Patent Application
20060211449
The following description relates generally to computer system design and more specifically to reconfigurable wireless interconnects for data communication.
Space satellites are typically launched for the purpose of performing specific missions (e.g. communication, navigation, reconnaissance, and scientific research). However, because the specific needs of satellite owners change over time, and because of the appreciable costs associated with launching new satellites, reconfigurable spacecraft are highly desirable to provide the most flexibility in the use of a satellite already in space. One current limitation affecting reconfigurability of satellites lies in the design of computer processing components that rely on wires, or printed circuit board wiring traces, to provide for the interconnection of processing components. High speed data transfer between chip level components in computer processing systems is currently accomplished through printed circuit board wiring traces that connect the input/output (I/O) pin interfaces of one component chip to the I/O pin interfaces of another. These chip level interconnections require circuit board layouts to connect data buses and address buses between system components through conducting metallic traces. Such hardware level interconnections limit the flexability of satellites because the data flow paths between components cannot be altered as required to meet the processing needs of changing missions. Additionally, reliance on hardwired interconnections between components leaves the system vulnerable to complete or partial system failure due to the failure of a single component.
For the reasons stated above and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for reconfigurable interconnections between satellite processing systems components.
The embodiments of the present invention provide systems and methods for reconfigurable wireless interconnects for data communication, and will be understood by reading and studying the following specification.
In one embodiment, a reconfigurable computer processing system is provided. The system comprises a plurality of processing elements and one or more reconfigurable wireless interconnects. Each processing element is adapted to communicate to at least one other processing element through the one or more reconfigurable wireless interconnects.
In another embodiment, a reconfigurable processing system is provided. The system comprises two or more means for processing data and one or more means for reconfigurable wireless interconnection, wherein the two or more means for processing data communicate through the one or more means for reconfigurable wireless interconnections.
In yet another embodiment, a method for wireless data communication between processing elements is provided. The method comprises modulating processing element data output and demodulating the processing element data input. The method further comprises transmitting one or more RF signals representing processing data output at a first data bit rate and receiving one or more RF signals representing processing data input at a second data bit rate.
In still yet another embodiment, a processing element adapted to communicate to at least one other processing element through one or more reconfigurable wireless interconnects is provided. The processing element comprises one or more micro-antennas and one or more radio transmitter modules adapted to transmit one or more RF signals representing processing element data output. The one or more radio transmitter modules are further adapted to modulate the processing element data output based on a first data link protocol. The processing element further comprises one or more radio receiver modules adapted to receive one or more RF signals representing processing element data input. The one or more radio receiver modules are further adapted to demodulate the processing element data input based on a second data link protocol.
The present invention can be more easily understood and further advantages and uses thereof more readily apparent when considered in view of the detailed description and the following figures in which:
In accordance with common practice, the various described features are not drawn to scale but are drawn to emphasize features relevant to the present invention. Reference characters denote like elements throughout Figures and text.
In the following detailed description, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific illustrative embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that logical, mechanical and electrical changes may be made without departing from the spirit and scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense.
Reconfigurable spacecraft is an emerging space system concept that provides an advancement in the ability to do more with space based resources. Morphable spacecraft facilitate the implementation of adaptable missions that change with user needs. By providing flexible and high performance computing resources harmonious with the concept of reconfigurable spacecraft, reconfigurable computing systems of embodiments of the present invention provide many benefits to space systems. Reducing rigid wired interconnection constraints is one solution to harnessing the full potential of reconfigurable systems. Embodiments of the present invention provide reconfigurable wireless interconnects (RWIs) as a replacement for physical inter-subsystem, inter-board, and inter-chip interconnections. RWIs abate the reliance on wires and printed circuit board traces. In addition, with the elimination of hardwired connections between components, chip designers will no longer need to allocate power or space to facilitate I/O pins.
In the past decade significant advancements have been made in wireless technology used in data-communication and telecommunication networks. The integration of radios into a single device and the development of nanocomputer networks have paved the way for RWI.
Embodiments of the present invention provide systems and methods that eliminate the need for the physical interconnection of components by integrating wireless communication interfaces into individual components. Embodiments of the present invention integrate radio transmitters and receivers into the processing chip in place of traditional I/O pins. By utilizing wireless data communications technology, embodiments of the present invention provide high speed, short range, robust, bandwidth adaptive wireless data links between system components.
Embodiments of the present invention provide flexibility for reprogramming remote systems, such as systems embedded in satellites in space, where physical alterations to the systems configuration is all but impossible.
In one embodiment, processing elements 110-1 to 110-N are initially configured by design engineers to communicate with each other via RWIs 120-1 to 120-M based on the initial mission requirements of system 100. When mission requirements change, embodiments of the present invention allow reconfiguration of system 100 without the necessity of re-routing printed circuit board wiring traces. Instead, one or more of processing elements 110-1 to 110-N are reprogrammed to discontinue one or more of RWIs 120-1 to 120-M and establish one or more of RWIs 125-1 to 125-P.
