This application claims priority to Chinese Patent Application No. 202211620394.1 filed on Dec. 16, 2022, which is incorporated by reference herein in its entirety.
The present invention relates to the field of transport refrigeration vehicles, in particular to a refrigeration system for transport refrigeration vehicle and a heat dissipation method for electronic components therein.
Transport refrigeration vehicles play a crucial role in cold-chain transportation. In recent years, transport refrigeration vehicles based on new energy have developed rapidly. Compared to transport refrigeration vehicles based on traditional fuel vehicles, there are more and more electronic components such as transformers and inverters on vehicles, so the demand for heat dissipation of electronic components is increasing. The previous heat dissipation method for electronic components was to use an electronic component heat dissipation circuit, as shown in
The object of the present application is to solve or at least alleviate the problems existing in the prior art.
According to one aspect, a refrigeration system for a transport refrigeration vehicle is provided, comprising:
Optionally, in an embodiment of the refrigeration system, the main refrigeration circuit further comprises: an economizer between the condenser and the main throttling device, and a second branch extending from the main refrigeration circuit between the condenser and the main throttling device and is in communication with the EVI inlet of the compressor through a second throttling element and the economizer.
Optionally, in an embodiment of the refrigeration system, both the first branch and the second branch extend from upstream of the economizer, or, both the first branch and the second branch extend from downstream of the economizer, or, one of the first branch and the second branch extends from upstream of the economizer and the other extends from downstream of the economizer.
Optionally, in an embodiment of the refrigeration system, the first throttling element and the second throttling element are electronic expansion valves, where opening of the first throttling element and the second throttling element is dynamically controlled based on temperature of the electronic component.
Optionally, in an embodiment of the refrigeration system, when temperature of the electronic component is within a predetermined range, the opening of the first throttling element is increased while the opening of the second throttling element is reduced when the temperature of the electronic component increases, and the opening of the second throttling element is increased while the opening of the first throttling element is reduced when the temperature of the electronic component decreases.
Optionally, in an embodiment of the refrigeration system, the first branch and the second branch merge together before being connected to the EVI inlet, where a check valve that only allows fluid to flow to the EVI inlet is provided on a flow path after the first branch and the second branch merge together.
Optionally, in an embodiment of the refrigeration system, the electronic component heat dissipation circuit comprises a pump, an electronic component heat dissipation carrier, and an associated heat exchanger that are sequentially connected. Optionally, the electronic component heat dissipation circuit also comprises a radiator.
Optionally, in an embodiment of the refrigeration system, the electronic component includes a transformer and/or an inverter for the compressor.
A method for dissipating heat from an electronic component of a transport refrigeration vehicle is further provided, the method comprising:
Optionally, the method further comprises:
The device and method according to the embodiments of the present invention can provide sufficient heat dissipation to the electronic component of transport refrigeration vehicles to cope with extreme ambient temperatures, with substantially no impact on the main refrigeration circuit.
With reference to the accompanying drawings, the disclosure of the present application will become easier to understand. Those skilled in the art would easily understand that these drawings are for the purpose of illustration, and are not intended to limit the protection scope of the present application. Furthermore, in the figures, similar numerals are used to denote similar components, where:
Referring to
According to another aspect, the electronic component heat dissipation circuit 5 is used to provide heat dissipation for electronic components, such as transformers and/or an inverter for the compressor, or other electronic components on the vehicle that require heat dissipation. In the case of electric vehicles, for example, it can mean to provide heat dissipation for power batteries and related components. The heat dissipation circuit 5, adopts, for example, a water cooling form, such as using a water jacket in thermal association with the electronic component, thereby dissipating heat on the electronic component through the cooling medium, which can be water or other suitable liquids. An associated heat exchanger 52 is included in the electronic component heat dissipation circuit. In the associated heat exchanger 52, the cooling medium in the electronic component heat dissipation circuit 5 exchanges heat with the refrigerant from a first branch of the main refrigeration circuit. The first branch extends from the main refrigeration circuit between the condenser 2 and the main throttling device 3, such as from position a upstream of the economizer 6 in
In some embodiments, the main refrigeration circuit further includes: an economizer 6 between the condenser 2 and the main throttling device 3, and a second branch extending from the main refrigeration circuit between the condenser 2 and the main throttling device 3. In the embodiment shown in
