Lazzerini May 2007 A1
20080170112 Hull et al. Jul 2008 A1
20080224352 Narukawa et al. Sep 2008 A1
20080241404 Allaman et al. Oct 2008 A1
20100003619 Das et al. Jan 2010 A1
20100196694 Yamazaki et al. Aug 2010 A1
20100290016 Kaehr et al. Nov 2010 A1
20110089610 El-Siblani et al. Apr 2011 A1
20110101570 John et al. May 2011 A1
20110162989 Ducker et al. Jul 2011 A1
20110207057 Hull et al. Aug 2011 A1
20120195994 El-Siblani et al. Aug 2012 A1
20120292800 Higuchi et al. Nov 2012 A1
20130008879 Bichsel Jan 2013 A1
20130140741 El-Siblani et al. Jun 2013 A1
20140099476 Subramanian et al. Apr 2014 A1
20140103581 Das et al. Apr 2014 A1
20140200865 Lehmann et al. Jul 2014 A1
20140239554 El-Siblani et al. Aug 2014 A1
20140275317 Moussa Sep 2014 A1
20140319735 El-Siblani et al. Oct 2014 A1
20140322374 El-Siblani et al. Oct 2014 A1
20140332507 Fockele Nov 2014 A1
20140339741 Aghababaie et al. Nov 2014 A1
20140348691 Ljungblad et al. Nov 2014 A1
20140348692 Bessac et al. Nov 2014 A1
20150004042 Nimal Jan 2015 A1
20150004046 Graham et al. Jan 2015 A1
20150056365 Miyoshi Feb 2015 A1
20150086409 Hellestam Mar 2015 A1
20150102531 El-Siblani et al. Apr 2015 A1
20150104563 Lowe et al. Apr 2015 A1
20150140152 Chen May 2015 A1
20150140155 Ohno et al. May 2015 A1
20150145174 Comb May 2015 A1
20150158111 Schwarze et al. Jun 2015 A1
20150165695 Chen et al. Jun 2015 A1
20150210013 Teulet Jul 2015 A1
20150224710 El-Siblani Aug 2015 A1
20150231828 El-Siblani et al. Aug 2015 A1
20150231831 El-Siblani Aug 2015 A1
20150246487 El-Siblani Sep 2015 A1
20150251351 Feygin Sep 2015 A1
20150268099 Craig et al. Sep 2015 A1
20150298396 Chen et al. Oct 2015 A1
20150301517 Chen et al. Oct 2015 A1
20150306819 Ljungblad Oct 2015 A1
20150306825 Chen et al. Oct 2015 A1
20150321421 Ding Nov 2015 A1
20150352668 Scott et al. Dec 2015 A1
20150352791 Chen et al. Dec 2015 A1
20150355553 Allanic Dec 2015 A1
20150375452 Huang et al. Dec 2015 A1
20160016361 Lobovsky et al. Jan 2016 A1
20160031010 O'Neill et al. Feb 2016 A1
20160046075 DeSimone et al. Feb 2016 A1
20160046080 Thomas et al. Feb 2016 A1
20160052205 FrantzDale Feb 2016 A1
20160059484 DeSimone et al. Mar 2016 A1
20160059485 Ding et al. Mar 2016 A1
20160067921 Willis et al. Mar 2016 A1
20160082662 Majer Mar 2016 A1
20160082671 Joyce Mar 2016 A1
20160096332 Chen et al. Apr 2016 A1
20160107340 Joyce Apr 2016 A1
20160107383 Dikovsky et al. Apr 2016 A1
20160107387 Ooba et al. Apr 2016 A1
20160129631 Chen et al. May 2016 A1
20160137839 Rolland et al. May 2016 A1
20160167160 Hellestam Jun 2016 A1
20160176114 Tsai et al. Jun 2016 A1
20160184931 Green Jun 2016 A1
20160193785 Bell et al. Jul 2016 A1
20160214327 Ucklemann et al. Jul 2016 A1
20160221262 Das et al. Aug 2016 A1
20160243649 Zheng et al. Aug 2016 A1
20160303798 Mironets et al. Oct 2016 A1
20160332386 Kuijpers Nov 2016 A1
20160361871 Jeng et al. Dec 2016 A1
20160361872 El-Siblani Dec 2016 A1
20170008234 Cullen et al. Jan 2017 A1
20170008236 Easter et al. Jan 2017 A1
20170021562 El-Siblani et al. Jan 2017 A1
20170066185 Ermoshkin et al. Mar 2017 A1
20170066196 Beard et al. Mar 2017 A1
