Patent Application
20250224155
The present disclosure relates to a refrigerator including a thermoelectric element for cooling a storage compartment.
A refrigerator is a home appliance that keeps food fresh by including a main body including a storage compartment and a cold air supply device configured to supply cold air to the storage compartment.
A thermoelectric cooling device that performs heating and cooling functions through the Peltier effect may be used as the cold air supply device for the refrigerator. The thermoelectric cooling device may include a thermoelectric element. The thermoelectric element includes a heating portion formed on one side and a heat absorbing portion formed on the other side, and when a current is applied to the thermoelectric element, heat generation may occur in the heating portion and heat absorption may occur in the heat absorbing portion.
The thermoelectric cooling device may be equipped with a heat dissipation sink, a heat absorbing sink, a heat dissipation fan, a cooling fan, a heat dissipation duct, and a cooling duct, so as to increase the cooling efficiency of the storage compartment through the thermoelectric cooling device.
The present disclosure is directed to providing a refrigerator having increased cooling efficiency of a storage compartment through a thermoelectric cooling device.
Further, the present disclosure is directed to providing a refrigerator capable of preventing overheating of a thermoelectric cooling device.
Further, the present disclosure is directed to providing a refrigerator capable of preventing damage due to overheating of a thermoelectric cooling device.
In an aspect of the present disclosure a refrigerator may include: a main body; a storage compartment inside the main body; a thermoelectric module configured to cool the storage compartment and including: a thermoelectric element including: a heating portion configured to emit heat and a heat absorbing portion configured to absorb heat, and a heat dissipation sink configured to absorb heat from the heating portion and emit the absorbed heat; a blocking portion disposed in the heat dissipation sink to block a current from being supplied to the thermoelectric element based on a temperature of the heat dissipation sink exceeding a predetermined temperature.
The heat dissipation sink may include: a heat dissipation sink base that may be in contact with the heating portion, and a plurality of heat dissipation fins that may protrude from the heat dissipation sink base to an outside of the main body, and the blocking portion may be between two heat dissipation fins of the plurality of heat dissipation fins.
The refrigerator may include a heat absorbing sink configured to absorb heat from the storage compartment and transmit the absorbed heat to the heat absorbing portion. The heat absorbing sink may include: a heat absorbing sink base that may be in contact with the heat absorbing portion, and a plurality of cooling fins that may protrude from the heat absorbing sink base into the storage compartment. The refrigerator may include a fastening member, penetrating and coupling, the heat dissipation sink base and the heat absorbing sink base, and an insulating member that may be between the plurality of heat dissipation fins and may be configured to fix the fastening member.
The blocking portion may be between the heat dissipation sink base and the insulating member and may be fixed to the thermoelectric element.
The blocking portion may include: a blocking portion base, and a protrusion that may protrude upward from the blocking portion base, and the insulating member may include: an insulating member base, and a hook that may protrude downward from the insulating member base so as to be fixed to the protrusion.
The predetermined temperature of the heat dissipation sink may be 150° C., and the blocking portion may be configured to block the current from being supplied to the thermoelectric element based on the temperature of the heat dissipation sink exceeding the predetermined temperature of the heat dissipation sink.
The refrigerator may further include: a heat exchanger that may be arranged on a rear side of the storage compartment, and the thermoelectric element may be configured to cool air within the storage compartment while the heat exchanger cools air within the storage compartment.
The refrigerator may further include: a temperature sensor that may be on an outside of a heat dissipation fin of the plurality of heat dissipation fins that is at an outermost side of the plurality of heat dissipation fins.
The heat dissipation sink may include: a heat dissipation sink base that may be in contact with the heating portion, and a plurality of heat dissipation fins that may protrude from the heat dissipation sink base to an outside of the main body, and the blocking portion may be on an outside of a heat dissipation fin of the plurality of heat dissipation fins that is at an outermost side of the plurality of heat dissipation fins.
The refrigerator may further include: at least one temperature sensor that may be configured to detect a temperature of the thermoelectric module; and a processor that may be configured to block the current from being supplied to the thermoelectric element based on the temperature of the thermoelectric module, which may be detected by the at least one temperature sensor, exceeding the predetermined temperature of the thermoelectric module.
The thermoelectric module may include a heat absorbing sink configured to absorb heat from the storage compartment and transfer the absorbed heat to the heat absorbing portion, the at least one temperature sensor may include: a first temperature sensor that may be configured to detect a temperature of the heat dissipation sink, and a second temperature sensor that may be configured to detect a temperature of the heat absorbing sink, and the processor may be configured to block the current from being supplied to the thermoelectric element based on the temperature of the heat absorbing sink, which may be detected by the second temperature sensor, exceeding the predetermined temperature of the heat absorbing sink.
The refrigerator may further include: a user interface, wherein the processor may be configured to output, to the user interface, information related to whether the thermoelectric element has failed or has not failed that may be based on whether the blocking portion is blocking the current from being supplied to the thermoelectric element.
The refrigerator may further include: a user interface, wherein the processor may be configured to output, to the user interface, information related to whether the thermoelectric element has failed or has not failed that may be based on a change in the detected temperature of the thermoelectric module.
The thermoelectric module may include a heat absorbing sink configured to absorb heat from the storage compartment and transfer the absorbed heat to the heat absorbing portion. The at least one temperature sensor may include: a first temperature sensor that may be configured to detect a temperature of the heat dissipation sink, and a second temperature sensor that may be configured to detect a temperature of the heat absorbing sink, and the processor may be configured to output, to the user interface, information related to whether the thermoelectric element has failed or has not failed that may be based on a change in the detected temperature of the heat absorbing sink.
The refrigerator may further include: a heat exchanger configured to cool air within the storage compartment; and a compressor connected to the heat exchanger, wherein the processor may be configured to increase revolutions per minute (RPM) of the compressor based on the blocking portion blocking the current from being supplied to the thermoelectric element.
In an aspect of the present disclosure a refrigerator may include: a main body; a storage compartment inside the main body; a thermoelectric module configured to cool the storage compartment and including: a thermoelectric element including a heating portion and a heat absorbing portion, a heat dissipation sink, and a heat absorbing sink; and a blocking portion. The thermoelectric module may be configured so that, based on a current being supplied to the thermoelectric element, the heat absorbing portion absorbs heat from the heat absorbing sink to cool the heat absorbing sink, and heat generation occurs at the heating portion and the generated heat is transferred to the heat dissipation sink to be emitted by the heat dissipation sink to an outside of the thermoelectric module. The blocking portion may be configured to block the current from being supplied to the thermoelectric element based on at least one of a temperature of the thermoelectric module exceeding a predetermined temperature of the thermoelectric module, a temperature of the heat dissipation sink exceeding a predetermined temperature of the heat dissipation sink, a temperature of the heat absorbing sink exceeding a predetermined temperature of the heat absorbing sink, a temperature of the thermoelectric element exceeding a predetermined temperature of the thermoelectric element, and a temperature of the heating portion exceeding a predetermined temperature of the heating portion.
