Silicon photonics is the study and application of photonic systems that use silicon as an optical medium. Silicon photonic devices can be made using existing semiconductor fabrication techniques, and because silicon is already used as the substrate for most integrated circuits, it is possible to create hybrid devices with optical and electronic components integrated onto a single microchip, thereby dramatically lowering the cost of photonics.
In the drawings:
Use of the same reference numbers in different figures indicates similar or identical elements.
As used herein, the term “includes” means includes but not limited to, the term “including” means including but not limited to. The terms “a” and “an” are intended to denote at least one of a particular element. The term “based on” means based at least in part on.
A backplane connects printed circuit boards (PCBs) together to form a computing system. The computing system may be a switch or a router, and the PCBs may be line cards that plug into the backplane of the switch or the router. An optical backplane is a backplane that uses optical channels instead of copper wires. The optical backplane connects optical PCBs that include silicon photonic chips, such as optical line cards, to achieve higher data transfer rates. The optical backplane may be passive or active. If active, the optical backplane may itself include silicon photonic chips.
A silicon photonic chip, also known as a photonic integrated circuit (IC) chip, may use an external light supply to provide the optical energy used by the chip to communicate with other devices chip-to-chip, board-to-board, shelf-to-shelf, rack-to-rack, or network-to-network. The external light supply may utilize laser light sources that have a limited lifespan. A malfunctioning external light supply in either an optical line card or an optical backplane may bring down the entire computing system and affect the other computing systems in an optical network. Thus the external light supply plays an important role in the operation of the silicon photonic chip and an external light supply with built-in redundancy helps to ensure seamless operation of optical communication.
In one example of the present disclosure, an external light supply includes a primary light source and a secondary light source with both their outputs connected to an optical coupler, which in turn has its output connected to a photonic silicon chip. The primary and the secondary light sources are respectively the active and the redundant sources of light energy to the photonic silicon chip. The primary light source has a small amount of its light energy diverted to trigger a sensor, which activates the secondary light source when the primary light source malfunctions. This small amount of light may be tapped out with an optical splitter. The sensor may be a phototransistor. With the light energy is above a threshold, the phototransistor turns off the power to the secondary light source. When the light energy diminishes, the phototransistor turns on the power to the secondary light source, which starts to provide light energy to the silicon photonic chip. This arrangement provides an undisrupted supply of light energy to the silicon photonic chip.
In one example, system 100 includes silicon photonic chip 104. Silicon photonic chip 104 may include integrated optical and electronic components. In one example, computing system 100 includes additional electrical and optical components to form a switch, a router, or a similar computing system.
In one example, external light supply 102 is a silicon photonic chip where silicon optical coupler 110, silicon optical splitter 112, and dark sensor 114 are formed on a silicon substrate. In one example, primary light source 106 and secondary light source 108 are also formed on the silicon substrate of silicon photonic chip 102. In another example, primary light source 106 and secondary light source 108 are discrete components mounted on silicon photonic chip 102. Primary light source 106 and secondary light source 108 may be lasers, such vertical-cavity side-emitting lasers (VCSELs). Alternatively another type of solid state lasers that is able to meet the wavelength requirements of the optical components as well as the phototransistors may be used.
Silicon photonic chip 102 includes optical channels 116, 120, and 122. Optical channel 116 couples primary light source 106 to optical coupler 110. Optical channel 120 couples secondary light source 108 to optical coupler 110. Optical channel 122 couples optical splitter 112 to dark sensor 114.
In one example, optical channels 116, 120, and 122 are optical fibers. In this example, optical coupler 110 includes silicon fiber couplers 124 and 126, a silicon Y-junction combiner 128, and a silicon fiber coupler 130. Optical fibers 116 and 120 are connected to respective inputs of silicon fiber couplers 124 and 126, which have outputs connected to respective inputs of silicon Y-junction combiner 128. Silicon Y-junction combiner 128 has an output connected to an input of silicon fiber coupler 130, which as an output connected to an optical fiber 124 that feeds silicon photonic chip 104.
Optical splitter 112 taps optical fiber 116 to divert part of the output from primary light source 106. Optical splitter 112 includes a silicon fiber coupler 132, a silicon Y-junction splitter 134, and silicon fiber couplers 136 and 138. An upstream portion of optical fiber 116 has an output connected to an input of silicon fiber coupler 132, which has an output connected to an input of silicon Y-junction splitter 134. Silicon Y-junction splitter 134 has outputs connected to respective inputs of silicon fiber coupler 136 and 138, which have outputs connected to respective inputs of a downstream portion of optical fiber 116 and optical fiber 122.
In another example, optical channels 116, 120, and 122 are silicon waveguides. In this example, optical coupler 110 may be directly connected to silicon waveguides 116 and 120 without any optical fibers and fiber couplers as the optical coupler and the silicon waveguides may be etched in silicon to form continuous paths. Optical coupler 110 may include silicon Y-junction combiner 128 and fiber coupler 130. Waveguides 116 and 120 are connected to respective inputs of silicon Y-junction combiner 128, which has an output connected to an input of silicon fiber coupler 130. Silicon fiber coupler 130 has an output connected to optical fiber 124, which is connected to silicon photonic chip 104. Optical splitter 112 taps waveguide 116 to divert part of the output from primary light source 106. In this example, optical splitter 112 may be directly connected to waveguides 116 and 122 without any optical fibers and fiber couplers as the optical splitter and the waveguides may be etched in silicon to form continuous paths. Optical splitter 112 may include silicon Y-junction splitter 134 having an input connected to an upstream portion of waveguide 116 and outputs connected to respective inputs of a downstream portion of waveguide 116 and waveguide 122.
In one example, dark sensor 114 includes a phototransistor that selectively couples secondary light source 108 to a power supply pin 118 providing a supply voltage Vcc.
In one example, dark sensor 114 includes a transistor and a photodetector, such as a photodiode, a light dependent resistor (LDR), or a solar cell, that together selectively couple secondary light source 108 to power supply pin 118 providing supply voltage Vcc.
In block 402, any output from a primary light source and any output from a secondary light source are combined into an input to silicon photonic chip 104. In one example, optical coupler 110 (
In block 404, part of the output from primary light source 106 is diverted. In one example, optical splitter 112 (
In block 406, the diverted part of the output from primary light source is sensed. In one example, dark sensor 114 (
In block 408, secondary light source 108 is selectively activated based on the sensing. In one example, dark sensor 114 selectively actives secondary light source 108 when it detects darkness.
Various other adaptations and combinations of features of the examples disclosed are within the scope of the invention.