Claims
        
                - 1. A process for preparing reduced pour point ethylene oxide/propylene oxide block copolymer surfactants, wherein a parent ethylene oxide/propylene oxide block copolymer surfactant is mixed with a pour point depressant, said pour point depressant comprising: 
a. a low molecular weight glycol; b. water; and c. a dialkyl sulfosuccinate.
 
                - 2. The process of claim 1, wherein the low molecular weight glycol is selected from propylene glycol, ethylene glycol, diethylene glycol, or mixtures thereof.
 
                - 3. The process of claim 1, wherein the dialkyl sulfosuccinate comprises a C4-C12 dialkyl sulfosuccinate.
 
                - 4. The process of claim 1, wherein the dialkyl sulfosuccinate comprises dioctyl sodium sulfosuccinate.
 
                - 5. The process of claim 1, wherein less than about 85% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer comprises the parent ethylene oxide/propylene oxide block copolymer surfactant.
 
                - 6. The process of claim 5, wherein at least about 5% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises the low molecular weight glycol.
 
                - 7. The process of claim 6, wherein at least about 5% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises the dialkyl sulfosuccinate.
 
                - 8. The process of claim 7, wherein at least about 5% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises water.
 
                - 9. The process of claim 1, wherein from about 55% to about 80% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises the parent ethylene oxide/propylene oxide block copolymer surfactant.
 
                - 10. The process of claim 9, wherein from about 5% to about 15% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises the low molecular weight glycol.
 
                - 11. The process of claim 10, wherein from about 5% to about 20% by weight of the reduced pour point surfactant comprises the dialkyl sulfosuccinate.
 
                - 12. The process of claim 11, wherein from about 5% to about 15% by weight of the reduced pour point surfactant comprises water.
 
                - 13. A reduced pour point ethylene oxide/propylene oxide block copolymer surfactant composition prepared by mixing a parent ethylene oxide/propylene oxide block copolymer surfactant with a pour point depressant, said pour point depressant comprising: 
a. a low molecular weight glycol; b. water; and c. a dialkyl sulfosuccinate.
 
                - 14. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant of claim 13, wherein the dialkyl sulfosuccinate comprises a C4-C12 dialkyl sulfosuccinate.
 
                - 15. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant composition of claim 13, wherein the dialkyl sulfosuccinate comprises dioctyl sodium sulfosuccinate.
 
                - 16. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant composition of claim 13, wherein the low molecular weight glycol is selected from the group consisting of: propylene glycol, ethylene glycol, diethylene glycol, or mixtures thereof.
 
                - 17. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant of claim 13, wherein less than 85% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant composition comprises the parent ethylene oxide/propylene oxide block copolymer surfactant.
 
                - 18. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant of claim 17, wherein at least 5% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant composition comprises the dialkyl sulfosuccinate.
 
                - 19. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant of claim 18, wherein at least about 5% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant composition comprises water.
 
                - 20. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant of claim 19, wherein at least 5% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises the low molecular weight glycol.
 
                - 21. A reduced pour point ethylene oxide/propylene oxide block copolymer surfactant, wherein: 
a. less than about 85% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises a parent ethylene oxide/propylene oxide block copolymer surfactant; b. at least about 5% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises a low molecular weight glycol; c. at least about 5% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises a dialkyl sulfosuccinate; and d. at least about 5% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises water.
 
                - 22. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant of claim 21, wherein the dialkyl sulfosuccinate comprises a C4-C12 dialkyl sulfosuccinate.
 
                - 23. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant of claim 21, wherein the dialkyl sulfosuccinate comprises dioctyl sodium sulfosuccinate.
 
                - 24. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant of claim 21, wherein the low molecular weight glycol is selected from propylene glycol, ethylene glycol, diethylene glycol, or mixtures thereof.
 
                - 25. A reduced pour point ethylene oxide/propylene oxide block copolymer surfactant, wherein: 
a. from about 55% to about 85% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises a parent ethylene oxide/propylene oxide block copolymer surfactant; b. from about 5% to about 15% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises a low molecular weight glycol; c. from about 5% to about 20% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises a dialkyl sulfosuccinate; and d. from about 5% to about 15% by weight of the reduced pour point ethylene oxide/propylene oxide block copolymer surfactant comprises water.
 
                - 26. The reduced pour point ethylene oxide/propylene oxide block copolymer surfactant of claim 25, wherein the dialkyl sulfosuccinate comprises a C4-C12 dialkyl sulfosuccinate.
 
                - 27. The reduced pour point surfactant of claim 25, wherein the dialkyl sulfosuccinate comprises dioctyl sodium sulfosuccinate.
 
                - 28. The reduced pour point surfactant of claim 25, wherein the low molecular weight glycol is selected from propylene glycol, ethylene glycol, diethylene glycol, or mixtures thereof.
 
                - 29. A pour point depressant for reducing the pour point of ethylene oxide/propylene oxide block copolymer surfactants, wherein the pour point depressant comprises: 
a. a low molecular weight glycol; b. water; and c. a dialkyl sulfosuccinate.
 
                - 30. The pour point depressant of claim 29, wherein the low molecular weight glycol is selected from propylene glycol, ethylene glycol, diethylene glycol, or mixtures thereof.
 
                - 31. The pour point depressant of claim 29, wherein the dialkyl sulfosuccinate comprises a C4-C12 dialkyl sulfosuccinate.
 
                - 32. The pour point depressant of claim 29, wherein the dialkyl sulfosuccinate comprises dioctyl sodium sulfosuccinate.
 
        
                
                        Parent Case Info
        [0001] This application is a continuation-in-part of pending U.S. application Ser. No. 09/419,840 filed Oct. 15, 1999, currently still pending, the entire contents of which are herein incorporated fully by reference thereto.
                
                
                
                        Continuation in Parts (1)
        
            
                
                     | 
                    Number | 
                    Date | 
                    Country | 
                
            
            
    
        | Parent | 
            09419840 | 
        Oct 1999 | 
        US | 
    
    
        | Child | 
            09905237 | 
        Jul 2001 | 
        US |