Another aspect of the present disclosure provides a refrigerator including: a storage compartment; a thermoelectric element including a heating portion and a heat absorbing portion, the thermoelectric element disposed in the storage compartment to discharge air, which is heated by the heating portion, to an outside of the storage compartment and to supply air, which is cooled by the heat absorbing portion, to the storage compartment; at least one temperature sensor configured to detect a temperature of the thermoelectric element; and a processor configured to block a current supplied to the thermoelectric element based on a temperature, which is detected by the at least one temperature sensor, exceeding a predetermined temperature.
Another aspect of the present disclosure provides a refrigerator including: a main body; a storage compartment formed inside the main body; a heat exchanger configured to evaporate a refrigerant to generate cold air; a thermoelectric cooling device configured to cool air in the storage compartment while the heat exchanger cools air in the storage compartment, and including a thermoelectric element a heating portion and a heat absorbing portion, the thermoelectric cooling device including a heat dissipation sink configured to absorb heat from the heating portion and emit the absorbed heat to an outside of the main body; and a fuse disposed in the heat dissipation sink to block a current supplied to the thermoelectric element in response to a temperature of the heat dissipation sink exceeding a predetermined temperature.
Various embodiments of the disclosure and terms used herein are not intended to limit the technical features described herein to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the corresponding embodiments.
In describing of the drawings, similar reference numerals may be used for similar or related elements.
The singular form of a noun corresponding to an item may include one or more of the items unless clearly indicated otherwise in a related context.
In the disclosure, phrases, such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together in the corresponding phrase among the phrases. As an example, a phrase such as “at least one of A, B, and C” may include any of the following: A, B, C, A and B, A and C, B and C, A and B and C.
As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Terms such as “1st”, “2nd”, “primary”, or “secondary” may be used simply to distinguish an element from other elements, without limiting the element in other aspects (e.g., importance or order).
Further, as used in the disclosure, the terms “front”, “rear”, “top”, “bottom”, “side”, “left”, “right”, “upper”, “lower”, and the like are defined with reference to the drawings, and are not intended to limit the shape and position of any element.
It will be understood that when the terms “includes”, “comprises”, “including”, and/or “comprising” are used in the disclosure, they specify the presence of the specified features, figures, steps, operations, components, members, or combinations thereof, but do not preclude the presence or addition of one or more other features, figures, steps, operations, components, members, or combinations thereof.
When a given element is referred to as being “connected to”, “coupled to”, “supported by” or “in contact with” another element, it is to be understood that it may be directly or indirectly connected to, coupled to, supported by, or in contact with the other element. When a given element is indirectly connected to, coupled to, supported by, or in contact with another element, it is to be understood that it may be connected to, coupled to, supported by, or in contact with the other element through a third element.
It will also be understood that when an element is referred to as being “on” another element, it may be directly on the other element or intervening elements may also be present.
A refrigerator according to an embodiment of the disclosure may include a main body.
The main body may include an insulation. The insulation may insulate an inside of the storage compartment from an outside of the storage compartment to maintain inside temperature of the storage compartment at appropriate temperature without being influenced by an external environment of the storage compartment. According to an embodiment of the disclosure, the insulation may include a foaming insulation such as polyurethane foam. According to an embodiment of the disclosure, the insulation may include a vacuum insulation in addition to a foaming insulation, or may be configured only with a vacuum insulation instead of a foaming insulation.
The storage compartment may store a variety of items, such as food, medicines, cosmetics, and the like, and the storage compartment may be configured to be open on at least one side for insertion and removal of the items.
The refrigerator may include one or more storage compartments. In a case in which two or more storage compartments are formed in the refrigerator, the respective storage compartments may have different purposes of use, and may be maintained at different temperatures. To this end, the respective storage compartments may be partitioned by a partition wall including an insulation.
The storage compartment may be maintained within an appropriate temperature range according to a purpose of use, and may include a “refrigerating compartment”, a “freezing compartment”, and a “temperature conversion compartment” according to purposes of use and/or temperature ranges. The refrigerating compartment may be maintained at an appropriate temperature to keep food refrigerating, and the freezing compartment may be maintained at an appropriate temperature to keep food frozen. The “refrigerating” may be keeping food cold without freezing the food, and for example, the refrigerating compartment may be maintained within a range of 0 degrees Celsius to 7 degrees Celsius. The “freezing” may be freezing food or keeping food frozen, and for example, the freezing compartment may be maintained within a range of −20 degrees Celsius to −1 degrees Celsius. The temperature conversion compartment may be used as either a refrigerating compartment or a freezing compartment according to or regardless of a user's selection.
The storage compartment may also be referred to by various terms, such as “vegetable compartment”, “freshness compartment”, “cooling compartment”, and “ice-making compartment”, in addition to “refrigerating compartment”, “freezing compartment”, and “temperature conversion compartment”, and the terms, such as “refrigerating compartment”, “freezing compartment”, “temperature conversion compartment”, etc., as used below are to be understood as representing storage compartments having the corresponding purposes of use and the corresponding temperature ranges.
The refrigerator according to an embodiment of the disclosure may include at least one door configured to open or close the open side of the storage compartment. The respective doors may be provided to open and close one or more storage compartments, or a single door may be provided to open and close a plurality of storage compartments. The door may be rotatably or slidably mounted to the front of the main body.
The door may seal the storage compartment in a closed state. The door, like the main body, may include an insulation to insulate the storage compartment in a closed state.
According to an embodiment, the door may include an outer door plate forming the front surface of the door, an inner door plate forming the rear surface of the door and facing the storage compartment, an upper cap, a lower cap, and a door insulation provided therein.
A gasket may be provided on the edge of the inner door plate to seal the storage compartment by coming into close contact with the front surface of the main body when the door is closed. The inner door plate may include a dyke that protrudes rearward to allow a door basket for storing items to be fitted.
According to an embodiment, the door may include a door body and a front panel that is detachably coupled to the front of the door body and forming the front surface of the door. The door body may include an outer door plate forming the front surface of the door body, an inner door plate forming the rear surface of the door body and facing the storage compartment, an upper cap, a lower cap, and a door insulator provided therein.
The refrigerator may be classified as French Door Type, Side-by-side Type, Bottom Mounted Freezer (BMF), Top Mounted Freezer (TMF), or Single Door Refrigerator according to the arrangement of the doors and the storage compartments.
The refrigerator according to an embodiment of the disclosure may include a cold air supply device for supplying cold air to the storage compartment.
The cold air supply device may include a machine, an apparatus, an electronic device, and/or a combination system thereof, capable of generating cold air and guiding the cold air to cool the storage compartment.