20170072635 El-Siblani et al. Mar 2017 A1
20170080641 El-Siblani Mar 2017 A1
20170087670 Kalentics et al. Mar 2017 A1
20170100895 Chou et al. Apr 2017 A1
20170100897 Chou et al. Apr 2017 A1
20170100899 El-Siblani et al. Apr 2017 A1
20170102679 Greene et al. Apr 2017 A1
20170113409 Patrov Apr 2017 A1
20170120332 DeMuth et al. May 2017 A1
20170120333 DeMuth et al. May 2017 A1
20170120334 DeMuth et al. May 2017 A1
20170120335 DeMuth et al. May 2017 A1
20170120336 DeMuth et al. May 2017 A1
20170120387 DeMuth et al. May 2017 A1
20170120518 DeMuth et al. May 2017 A1
20170120529 DeMuth et al. May 2017 A1
20170120530 DeMuth et al. May 2017 A1
20170120537 DeMuth et al. May 2017 A1
20170120538 DeMuth et al. May 2017 A1
20170123222 DeMuth et al. May 2017 A1
20170123237 DeMuth et al. May 2017 A1
20170136688 Knecht et al. May 2017 A1
20170136708 Das et al. May 2017 A1
20170157841 Green Jun 2017 A1
20170157862 Bauer Jun 2017 A1
20170165916 El-Siblani Jun 2017 A1
20170173865 Dikovsky et al. Jun 2017 A1
20170182708 Lin et al. Jun 2017 A1
20170190120 Bloome Jul 2017 A1
20170276651 Hall Sep 2017 A1
20170284971 Hall Oct 2017 A1
20170291804 Craft et al. Oct 2017 A1
20170297108 Gibson et al. Oct 2017 A1
20170297109 Gibson et al. Oct 2017 A1
20170305136 Elsey Oct 2017 A1
20170326786 Yuan et al. Nov 2017 A1
20170326807 Greene et al. Nov 2017 A1
20170368816 Batchelder et al. Dec 2017 A1
20180001567 Juan et al. Jan 2018 A1
20180015672 Shusteff et al. Jan 2018 A1
20180043619 Kim et al. Feb 2018 A1
20180056585 Du Toit Mar 2018 A1
20180056604 Sands et al. Mar 2018 A1
20180079137 Herzog et al. Mar 2018 A1
20180085998 von Burg Mar 2018 A1
20180117790 Yun May 2018 A1
20180169969 Deleon et al. Jun 2018 A1
20180200948 Kuijpers et al. Jul 2018 A1
20180201021 Beaver et al. Jul 2018 A1
20180229332 Tsai et al. Aug 2018 A1
20180229436 Gu et al. Aug 2018 A1
20180272603 MacCormack et al. Sep 2018 A1
20180272608 Yun Sep 2018 A1
20180345600 Holford et al. Dec 2018 A1
20180370214 Comb et al. Dec 2018 A1
20190022937 Stelter et al. Jan 2019 A1
20190039299 Busbee et al. Feb 2019 A1
20190047211 Herring et al. Feb 2019 A1
20190061230 Ermoshkin et al. Feb 2019 A1
20190112499 Rolland et al. Apr 2019 A1
20190126548 Barnhart May 2019 A1
20190232550 Mark et al. Aug 2019 A1
20190240932 Graf Aug 2019 A1
20190263054 Kotler et al. Aug 2019 A1
20190283316 Rolland et al. Sep 2019 A1
20190344381 Pomerantz et al. Nov 2019 A1
20190389137 Frohnmaier et al. Dec 2019 A1
20200001398 Mellor et al. Jan 2020 A1
20200079008 Chowdry et al. Mar 2020 A1
20200079017 MacNeish, III et al. Mar 2020 A1
20200108553 Rogren Apr 2020 A1
20200164437 Goth et al. May 2020 A1
20200198224 Dubelman et al. Jun 2020 A1
20200230938 Menchik et al. Jul 2020 A1
20200247040 Green Aug 2020 A1
20200290275 Dubelman et al. Sep 2020 A1
20200307075 Mattes et al. Oct 2020 A1
20200376775 Das et al. Dec 2020 A1
20210046695 Thompson et al. Feb 2021 A1
Foreign Referenced Citations (41)
Number Date Country
101628477 Jan 2010 CN
103210344 Jul 2013 CN
103522546 Jan 2014 CN
104175559 Dec 2014 CN
104647752 May 2015 CN
105711101 Jun 2016 CN
105773962 Jul 2016 CN
107322930 Nov 2017 CN