In some embodiments, the first throttling element 81 and the second throttling element 82 are electronic expansion valves, and the opening of the first throttling element 81 and the second throttling element 82 is dynamically controlled based on the temperature of the electronic component. The specific control concept is to increase the refrigerant passing through the first branch when the temperature of the electronic component is relatively high and more heat dissipation is required, and to increase the refrigerant passing through the second branch or even close the first throttling element 81 when the temperature of the electronic component is relatively low and no more heat dissipation is required. Therefore, in some embodiments, when the temperature of the electronic component is within a predetermined range, such as between T1 to T2, the refrigeration system can be configured to increase the opening of the first throttling element 81 and reduce the opening of the second throttling element 82 when the temperature of the electronic component increases, and to increase the opening of the second throttling element 82 and reduce the opening of the first throttling element 81 when the temperature of the electronic component decreases. In some embodiments, if the temperature of the electronic component is lower than a predetermined temperature, such as T1, the first throttling element 81 can be kept closed. Furthermore, in some embodiments, the opening of the first throttling element 81 and the second throttling element 82 can also be controlled based on the ambient temperature. As the compressor operates at a certain frequency, the flow rate of the EVI inlet 13 of the compressor is constant. Therefore, as long as it is ensured that the first throttling element 81 and the second throttling element 82 are not closed at the same time, the refrigerant flow passing through the first and second branches can be allocated through the opening of the first throttling element 81 and the second throttling element 82, where this allocation has little impact on the main refrigeration circuit. In some embodiments, the first and second branches merge at, for example, position b, before being connected to the EVI inlet 13, where a check valve 83 that only allows fluid to flow to the EVI inlet 13 is arranged in the flow path after the merging of the first and second branches. In alternative embodiments, the first and second branches can be respectively provided with check valves before merging, or the first and second branches can be connected to the EVI inlet 13 of the compressor, respectively.
In some embodiments, the electronic component heat dissipation circuit 5 may include a pump 54, an electronic component heat dissipation carrier 53, and an associated heat exchanger 52 that are sequentially connected, and an optional expansion tank 51 may also be provided to accommodate extra cooling medium. The electronic component heat dissipation carrier 53 can be, for example, water pipes, water jacket, or the like that is in thermal association with the electronic component.
With continued reference to
According to another aspect, in the embodiment of
A method for dissipating heat from electronic components of transport refrigeration vehicles is further provided, the method comprising: branching a first part of refrigerant from a main refrigeration circuit between a condenser and a main throttling device; throttling the first part of refrigerant through a first expansion valve; bringing the first part of refrigerant after being throttled to exchange heat with cooling medium in an electronic component heat dissipation circuit; and returning the first part of refrigerant to an EVI inlet of a compressor.
In some embodiments, the method further comprises: branching a second part of refrigerant from the main refrigeration circuit between the condenser and the main throttling device; throttling the second part of refrigerant through a second expansion valve; bringing the second part of refrigerant after being throttled to exchange heat with remaining refrigerant in the main circuit; and returning the second part of refrigerant to the EVI inlet of the compressor; and wherein, the opening of the first expansion valve and the second expansion valve is controlled based on the temperature of the electronic component.
In some embodiments, the method further comprises: when the temperature of the electronic component is within a predetermined range, increasing the amount of the first part of refrigerant and reducing the amount of the second part of refrigerant when the temperature of the electronic component increases, and increasing the amount of the second part of refrigerant and reducing the amount of the first part of refrigerant when the temperature of the electronic component decreases. In some embodiments, when the temperature of the electronic component is lower than a predetermined temperature, the first part of refrigerant is cut off. Furthermore, in some embodiments, the amounts of the first and second parts of refrigerant can also be regulated based on the ambient temperature.
The device and method according to the present invention utilizes a part of refrigerant in the economizer branch of the main refrigeration circuit to dissipate heat from the electronic component. This can meet the heat dissipation demands of electronic components under extreme ambient temperatures and does not affect the refrigerant flow passing through the evaporator in the main refrigeration circuit, thus ensuring the refrigeration capacity of the main refrigeration circuit.
The specific embodiments described above in the present application are merely intended to describe the principles of the present application more clearly, wherein various components are clearly shown or described to facilitate the understanding of the principles of the present invention. Those skilled in the art may, without departing from the scope of the present application, make various modifications or changes to the present application. Therefore, it should be understood that these modifications or changes should be included within the scope of patent protection of the present application.
Number | Date | Country | Kind |
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202211620394.1 | Dec 2022 | CN | national |