According to an embodiment of the disclosure, the cold air supply device may generate cold air through a cooling cycle including compression, condensation, expansion, and evaporation processes of refrigerants. To this end, the cold air supply device may include a refrigeration cycle device having a compressor, a condenser, an expander, and an evaporator to drive the refrigeration cycle. According to an embodiment of the disclosure, the cold air supply device may include a semiconductor, such as a thermoelectric element. The thermoelectric element may cool the storage compartment by heating and cooling actions through the Peltier effect.
The refrigerator according to an embodiment of the disclosure may include a machine compartment in which at least some components belonging to the cold air supply device are installed.
The machine compartment may be partitioned and insulated from the storage compartment to prevent heat generated by the components installed in the machine compartment from being transferred to the storage compartment. To dissipate heat from the components installed in the machine compartment, the machine compartment may communicate with outside of the main body.
The refrigerator according to an embodiment of the disclosure may include a dispenser provided on the door to provide water and/or ice. The dispenser may be provided on the door to allow access by the user without opening the door.
The refrigerator according to an embodiment of the disclosure may include an ice-making device that produces ice. The ice-making device may include an ice-making tray that stores water, an ice-moving device that separates ice from the ice-making tray, and an ice-bucket that stores ice produced in the ice-making tray.
The refrigerator according to an embodiment of the disclosure may include a controller for controlling the refrigerator.
The controller may include a memory for storing and/or recording data and/or programs for controlling the refrigerator, and a processor for outputting control signals for controlling the cold air supply device, etc. in accordance with the programs and/or data stored in the memory.
The memory may store or record various information, data, instructions, programs, and the like necessary for operation of the refrigerator. The memory may store temporary data generated while generating control signals for controlling components included in the refrigerator. The memory may include at least one of a volatile memory or a non-volatile memory, or a combination thereof.
The processor may control the overall operation of the refrigerator. The processor may control the components of the refrigerator by executing programs stored in memory. The processor may include a separate neural processing unit (NPU) that performs an artificial intelligence (AI) model operation. In addition, the processor may include a central processing unit (CPU), a graphics processor (GPU), and the like. The processor may generate a control signal to control the operation of the cold air supply device. For example, the processor may receive temperature information of the storage compartment from a temperature sensor and generate a cooling control signal to control an operation of the cold air supply device based on the temperature information of the storage compartment.
Furthermore, the processor may process a user input of a user interface and control an operation of the user interface in accordance with the programs and/or data memorized/stored in the memory. The user interface may be provided with an input interface and an output interface. The processor may receive the user input from the user interface. In addition, the processor may transmit a display control signal and image data for displaying an image on the user interface to the user interface in response to the user input.
The processor and memory may be provided integrally or may be provided separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one sub-processor. The memory may include one or more memories.
The refrigerator according to an embodiment of the disclosure may include a processor and a memory for controlling all of the components included in the refrigerator, and may include a plurality of processors and a plurality of memories for individually controlling the components of the refrigerator. For example, the refrigerator may include a processor and a memory for controlling the operation of the cold air supply device in accordance with to an output of the temperature sensor. In addition, the refrigerator may be separately provided with a processor and a memory for controlling the operation of the user interface in accordance with the user input.
A communication module may communicate with external devices, such as servers, mobile devices, and other home appliances via a nearby access point (AP). The AP may connect a local area network (LAN) to which a refrigerator or a user device is connected to a wide area network (WAN) to which a server is connected. The refrigerator or the user device may be connected to the server via the WAN.
The input interface may include keys, a touch screen, a microphone, and the like. The input interface may receive the user input and pass the received user input to the processor.
The output interface may include a display, a speaker, and the like. The output interface may output various notifications, messages, information, and the like generated by the processor.
Hereinafter, various embodiments according to the disclosure will be described in detail with reference to the accompanying drawings.
Referring to
The main body 100 may include an inner case 170, an outer case 180 coupled to the outside of the inner case 170, and an insulating material 190 disposed between the inner case 170 and the outer case 180 (refer to
Further, the main body 100 may include an upper wall 110, a lower wall 120, a left wall 130, a right wall 140, and a rear wall 150. The upper wall 110, the lower wall 120, the left wall 130, the right wall 140, and the rear wall 150 may form an upper surface, a lower surface, a left surface, a right surface and a rear surface of the main body 100, respectively.
The upper wall 110, the lower wall 120, the left wall 130, the right wall 140, and the rear wall 150 may each be formed with the inner case 170, the outer case 180 and the insulating material 190. For example, an upper surface of the upper wall 110 may be formed by the outer case 180, a lower surface of the upper wall 110 may be formed by the inner case 170, and the insulating material 190 may be disposed inside the upper wall 110.
The storage compartments 11, 12, 13 may accommodate goods. The storage compartments 11, 12, and 13 may be formed with an open front side to allow goods to be inserted thereinto or withdrawn therefrom. The main body 100 may include a horizontal partition 160 provided to divide a first storage compartment 11 from a second storage compartment 12 and a third storage compartment 13, and a vertical partition 161 provided to divide the second storage compartment 12 from the third storage compartment 13. The first storage compartment 11 may be provided in an upper portion of the main body 100, and the second storage compartment 12 and the third storage compartment 13 may be provided in a lower portion of the main body 100. The first storage compartment 11 may be a refrigerating compartment, the second storage compartment 12 may be a freezing compartment, and the third storage compartment 13 may be a variable temperature compartment.
The doors 21, 22, 23, and 24 may open and close the storage compartments 11, 12, and 13. A first door 21 and a second door 22 may open and close the first storage compartment 11, a third door 23 may open and close the second storage compartment 12, and a fourth door 24 may open and close the third storage compartment 13. The doors 21, 22, 23, and 24 may be rotatably coupled to the main body 100.
The doors 21, 22, 23, and 24 may be rotatably coupled to the main body 100 by a hinge. For example, the first door 21 and the second door 22 may be rotatably coupled to the main body 100 by a hinge 31 disposed in the upper portion of the main body 100 and a hinge disposed in a middle portion of the main body 100. The hinge 31 may include a hinge pin that protrudes in a vertical direction to form a rotation axis of the door. The hinge 31 may be covered by a top cover 300 provided to cover a front upper surface of the main body 100.
One of the first door 21 and the second door 22 may be provided with a rotation bar 40 provided to cover a gap formed between the first door 21 and the second door 22 when the first door 21 and the second door 22 are closed. The rotation bar 40 may be rotatably provided on one of the first door 21 and the second door 22. The rotation bar 40 may have a bar shape that is elongated in the vertical direction. The rotation bar 40 may also be referred to as ‘pillar’, ‘mullion’, etc.
A guide protrusion 46 may be provided at an upper end of the rotation bar 40, and a rotation guide 119 provided to guide a rotation of the guide protrusion 46 may be provided in the upper portion of the main body 100.