208946717 Jun 2019 CN
109968661 Jul 2019 CN
111497231 Aug 2020 CN
102007010624 Sep 2008 DE
448459 Sep 1991 EP
557051 Aug 1993 EP
1454831 Sep 2004 EP
1852244 Nov 2007 EP
1864785 Dec 2007 EP
1946908 Jul 2008 EP
2521524 Nov 2012 EP
3053729 Aug 2016 EP
3453521 Mar 2019 EP
3356121 Oct 2020 EP
2311960 Oct 1997 GB
H06246839 Sep 1994 JP
2002370286 Dec 2002 JP
2003039564 Feb 2003 JP
2004257929 Sep 2004 JP
2016196098 Nov 2016 JP
20170108729 Sep 2017 KR
102109664 May 2020 KR
WO9600422 Jan 1996 WO
WO9806560 Feb 1998 WO
WO0100390 Jan 2001 WO
WO2006077665 Jul 2006 WO
WO2006109355 Oct 2006 WO
WO2017009368 Jan 2017 WO
WO2017098968 Jun 2017 WO
WO2017100538 Jun 2017 WO
WO2019159936 Aug 2019 WO
WO2020033607 Feb 2020 WO
WO2020185553 Sep 2020 WO
Non-Patent Literature Citations (31)
Entry
Admatec, Admaflex 300 DLP 3D Printer, Specifications, Features, Design and Functions, Netherlands, 2 Pages. Retrieved Nov. 5, 2020 from Webpage: https://admatecceurpoe.com/files/10f1a369c2239943e6506f27ba920bd4dd9359078e74369695ab6ffbde75c6c?filename=Admaflex%20300%20brochure.pdf&sig=hQyDlzxkSmFOZwjM.
Carbon, Carbon SpeedCell: Additive Manufacturing Reinvented, Redwood City California, Mar. 16, 2017, 4 Pages. Retrieved from Webpage: https://www.carbon3d.com/news/carbon-speedcell-additive-manufacturing-reinvented/.
Carbon, The 3D Printer for Products that Outperform, 8 Pages. Retrieved from Webpage: https://www.carbon3d.com.
DDM Systems, Disruptive Technologies for Additive Manufacturing, 2014. Retrieved on Jul. 7, 2020 from Web Link: http://www.ddmsys.com/.
Designing Buildings Wiki, Types of Brick Bonding, 6 Pages. Retrieved Mar. 25, 2021 from Webpage: https://www.designingbuildings.co.uk/wiki/Types_of_brick_bonding.
Doctor Blade with Micrometer Screw Gauge, The Tape Casting Warehouse, Inc., Morrisville PA, 6 Pages. Retrieved Mar. 23, 2021 from Webpage: http://www.drblade.com/.
Envisiontec, Advanced DLP for Superior 3D Printing, Mar. 9, 2017, 8 Pages. https://envisiontec.com/wp-content/uploads/2016/12/Why-EnvisionTEC-DLP-3D Printing-is-Better-rebranded.pdf.
Feng et al., Exposure Reciprocity Law in Photopolymerization of Multi-Functional Acrylates and Methacrylates, Macromolecular Chemistry and Physics, vol. 208, 2007, pp. 295-306.
Formlabs, An Introduction to Post-Curing SLA 3D Prints, 8 Pages. Retrieved from Webpage: https://formlabs.com/blog/introduction-post-curing-sla-3d-prints.
Formlabs, Form Wash & Form Cure, 8 Pages. Retrieved from Webpage: https://formlabs.com/tools/wash-cure/.
Hafkamp et al., A Feasibility Study on Process Monitoring and Control in Vat Photopolymerization of Ceramics, Mechatronics, vol. 56, The Netherlands, Dec. 2018, pp. 220-241. Retrieved from https://doi.org/10.1016/j.mechatronics.2018.02.006.
Kudo3d, Post-Process Your SLA Prints in 4 Easy Steps, 8 Pages. Retrieved from Webpage: https://www.kudo3d.com/post-process-your-sla-prints-in-4-easy-steps/.
Leap, Low-Frequency Sonic Mixing Technology, Energy Efficiency & Renewable Energy, Energy.Gov, 5 Pages. Retrieved Mar. 17, 2021 from Webpage: https://www.energy.gov/eere/amo/low-frequency-sonic-mixing-technology.
