The invention relates generally to irradiation engraving of a metal sheet and, more particularly, to reducing a dross welding phenomenon during the engraving.
In conventional IC manufacturing, recesses or grooves may be provided at selected locations in the surface of the lead frame in order to increase the contact area between the lead frame and the encapsulation (molding) material subsequently deposited on the lead frame. The increased contact area provides, for example, improved adhesion between the lead frame and the molding material. The recesses are sometimes formed by applying radiation to (i.e., irradiating) the lead frame at the locations selected for the recesses. For example, the locations may be irradiated with a laser. U.S. Patent Application Publication No. US 2010-0283135 (incorporated herein by reference) describes conventional examples of forming recesses or grooves in IC lead frames. The process of forming such recesses or grooves is also referred to herein as grooving or engraving.
When engraving the surface of the lead frame sheet metal using radiation such as a laser beam, a portion of the metal is melted and displaced to form the groove. This displaced metal piles up on the metal surface adjacent the groove in the form of metal particles. This accumulation of excess metal particles, or dross, should be removed so that it does not interfere with wire bonding or cause unwanted accumulation of a mold flash remnant after encapsulation. A smooth metal surface without accumulated dross is therefore desired.
Conventional techniques avoid dross accumulation by aiming an air jet at the groove to scatter dross particles away from the metal surface, and/or by applying vacuum suction to remove the dross particles. However, the present work has recognized that, because the displaced metal has been melted by irradiation, the dross includes molten metal particles that form a welding bond with the lead frame surface adjacent the grooves, making it difficult for conventional air jet and vacuum suction techniques to removing the welded particles from the lead frame surface.
It is therefore desirable to provide techniques that reduce and/or prevent the aforementioned dross welding phenomenon.
The present work provides techniques for lowering the temperature of the dross particles before they reach the metal surface adjacent the groove, thereby reducing and/or preventing the dross welding phenomenon, and permitting removal of the dross by techniques such as conventional air jets and/or vacuum suction.
Exemplary embodiments submerge the metal in a liquid during the irradiation engraving operation. Because the liquid is capable of effectively transferring heat away from the dross particles as they form, the particles are held at a lower temperature than in conventional irradiation engraving. This prevents or significantly reduces the dross welding phenomenon. Some embodiments immerse the metal in a flowing liquid, which aids in clearing away the dross. Some embodiments use conventional air jets and/or vacuum suction to clear away the dross after removing the metal from the liquid. Various embodiments use various combinations of flowing liquid, air jets and vacuum suction to clear the dross. The cooling effect of the liquid also helps protect the metal from irradiation damage that could otherwise impede subsequent wire bonding and soldering.
The liquid attenuates the power of the irradiation source, so the source applies less power to the metal surface than it would without the liquid immersion technique. Various embodiments match the liquid with the desired power delivery, for example, either selecting the liquid based on the power of an available source, or selecting the source power based on the attenuation characteristic of a selected liquid. Suitable combinations of irradiation power and immersion liquid are readily determined by empirical observations of various combinations. Various embodiments use various immersion liquids, for example, water, fluorinated wafer, and mineral oil of various specific weights.
In various embodiments, the thickness of the lead frame metal ranges between about 125 μm and about 200 μm. In some embodiments, the thickness of the lead frame metal is reduced by conventional mechanical processing to achieve a desired thickness prior to the engraving operation. In various embodiments, the grooves have a depth that ranges from 15% to 30% of the lead frame thickness, and a width that ranges from 0.1 mm to 0.25 mm. In some embodiments, the grooves have a straight trench configuration. In various embodiments, the grooves have various shapes, depths, and sizes. Engraving lead frames according to the aforementioned example dimensions and shapes is known in the art.
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In some embodiments, a sheet of transparent material such as glass is supported within the tank 15, interposed between the liquid 14 and the irradiation source 13. The radiation from the source 13 passes through the transparent sheet to perform the irradiation engraving. In flowing liquid embodiments, this arrangement accommodates a strong and stable flow of liquid.
Various embodiments produce grooves of various depths relative to the lead frame thickness, and grooves of various depths may be produced for any given embodiment. Any desired groove depth may be produced, including a depth equal to the thickness of the lead frame. Grooves of this latter depth thus constitute through-openings extending completely through the lead frame. As such, the term “groove” as used herein is intended to refer to a groove of any depth, including a through-opening. In some embodiments, the through-openings are significantly larger in size (i.e., area) than the other grooves. In some embodiments, a sequence of repeated irradiations is used to produce a groove of any desired depth. For example, a sequence of four irradiations may be applied to produce grooves twice as deep as those produced when a sequence of two irradiations is applied.
In some embodiments, the irradiation source 13 is selected based on the target metal. For example, some embodiments use a Green laser or UV (ultraviolet) laser as the radiation source 13 for a Cu alloy metal, and some embodiments use a CO2 laser as the irradiation source for a Fe alloy metal. In some embodiments, the irradiation source 13 has a wavelength in the microwave range.
Although the present work is described above, for expository purposes, with respect to engraving lead frames for integrated circuits, the engraving techniques of the present work are useful in other contexts, for example, in other applications where metal sheets are engraved by irradiation.
Although exemplary embodiments of the invention have been described above in detail, this does not limit the scope of the invention, which can be practiced in a variety of embodiments.