The doors 21, 22, 23, and 24 may include a gasket 51. The gasket 51 may be in close contact with a front surface of the main body 100 when the doors 21, 22, 23, and 24 are closed. The doors 21, 22, 23, and 24 may include a dyke 52 protruding rearward. The dyke 52 may be equipped with a door shelf 53 provided to store goods. The rotation bar 40 may be rotatably installed on the dyke 52.
The number and arrangement of storage compartments and the number and arrangement of doors are described above, but the number and arrangement of storage compartments and the number and arrangement of doors of the refrigerator according to one embodiment of the present disclosure are not limited thereto.
The refrigerator 1 may include a thermoelectric cooling device 400 configured to cool the storage compartment 11.
Thermoelectric cooling device 400 may be disposed on the upper side of the storage compartment 11 to cool the storage compartment 11. That is, the thermoelectric cooling device may be provided on the upper wall 110 of the main body 100.
The thermoelectric cooling device 400 may include a thermoelectric element 530. The thermoelectric element 530 may be a semiconductor element configured to convert thermal energy into electrical energy using the thermoelectric effect, and may also be referred to as ‘thermoelectric semiconductor element’, ‘Peltier element’, etc.
The thermoelectric element 530 includes a heating portion 531 and a heat absorbing portion 532. When a current is applied to the thermoelectric element 530, heat generation may occur in the heating portion 531 and heat absorption may occur in the heat absorbing portion 532. The thermoelectric element 530 may have a thin hexahedral shape. The heating portion 531 may be disposed on one surface of the thermoelectric element 530 and the heat absorbing portion 532 may be disposed on the opposite surface.
The heating portion 531 may face the outside of the main body 100 and the heat absorbing portion 532 may face the inside of the storage compartment 11. For example, the thermoelectric element 530 may be provided on the upper wall 110 in such a way that the heating portion 531 faces above the thermoelectric element 530 and the heat absorbing portion 532 faces below the thermoelectric element 530. Accordingly, air warmed by the heat exchange with the heating portion 531 may be discharged to the outside of the main body 100, and air cooled by the heat exchange with the heat absorbing portion 532 may be supplied to the storage compartment 11.
The thermoelectric cooling device 400 may include a heat dissipation sink 520 in contact with the heating portion 531 to efficiently exchange heat between the heating portion 531 and the air outside the main body 100.
The heat dissipation sink 520 may be disposed outside the main body 100. The heat dissipation sink 520 may be in contact with the heating portion 531 to absorb heat from the heating portion 531 and emit the heat to the outside of the main body 100. The heat dissipation sink 520 may also be referred to as ‘hot sink’, ‘dissipation heat sink’, ‘hot heat sink’, etc.
The heat dissipation sink 520 may be formed of a metal material with relatively high thermal conductivity. For example, the heat dissipation sink 520 may be formed of aluminum or copper.
The heat dissipation sink 520 may include a heat dissipation sink base 521 in contact with the heating portion 531 and a plurality of heat dissipation fins 525 protruding from the heat dissipation sink base 521 to increase a heat transfer area. The plurality of heat dissipation fins 525 may protrude upward from the heat dissipation sink base 521.
The thermoelectric cooling device 400 may include a heat absorbing sink 570 in contact with the heat absorbing portion 532 to efficiently exchange heat between the heat absorbing portion 532 and the air inside the storage compartment 11.
The heat absorbing sink 570 may be disposed inside the storage compartment 11. The heat absorbing sink 570 may cool the storage compartment 11 by absorbing heat from the storage compartment 11 and transferring the heat to the heat absorbing portion 532. The heat absorbing sink 570 may also be referred to as ‘cold sink’, ‘cooling sink’, ‘cooling heat sink’, ‘cold heat sink’, ‘cooling heat sink’, etc.
The heat absorbing sink 570 may be formed of a metal material with relatively high thermal conductivity. For example, the heat absorbing sink 570 may be formed of aluminum or copper.
The heat absorbing sink 570 may include a heat absorbing sink base 571 in contact with the heat absorbing portion 532 and a plurality of cooling fins 575 protruding from the heat absorbing sink base 571 to increase a heat transfer area. The plurality of cooling fins 575 may protrude downward from the heat absorbing sink base 571. The heat absorbing sink base 571 and the plurality of cooling fins 575 may be formed integrally with each other.
The thermoelectric cooling device 400 may include a heat dissipation fan 600 configured to move air to efficiently exchange heat between the heat dissipation sink 520 and the air outside the main body 100.
The heat dissipation fan 600 may be configured to blow air toward the heat dissipation sink 520. The heat dissipation fan 600 may be disposed in the horizontal direction of the heat dissipation sink 520. The heat dissipation fan 600 may be disposed outside the main body 100. The heat dissipation fan 600 may be provided on the upper side of the upper wall 110.
For example, the heat dissipation fan 600 may be a centrifugal fan configured to draw in air in an axial direction and discharge the drawn air to radial directions. The centrifugal fan may include a blower fan. A rotating shaft 610 of the heat dissipation fan 600 may be disposed perpendicular to the upper surface of the upper wall 110.
The thermoelectric cooling device 400 may include a heat dissipation duct 700 configured to guide air flowing by the heat dissipation fan 600. The heat dissipation duct 700 may draw in air outside the main body 100 and guide the drawn air to exchange heat with the heat dissipation sink 520, and discharge the air, which exchanges heat with the heat dissipation sink 520, back to the outside of the main body 100.
The heat dissipation duct 700 may draw in air in an external space on the upper side of the main body 100. The heat dissipation duct 700 may discharge air, which exchanges heat with the heat dissipation sink 520, to the external space on the upper side of the main body 100. The heat dissipation fan 600 may be disposed inside the heat dissipation duct 700. The heat dissipation sink 520 may be disposed inside the heat dissipation duct 700. The heat dissipation duct 700 may be provided on the upper surface of the upper wall 110.
The heat dissipation duct 700 may include an outside air intake port 751 provided to draw in air outside the main body 100 to the inside of the heat dissipation duct 700, and an outside air discharge port 782 provided to discharge air, which exchanges heat with the heat dissipation sink 520, to the outside of the main body 100 (refer to
The thermoelectric cooling device 400 may include a cooling fan 800 configured to move air to efficiently exchange heat between the heat absorbing sink 570 and the air inside the storage compartment 11.
The cooling fan 800 may be configured to move and/or blow air toward the heat absorbing sink 570. The cooling fan 800 may be disposed in the horizontal direction of the heat absorbing sink 570. The cooling fan 800 may be disposed inside the storage compartment 11. The cooling fan 800 may be disposed on the lower side of the upper wall 110.
For example, the cooling fan 800 may be a centrifugal fan configured to draw in air in the axial direction and discharge the drawn air to the radial directions. A rotating shaft 810 of the cooling fan 800 may be disposed perpendicular to the lower surface of the upper wall 110.