Lee et al., Development of a 3D Printer Using Scanning Projection Stereolithography, Scientific Reports, vol. 5, Article No. 9875, 2015, 5 pages. https://www.nature.com/articles/srep09875#s1.
Lee et al., Large-Area Compatible Laser Sintering Schemes with a Spatially Extended Focused Beam, Journal, Micromachines, vol. 8, No. 153, Seoul University, Seoul Korea, May 11, 2017, 8 Pages. http://dx.doi.org/10.3390/mi8050153.
Limaye, Multi-Objective Process Planning Method for Mask Projection Stereolithography, Dissertation Georgia Institute of Technology, Dec. 2007, 324 Pages.
Lithoz, 2 Pages. Retrieved from Webpage: http://www.lithoz/en/our-products/cleaing-station.
Matthews et al., Diode-Based Additive Manufacturing of Metals Using an Optically-Addressable Light Valve, Optic Express Research Article, vol. 25, No. 10, Lawrence Livermore National Laboratory, Livermore CA, May 10, 2017.
Nussbaum et al., Evaluation of Processing Variables in Large Area Polymer Sintering of Single Layer Components, Solid Freeform Fabrication 2016: Proceedings of the 27th Annual International Solid Freeform Fabracation Symposium—An Additive Manufacturing Conference Reviewed Paper, University of South Florida, Tampa Florida.
Park et al., Development of Multi-Material DLP 3D Printer, Journal of the Korean Society of Manufacturing Technology Engineers, vol. 26, Issue 1, Seoul Korea, Feb. 15, 2017, pp. 100-107. https://doi.org/10.7735/ksmte.2017.26.1.100.
Prodways Tech, Prodways Movinglight Technology Retrieved on Jul. 2, 2020 from Web Link: https://www.prodways.com/en/the-prodways-movinglight-technology/.
Ricoh Imaging Company Ltd., The Advanced Pixel Shift Resolution System II for Super-High-Resolution Images, Pentax K-1 Mark II, Pixel Shift Resolution System, 4 Pages. Retrieved on Mar. 30, 2021 from Webpage: http://www.ricoh-imaging.co.jp/english/products/k-1-2/feature/02.html.
Sonics & Materials, Inc., Ultrasonic Food Cutting Equipment, Sonics & Materials, Inc., Retrieved on Jun. 26, 2020, 4 Pages. https://www.sonics.com/food-cutting.
Stemmer Imaging, Ultra-High Resolution for Industrial Imaging, Germany, 9 Pages. Retrieved on Mar. 30, 2021 from Webpage: https://www.stemmer-imaging.com/en/knowledge-base/pixel-shift-technology.
Stevenson, Admatec's Ceramic 3D Printers, Ceramic, Metal, Fabbaloo 3D Printing News, Jan. 21, 2019, 8 Pages. Retrieved Nov. 24, 2020 from Weblink: https://www.fabbaloo.com/blog/2019/1/21/admatecs-ceramic-3d-printers.
Techmetals, Electroless Nickel (Tm 117C), Engineered Metal Finishing & Performance Coatings, 1 Page. Retrieved from Webpage: https://techmetals.com/pdfs/TM_117C.pdf https://techmetals.com/tm117c-2/.
Telsonic Ultrasonics, Cutting Awning Fabrics and Sealing the Edge, The Powerhouse of Ultrasonics, 2017, 1 Page. https://www.telsonic.com/fileadmin/applications/AS_206_Cut_Seal_Markisengewebe_EN.pdf.
Telsonic Ultrasonics, Integrated Power Actuator—IPA 3505, Telsonic Ultrasonics, Retrieved Jun. 26, 2020, 2 Pages. https://www.telsonic.com/en/products/integrated-power-actuator-ipa-3505/.
Tok et al., Tape Casting of High Dielectric Ceramic Substrates for Microelectronics Packaging, Journal of Materials Engineering and Performance, vol. 8, 1999, pp. 469-472. (Abstract Only) https://link.springer.com/article/10.1361/105994999770346783.
Wikipedia, Pixel Shifting, 2 Pages. Retrieved Mar. 30, 2021 from Webpage: https://en.wikpedia.org/wiki/Pixel_shifting.
Wikipedia, Standing Wave, 11 Pages. Retrieved Mar. 17, 2021 from Webpage: https://en.wikipedia.org/wiki/Standing_wave.
Related Publications (1)
Number Date Country
20220410482 A1 Dec 2022 US
Provisional Applications (1)
Number Date Country
63214309 Jun 2021 US