Claims
- 1. A reforming catalyst which comprises from about 0.1 to about 2 percent platinum, from about 0.1 to about 2 percent iridium, from about 0.01 to about 0.1 percent copper, from about 0.001 to about 3 percent selenium, and from about 0.1 to about 2.5 percent halogen, composited with an inorganic oxide support.
- 2. The composition of claim 1 wherein the catalyst contains from about 0.2 to about 0.6 percent platinum.
- 3. The composition of claim 1 wherein the catalyst contains from about 0.2 to about 0.6 percent iridium.
- 4. The composition of claim 1 wherein catalyst contains from about 0.025 to about 0.08 percent copper.
- 5. The composition of claim 1 wherein the catalyst contains from about 0.01 to about 1 percent selenium.
- 6. The composition of claim 1 wherein the catalyst contains from about 0.7 to about 1.2 percent halogen.
- 7. The composition of claim 1 wherein the catalyst contains from about 0.2 to about 0.6 percent platinum, from about 0.2 to about 0.6 percent iridium, from about 0.01 to about 0.1 percent copper, from about 0.01 to about 1 percent selenium, from about 0.7 to about 1.2 percent halogen, and wherein the copper is composited with the catalyst in amount sufficient to provide an atom ratio of copper:platinum ranging from about 0.008:1 to about 1.54:1.
- 8. The composition of claim 1 wherein the catalyst is sulfided, and contains to about 0.2 percent sulfur.
- 9. The composition of claim 8 wherein catalyst contains from about 0.01 to about 0.1 percent sulfur.
- 10. The composition of claim 1 wherein the catalyst contains from about 0.2 to about 0.6 percent platinum, from about 0.2 to about 0.6 percent iridium, from about 0.01 to about 0.1 percent copper, and from about 0.01 to about 1 percent selenium.
- 11. The composition of claim 10 wherein the catalyst contains from about 0.7 to about 1.2 percent halogen.
- 12. The composition of claim 10 wherein the catalyst is sulfided, and contains from about 0.7 to about 1.2 percent sulfur.
RELATED APPLICATIONS
This is a continuation-in-part of application Ser. No. 053,375; filed June 29, 1979 and now U.S. Pat. No. 4,265,786.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
2848377 |
Webb |
Aug 1958 |
|
4265786 |
Eberly et al. |
May 1981 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
53375 |
Jun 1979 |
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