The thermoelectric cooling device 400 may include a cooling duct 900 provided to guide air flowing by the cooling fan 800. The cooling duct 700 may draw in air inside the storage compartment 11 and guide the drawn air to exchange heat with the heat absorbing sink 570, and discharge the air, which exchanges heat with the heat absorbing sink 570, back into the storage compartment 11.
The cooling fan 800 may be disposed inside the cooling duct 900. The heat absorbing sink 570 may be disposed inside the cooling duct 900. The cooling duct 800 may be provided on the lower surface of the upper wall 110.
The cooling duct 900 may include an inside air intake port 991 provided to draw in air inside the storage compartment 11 to the inside of the cooling duct 900, and an inside air discharge port 992 provided to discharge air, which exchanges heat with the heat absorbing sink 570, to the inside of the storage compartment 11.
Referring to
The refrigerator 1 may include evaporator ducts 60 and 70 provided to guide cold air generated in the evaporator 3. A first evaporator duct 60 may be provided at the rear of the second storage compartment 12 and the third storage compartment 13. A second evaporator duct 70 may be provided at the rear of the first storage compartment 11.
Cold air generated in the evaporator 3 may be drawn into the first evaporator duct 60 by an evaporator fan 80. The cold air drawn into the first evaporator duct 60 may be discharged into the second storage compartment 12 or the third storage compartment 13 through a cold air outlet (not shown) formed in a front portion of the first evaporator duct 60. Additionally, the cold air drawn into the first evaporator duct 60 may be guided to an internal flow path 78 of the second evaporator duct 70. The first evaporator duct 60 may be provided with a damper 61 provided to control the supply of cold air inside the first evaporator duct 60 to the second evaporator duct 70. A connection duct 90 may be provided between the first evaporator duct 60 and the second evaporator duct 70 to connect the first evaporator duct 60 and the second evaporator duct 70.
The cold air introduced into the internal flow path 78 of the second evaporator duct 70 may be supplied to the first storage compartment 11 through the cold air outlet 72 formed on in a front portion of the second evaporator duct 70.
However, unlike the above embodiment, cold air generated in the evaporator 3 may be supplied directly to the second evaporator duct 70 without passing through the first evaporator duct 60. Alternatively, a separate evaporator 3 may be provided at the rear of the first storage compartment 11, thereby supplying cold air to the second evaporator duct 70.
As mentioned above, the refrigerator 1 according to one embodiment of the present disclosure may include the thermoelectric cooling device and the refrigeration cycle device for cooling the storage compartment 11. Accordingly, a method of supplying cold air to the storage compartment 11 may include a first method of supplying only cold air generated by the thermoelectric cooling device 400, a second method of supplying only cold generated by the refrigeration cycle device, and a third method of supplying both cold generated by the thermoelectric cooling device and cold air generated by the refrigeration cycle device.
The refrigerator 1 may supply cold air to the storage compartment 11 in an appropriate manner according to external and internal conditions. For example, the refrigerator 1 may cool the storage compartment 11 using one method according to a temperature of an indoor space in which the refrigerator 1 is installed. That is, when an indoor temperature is higher than a predetermined temperature, and cooling by the refrigeration cycle device is more efficient than cooling by the thermoelectric cooling device 400, the storage compartment 11 may be cooled only with cold generated by the refrigeration cycle device. Conversely, when the indoor temperature is lower than the predetermined temperature and cooling by the thermoelectric cooling device 400 is more efficient than cooling by the refrigeration cycle device, the storage compartment 11 may be cooled only with the cold generated by the thermoelectric cooling device 400. The refrigerator 1 may only operate the thermoelectric cooling device 400 when it is required to reduce noise. When it is required to rapidly cool the storage compartment 11, the refrigerator 1 may simultaneously supply cold air generated through the thermoelectric cooling device 400 and cold air generated through the refrigeration cycle device to the storage compartment 11.
As mentioned above, according to one embodiment of the present disclosure, the refrigerator may include the thermoelectric cooling device 400 and the refrigeration cycle device, but the present disclosure is not limited thereto. Alternatively, the refrigerator may include only the thermoelectric cooling device 400.
A configuration of a thermoelectric module and an installation structure of the thermoelectric module of the thermoelectric cooling device according to one embodiment of the present disclosure will be described with reference to
The main body 100 of the refrigerator 1 may include the inner case 170 forming the storage compartment and the outer case 180 coupled to the outside of the inner case 170. The insulating material 190 provided to insulate the storage compartment 11 may be disposed between the inner case 170 and the outer case 180. The inner case 170 may include an inner case opening 171. The outer case 180 may include an outer case opening 181.
The inner case opening 171 may be formed larger than the outer case opening 181. However, unlike this embodiment, the inner case opening 171 and the outer case opening 181 may be formed to have the same size. In this case, a connection frame 200, which will be described later, may be composed of only a connection frame body 270 without a connection frame base 210.
The main body 100 may include the connection frame 200 disposed between the inner case 170 and the outer case 180 to connect the inner case opening 171 and the outer case opening 181 so as to form a through-hole 115 penetrating the upper wall 110.
One surface of the connection frame 200 may be supported on an inner surface of the inner case 170 (a surface facing the insulating material), and the other surface of the connection frame 200 may be supported on an inner surface of the outer case 180 (a surface facing the insulating material).
In a state in which the connection frame 200 is disposed between the inner case 170 and the outer case 180, an insulating space may be formed by the inner case 170, the outer case 180, and the connection frame 200. By filling and foaming the insulating space with a foamed insulating material, the inner case 170, the outer case 180, and the connection frame 200 may be coupled to each other. The connection frame 200 may be formed of a material with relatively low thermal conductivity. The connection frame 200 may be formed of a resin material.
The connection frame 200 may include the frame base 210 connected to the inner case opening 171, and the frame body 270 protruding from an upper surface of the frame base 210 and connected to the outer case opening 181.
The frame base 210 may have a size corresponding to a size of the inner case opening 171. The frame base 210 may include a frame base opening 211. The frame base opening 211 may have a size corresponding to a size of the outer case opening 181.
The frame body 270 may have a rectangular frame shape with a predetermined thickness. The frame body 270 may include a frame body opening 271. The frame body opening 271 may have a size corresponding to the size of the outer case opening 181. The frame base opening 211 and the frame body opening 271 may form the through-hole 115 of the upper wall 110.
The frame base 210 and the frame body 270 may be provided separately and coupled to each other. The frame base 210 and the frame body 270 may be coupled through a frame coupling member 201. For this, a coupling hole 240 may be formed in the frame base 210 and a coupling hole 280 may be formed in the frame body 270. The frame coupling member 201 may be a coupling mechanical element such as screw, pin, bolt, rivet, etc. However, the frame base 210 and the frame body 270 may be formed integrally with each other.
The frame base 210 may include a base protrusion 230 protruding upward. An accommodating space may be recessed on a lower surface of the base protrusion 230 to accommodate a portion of the cooling duct 900.
The thermoelectric cooling device 400 may include the thermoelectric module 500.