In another embodiment, the present invention facilitates the mitigation of component failures. In one embodiment, two or more of processing elements 110-1 to 110-N are FPGAs. In one embodiment, repair of system 100 is accomplished by reprogramming the logic of one FPGA to perform the needed functions of a failed FPGA. Then one or more of RWIs 120-1 to 120-M and RWIs 125-1 to 125-P are respectively discontinued and established to reroute data communication from the failed FPGA to the reprogrammed FPGA. As would be appreciated by one skilled in the art upon reading this specification, mitigation of component failures is not limited to embodiments where processing elements 110-1 to 110-N are FPGAs. In general, if another processing element 110-1 to 110-N in the network has the necessary resources to perform a failed device's functions, it may replace the failed device in the network.
In operation, in one embodiment, when a first processing element 110-1 has generated or otherwise prepared data for output (i.e. processing data output), the data is transmitted to the intended recipient, such as a second processing element 110-2 through RWI 120-1. In this way, embodiments of the present invention eliminate the need for wired address and data buses. As an example, in one embodiment, processing element 110-2 is a memory device and processing element 110-1 is an FPGA. In one embodiment, FPGA 110-1 outputs processing data output to memory device 110-2, via RWI 120-1, including instructions to store data in a specified memory address. Accordingly, memory device 110-2 receives the data (as processing data input) and stores the data as instructed by FPGA 110-1. In another embodiment, a plurality of processing elements 110-1 to 110-N are FPGAs receiving processing data input from each other via one or more RWIs 120-1 to 120-M and sending processing data output to each other via one or more RWIs 120-1 to 120-M
In another embodiment, the present invention facilitates system expansion for system 100. In one embodiment, system 100 expansion is accomplished by bringing another RWI enabled processing element, such as processing element 115 within communications range of one or more of processing elements 110-1 to 110-N. Then, one or more of processing elements 110-1 to 110-N are reprogrammed to establish one or more of RWIs 128. In one embodiment, processing element 155 is a built in spare device. In another embodiment, processing element 115 is physically located remotely, for example in a nearby spacecraft brought into communications range with one or more of processing elements 110-1 to 110-N. In one embodiment, system 100 further comprises one or more bridge elements 140 which are adapted to communicate via one or more of RWIs 120-1 to 120-N with one or more processing elements 110-1 to 110-N. Bridge elements 140 are further adapted to communicate with one or more hardwired data busses 142 in order to bridge data communications between wired processing elements 145 and processing elements 110-1 to 110-N.
In one embodiment of the present invention, the reconfiguration of RWIs is accomplished through a control channel 160 as illustrated in
Data rates approaching many gigabits per second are possible with existing RF technology and the power consumption for such systems is decreasing abreast the miniaturization of transceivers. Moreover, bit error rates of less than 10−6 have been demonstrated using RF over hundreds of meters. By employing modern RF modulation and channel multiplexing techniques including, but not limited to orthogonal frequency division multiplexing (OFDM), Multiple Input, Multiple Output (MIMO) transceiver, code-division multiple access (CDMA), and Ultra Wide Band (UWB), embodiment of the present invention enable processing elements to establish RWIs with little interference between channels and other systems.
In one embodiment, the one or more radio transmitter modules 210 and one or more radio receiver modules 220 are ultra wide band (UWB) radio modules. UWB wireless technology is preferred because UWB 1) allows high data exchange rates at close proximity, 2) requires very low power to transmit at close ranges, 3) is robust and resistant to multi-path interference, and 4) can be achieved through simple transmitter and receiver realizations. As would be appreciated by one skilled in the art upon reading this specification, the integration of such UWB radio transmitter and receiver modules onto chip devices is realizable with existing integrated circuit manufacturing technology. In one embodiment, radio transmitter modules 210 and radio receiver modules 220 are physically integrated into the logic layer of an integrated chip device, such as an FPGA. On one embodiment, radio transmitter modules 210 and radio receiver modules 220 are stacked onto the logic layer of an integrated chip device and housed inside the same I/C device package.
In one embodiment, RF logic module 208 is adapted to digitally re-configure radio modules 210 and 220 to implement different data link protocols. In one embodiment, before processing element 200 transmits processing data output via an RWI, high level algorithm system partitioning tool 240 analyzes the data and determines the needed data through-put. In one embodiment RF logic module 208 configures the RWI for effective use of bandwidth based on the needed data through-put. For example, in one embodiment a first processing element may only require 500 kb of bandwidth to communicate processing data output with a second processing element. In one embodiment, partitioning tool 240 accordingly configures an RWI between the first and second processing element for 500 kb of bandwidth. In contrast, 500 Mb of bandwidth could be necessary when the first processing element communicates processing data output with a third processing element. In that case, partitioning tool 240 configures an RWI between the first and third processing element for 500 Mb of bandwidth.
One skilled in the art upon reading this specification would appreciate that a beam forming micro-antenna array can be formed by transmitting an RF signal from a plurality of micro-antennas and individually adjusting the signal gain and phase angle of the RF signal transmitted by each micro-antenna of the plurality of micro-antennas. Beam formation allows the efficient control of radio waves towards a directed area of a system or specific receiving processing elements. Beam forming also results in reduced power consumption and reduces potential interference between other wireless processing elements as RF energy is directed only to the intended receiving processing element.
As illustrated in
In one embodiment, one or more of the plurality of micro-antennas 430-1 to 430-N are integrated into the I/C chip package housing 402 of processing element 400. As illustrated in
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement, which is calculated to achieve the same purpose, may be substituted for the specific embodiment shown. This application is intended to cover any adaptations or variations of the present invention. Therefore, it is manifestly intended that this invention be limited only by the claims and the equivalents thereof.