The thermoelectric element 530, the heat dissipation sink 520, and the heat absorbing sink 570 described above may be assembled integrally to form the thermoelectric module 500. That is, the thermoelectric module 500 may include the thermoelectric element 530, the heat dissipation sink 520, the heat absorbing sink 570, and a module plate 550.
As illustrated in
The module plate 550 may serve as a framework for the thermoelectric module. The module plate 550 may be formed of a resin material with relatively low thermal conductivity. The module plate 550 may maintain a gap between the heat dissipation sink 520 and the heat absorbing sink 570 and support the heat dissipation sink 520 and the heat absorbing sink 570. The module plate 550 may be formed integrally with a fan case 650, which will be described later. However, the module plate 550 may be provided separately from the fan case 650.
The module plate 550 may include a heat dissipation sink support portion 552 provided to support the heat dissipation sink 520.
The module plate 550 may include a module plate opening 551. The thermoelectric element 530 may be disposed inside the module plate opening 551. A vertical length of the module plate opening 551 may be greater than a vertical length of the thermoelectric element 530, and the thermoelectric element 530 may be disposed at an upper end portion of the module plate opening 551. The reason why the thermoelectric element 530 is disposed at the upper end portion of the module plate opening 551 is that a heat generation amount of the thermoelectric element 530 is generally greater than a heat absorption amount, and it is appropriate that the thermoelectric element 530 is located at the upper end portion of the module plate opening 551, in terms of the heat dissipation of the heating portion 531.
Therefore, because the thermoelectric element 530 is disposed on the upper end portion of the module plate opening 551, the heat absorbing sink 570 may include a cooling conductive portion 574 protruding from the heat absorbing sink base 571 to be in contact with the heat absorbing portion 532 of the thermoelectric element 530.
The thermoelectric module 500 may include an element insulating material 540 provided to insulate the module plate 550 and the thermoelectric element 530. The element insulating material 540 may be disposed in the module plate opening 551 to prevent side surfaces of the thermoelectric device 530 from being in contact with the module plate 550. The element insulating material 540 may include an element insulating material opening 541, and the thermoelectric device 530 may be accommodated in the element insulating material opening 541.
The thermoelectric module 500 may include a sink insulating material 580 disposed between the module plate 550 and the heat absorbing sink 570. The sink insulating material 580 may prevent heat from being transferred between the heat dissipation sink 520 and the heat absorbing sink 570 through the module plate 550. The sink insulating material 580 may include a sink insulating material opening 581. However, the sink insulating material 580 may be omitted. In this case, the heat dissipation sink 520 may be supported on the upper surface of the module plate 550 and the heat absorbing sink 570 may be supported on the lower surface of the module plate 550.
Referring to
The fan case 650 may include a case bottom 660 on which the heat dissipation fan 600 is rotatably installed, and a case scroll portion 670 extending upward from an edge of the case bottom 660 to guide air, which is blown by the heat dissipation fan 600, to the heat dissipation sink 520. The heat dissipation fan 600 may be a centrifugal fan and may be installed on the case bottom 660 to allow the rotating shaft 610 to be perpendicular to the case bottom 660. Additionally, the heat dissipation sink 520 may be disposed in one radial direction of the heat dissipation fan 600. With this structure, the overall vertical length of the thermoelectric cooling device 400 may be reduced and thus the thermoelectric cooling device 400 may be compact.
The case scroll portion 670 may be formed to surround the heat dissipation fan 600. The case scroll portion 670 may include a scroll portion opening 673 provided to open toward the heat dissipation sink 520. The case scroll portion 670 may include a downstream end 671 with respect to a rotation direction R of the heat dissipation fan 600 and an upstream end 672 with respect to the rotation direction R.
The downstream end 671 and the upstream end 672 may be spaced apart from each other, and the scroll portion opening 673 may be formed between the downstream end 671 and the upstream end 672.
Air blown by the heat dissipation fan 600 may be discharged in the radial directions of the heat dissipation fan 600 and move toward the heat dissipation sink 520 along an inner surface of the case scroll portion 670. Accordingly, the air blown by the heat dissipation fan 600 may flow more to a vicinity of the downstream end 671 of the case scroll portion 670 than a vicinity of the upstream end 672 of the case scroll portion 670.
The fan case 650 may include a case guide 680 provided to guide air that flows from the heat dissipation fan 600 to the vicinity of the downstream end 671 of the case scroll portion 670.
The case guide 680 may protrude upward from the case bottom 660. The case guide 680 may be spaced apart from the case scroll portion 670. The case guide 680 may guide air, which flows to the vicinity of the downstream end 671 of the case scroll portion 670, toward the upstream end 672 of the case scroll portion 670. Accordingly, the air blown from the heat dissipation fan 600 may be evenly distributed to heat dissipation channels 528 of the heat dissipation sink 520 by the case guide 680, and the heat exchange efficiency of the heat dissipation sink 520 may be increased.
Referring to
The plurality of heat dissipation fins 525 may be formed to extend in a second direction 527 parallel to the upper surface 522 of the heat dissipation sink base 521. The second direction 527 may be perpendicular to the first direction 526. The heat dissipation channels 528 may be formed between a plurality of heat dissipation fins 525 adjacent to each other. The heat dissipation channels 528 may extend in the second direction 527 in the same as the plurality of heat dissipation fins 525. Among the heat dissipation channels 528, some heat dissipation channels 529 may have a larger width than other heat dissipation channels.
Air moving by the heat dissipation fan 600 may pass through the heat dissipation channels 528 and exchange heat with the plurality of heat dissipation fins 525. An airflow (A) flowing by the heat dissipation fan 600 may pass through the heat dissipation channels 528 in a direction parallel to the second direction 527.
Referring to
The plurality of cooling fins 575 may be formed to extend in a second direction 577 in parallel with the lower surface 572 of the heat absorbing sink base 571. The second direction 577 may be perpendicular to the first direction 576. Cooling channels 578 may be formed between the plurality of cooling fins 575 adjacent to each other. Among the cooling channels 578, some cooling channels 579 may have a larger width than other cooling channels 578.
Air moving by the cooling fan 800 may pass through the cooling channels 578 and exchange heat with the plurality of cooling fins 575. An airflow (B) flowing by the cooling fan 800 may pass through the cooling channels 578 in a direction parallel to the second direction 577.
The thermoelectric cooling device 400 may further include a fastening member 596. The fastening member 596 may penetrate the heat dissipation sink 520 and the heat absorbing sink 570 to couple, fasten, and/or fix the heat dissipation sink 520 and the heat absorbing sink 570. For example, the fastening member 596 may penetrate the heat dissipation sink base 521 and the heat absorption sink base 571 to couple the heat dissipation sink base 521 and the heat absorption sink base 571. The fastening member 596 may include a plurality of fastening members 596.
The fastening member 596 may extend in one direction. For example, the fastening member 596 may extend in the vertical direction. For example, a head 596a of the fastening member 596 may be disposed on a side of the heat dissipation sink 520, and an extension 596b may penetrate the heat dissipation sink 520 and the heat absorbing sink 570 (refer to
The thermoelectric cooling device 400 may further include insulating members 593 and 594. The insulating members 593 and 594 may reduce heat transfer between the heat dissipation sink 520 and the heat absorbing sink 570 through the fastening member 596. The insulating members 593 and 594 may include a material having a low heat transfer rate. For example, the insulating members 593 and 594 may include plastic.
The insulating members 593 and 594 may be disposed between the plurality of heat dissipation fins 525 and/or the plurality of cooling fins 575. The insulating members 593 and 594 may be provided to surround the fastening members 596. The insulating members 593 and 594 may extend along the extension direction of the fins. The insulating members 593 and 594 may be referred to as insulating washers.
The insulating members 593 and 594 may include a plurality of insulating members 593 and 594. The plurality of insulating members 593 and 594 may include a first insulating member 593 and a second insulating member 594.
The first insulating member 593 may be inserted and/or mounted into the heat dissipation sink base 521. The first insulating member 593 may be disposed between the plurality of heat dissipation fins 525. The first insulating member 593 may be disposed on the heat dissipation sink base 521. For example, in the upper portion of the heat dissipation sink base 521, the first insulating member 593 may surround the fastening member 596. The first insulating member 593 may include a plurality of first insulating members 593. For example, the number of first insulating members 593 may correspond to the number of fastening members 596. The first insulating member 593 may be referred to as a heat dissipation insulating member.
The second insulating member 594 may be inserted and/or mounted into the heat absorbing sink base 571. The second insulating member 594 may be disposed between the plurality of cooling fins 575. The second insulating member 594 may be disposed under the heat absorbing sink base 571. For example, in the lower portion of the heat absorbing sink base 571, the second insulating member 594 may surround the fastening member 596. The second insulating member 594 may include a plurality of second insulating members 594. For example, the number of second insulating members 594 may correspond to the number of fastening members 596. The second insulating member 594 may be referred to as a cooling insulating member.
The thermoelectric cooling device 400 may further include a blocking portion 590. The blocking portion 590 may be configured to block a current supplied to the thermoelectric element 530 based on the thermoelectric element 530 being overheated and/or exceeding a predetermined temperature of the thermoelectric element 530. For example, the blocking portion 590 may be configured to block a current supplied to the thermoelectric element 530 (e.g., turn off the thermoelectric element 530) based on the heating portion 531 being overheated and/or exceeding the predetermined temperature of the heating portion 531. For example, the blocking portion 590 may be configured to block the current supplied to the thermoelectric element 530 based on the temperature of the heat dissipation sink 520 being overheated and/or exceeding the predetermined temperature of the heat dissipation sink 520. The blocking portion 590 may be electrically connected to the thermoelectric element 530. Further, the blocking portion 590 may be connected to a controller 1000 via a cable 595.
The blocking portion 590 may be adjacent to the heating portion 531. The blocking portion 590 may be disposed and/or positioned on the heat dissipation sink 520. For example, the blocking portion 590 may be disposed between the plurality of heat dissipation fins 525 on the heat dissipation sink base 521. The blocking portion 590 may be fixed by the first insulating member 593. The blocking portion 590 may include a fuse, a switch 590, and/or a sensor 590.
For example, the fuse 590 may be thermally short-circuited based on the thermoelectric element 530 being overheated. Because the fuse 590 is electrically connected to the thermoelectric element 530, the current supplied to the thermoelectric element 530 may be blocked based on the fuse 590 being short-circuited.
The fuse 590 may be in contact with the heat dissipation sink 520. When the temperature of the heating portion 531 of the thermoelectric element 530 rises, heat may be transferred from the heating portion 531 to the heat dissipation sink 520. As the temperature of the heating portion 531 rises, the temperature of the heat dissipation sink 520 may rise.
For example, the switch 590 and/or the sensor 590 may sense a temperature of air adjacent to the heating portion 531 and/or the heat dissipation sink 520. When the temperature of the air exceeds the predetermined temperature, the switch 590 and/or the sensor 590 may block the current supplied to the thermoelectric element 530 and/or turn off the thermoelectric element 530.
In the refrigerator 1 according to one embodiment, at least one of the motors configured to drive the heat dissipation fan 600 and the cooling fan 800 may fail. The fans 600 and 800 may not lower the temperature of the thermoelectric element 530, and thus the thermoelectric cooling device 400 may be overheated. When the thermoelectric cooling device 400 is overheated, the module plate 500, the fan case 650, the connection frame 200, the heat dissipation duct 700, the cooling duct 900, and/or temperature sensors 591 and 592 forming the thermoelectric cooling device 400 may be damaged.
Further, when the temperature sensor 591 or 592 fails, the thermoelectric element 530 and the thermoelectric cooling device 400 may be overheated, and the elements of the thermoelectric cooling device 400 may be damaged.
In the refrigerator 1 according to one embodiment, the blocking portion 590 may block the current supplied to the thermoelectric element 530 based on the thermoelectric element 530 exceeding the predetermined temperature of the thermoelectric element 530. For example, based on the heat dissipation sink 520, which is heated by the heating portion 531, exceeding the predetermined temperature, the temperature of the fuse 590 may also rise, and the fuse 590 may be short-circuited as the temperature of the fuse 590 rises. For example, the predetermined temperature may be 150° C.
Accordingly, the blocking portion 590 may prevent overheating of the thermoelectric element 530 so as to prevent the thermoelectric cooling device 400 including the temperature sensors 591 and 592 from being damaged, and thus the safety of use may be improved. In addition, because damage to the elements of the thermoelectric cooling device 400 is prevented, the need to replace the temperature sensors 591 and 592, etc. may be reduced and thus the user usage cost may be reduced.
An example, in which the temperature of the thermoelectric cooling device 400 including the thermoelectric element 530 is overheated, is not limited to the above-described example.
The thermoelectric cooling device 400 may further include the temperature sensors 591 and 592. The temperature sensors 591 and 592 may sense a temperature of an element of the thermoelectric cooling device 400. For example, the temperature sensors 591 and 592 may sense a temperature of the heat dissipation sink 520 and/or the heat absorbing sink 570. Additionally, the temperature sensors 591 and 592 may sense a temperature of the thermoelectric element 530.
The temperature sensors 591 and 592 may detect the temperature of the thermoelectric element 530 and transmit information about the temperature to the controller 1000. The controller 1000 may control the thermoelectric element 530, the compressor 2, and/or a user interface 1300 based on a temperature value detected by the temperature sensors 591 and 592 (refer to
The temperature sensors 591 and 592 may include a plurality of temperature sensors 591 and 592. The plurality of temperature sensors 591 and 592 may include a first temperature sensor 591 and a second temperature sensor 592.
The first temperature sensor 591 may be coupled and/or mounted on the heat dissipation sink base 521. The first temperature sensor 591 may be disposed on a side of a heat dissipation sink fin 525a that is disposed at the outermost end among the plurality of heat dissipation sink fins 525. The first temperature sensor 591 may be disposed on the heat dissipation sink base 521. For example, in the upper portion of the heat dissipation sink base 521, the first temperature sensor 591 may be coupled to the heat dissipation sink 520 by a coupling member. The first temperature sensor 591 may be referred to as a heat dissipation temperature sensor.
The second temperature sensor 592 may be coupled and/or mounted on the heat absorbing sink base 571. The second temperature sensor 592 may be disposed on a side of a cooling fin 575a that is disposed at the outermost end among the plurality of cooling fins 575. The second temperature sensor 592 may be disposed under the heat absorbing sink base 571. For example, in the lower portion of the heat absorbing sink base 571, the second temperature sensor 592 may be coupled to the heat absorbing sink 570 by a coupling member. The second temperature sensor 592 may be referred to as a cooling temperature sensor.
The structure of the heat dissipation duct 700 according to one embodiment of the present disclosure will be described with reference to
The refrigerator 1 may include the heat dissipation duct 700 provided on the upper wall 110 and configured to draw in air outside the main body 100 to exchange heat with the heat dissipation sink 520, and to allow the air, which exchanges heat with the heat dissipation sink 520, to be discharged back to the outside of the main body 100.
The heat dissipation duct 700 may include a heat dissipation duct body 720, a heat dissipation duct cover 710, and an extension duct 740.
The heat dissipation duct body 720 may be coupled to the upper surface of the main body 100. The heat dissipation duct body 720 may cover the heat dissipation fan 600 and the heat dissipation sink 520. The outside air intake port 751 may be formed on a front upper surface of the heat dissipation duct body 720, and the outside air intake port 751 may be covered by the top cover 300.
The heat dissipation duct cover 710 may be coupled to an upper portion of the heat dissipation duct body 720 to cover the upper side of the heat dissipation duct body 720. For this, a duct cover coupling portion 711 may be provided on the heat dissipation duct cover 710, and a duct body coupling portion 721 coupled to the duct cover coupling portion 711 may be provided on the heat dissipation duct body 720. The duct cover coupling portion 711 and the duct body coupling portion 721 may be coupled by a hook method or a fitting method.
The extension duct 740 may be provided in front of the heat dissipation duct body 720 to be connected to the heat dissipation duct body 720. As shown in
The extension duct 740 may be disposed below the top cover 300, and the upper side of the extension duct 740 may be covered by the top cover 300. The extension duct 740 may be coupled to a lower portion of the top cover 300. For this, the extension duct 740 may be provided with an extension duct coupling portion 745, and the top cover 300 may be provided with a top cover coupling portion 380 coupled to the extension duct coupling portion 745. The extension duct coupling portion 745 and the top cover coupling portion 380 may be coupled by a hook method or a fitting method.
The heat dissipation duct 700 may include the outside air intake port 751 provided to draw in air outside the main body. Particularly, the heat dissipation duct body 720 may include the outside air intake port 751.
The outside air intake port 751 may be formed on the upper surface of the heat dissipation duct body 720. The outside air intake port 751 may be located closer to the front surface of the main body 100 than the rear surface of the main body 100. The reason that the outside air intake port 751 is located closer to the front surface of the main body 100 than the rear surface of the main body 100 is to prevent heat, which is generated by the compressor 2 and the condenser located at the rear of the main body 100, from being introduced through the outside air intake port 751.
The heat dissipation duct 700 may include the outside air discharge ports 782 and 794 provided to discharge air, which exchanges heat with the heat dissipation sink 520, to the outside of the main body 100.
The heat dissipation duct body 720 may include a first outside air discharge port 782 provided to discharge air, which exchanges heat with the heat dissipation sink 520, to the outside of the main body 100. The first outside air discharge port 782 may discharge air, which exchanges heat with the heat dissipation sink 520, toward the external space above the main body 100.
The extension duct 740 may include a second outside air discharge port 794 provided to discharge air, which exchanges heat with the heat dissipation sink 520, to the rotation bar 40. As the air, which exchanges heat with the heat dissipation sink 520, is discharged toward the rotation bar 40, it is possible to prevent the dew condensation in the rotation bar 40.
However, the heat dissipation duct 700 does not necessarily include the first outside air discharge port 782 and the second outside air discharge port 794. Further, the second outside air discharge port 794 may be omitted.
The heat dissipation duct 700 may include a fan accommodating portion 760 provided to form a fan accommodating space 762 provided to accommodate the heat dissipation fan 600. Particularly, the heat dissipation duct body 720 may include the fan accommodating portion 760 provided to form the fan accommodating space 762 provided to accommodate the heat dissipation fan 600.
The fan accommodating space 762 may be formed on a lower surface of the fan accommodating portion 760. A lower side of the fan accommodating space 762 may be open and the open lower side of the fan accommodating space 762 may be covered by the fan case 650. The fan accommodating portion 760 may include a fan inlet 761 through which air flows into the fan accommodating space 762. The fan inlet 761 may be formed on an upper side of the fan accommodating space 762.
The heat dissipation duct 700 may include a sink accommodating portion 770 provided to form a sink accommodating space 771 provided to accommodate the heat dissipation sink 520. The sink accommodating space 771 may be formed on a lower surface of the sink accommodating portion 770. A lower side of the sink accommodating space 771 may be open. The open lower side of the sink accommodating space 771 may be covered by the module plate 550. The sink accommodating space 771 may be formed on a downstream side of the fan accommodating space 762.
As illustrated in
The reason that the channel blocking protrusion 772 is provided in the wide heat dissipation channel 529 is that a flow rate or heat exchange efficiency of air flowing through the wide heat dissipation channel 529 is reduced because a distance between the pair of heat dissipation fins 525 adjacent to the wide heat dissipation channel 529 is long.
As illustrated in
The fan accommodating space 762 and the sink accommodating space 771 may be located on a horizontal line. The fan accommodating space 762 and the sink accommodating space 771 may be arranged in the left and right directions with respect to the main body 100. The fan accommodating space 762 and the sink accommodating space 771 may be located closer to the rear surface of the main body 100 than the front surface of the main body 100.
In other words, the heat dissipation fan 600 accommodated in the fan accommodating space 762 and the heat dissipation sink 520 accommodated in the sink accommodating space 771 may be positioned on the horizontal line. The heat dissipation fan 600 and the heat dissipation sink 520 may be arranged in the left and right directions with respect to the main body 100. The heat dissipation fan 600 and the heat dissipation sink 520 may be located closer to the rear surface of the main body 100 than the front surface of the main body 100.
The heat dissipation duct 700 may include an intake duct portion 750 provided to guide air, which is drawn through the outside air intake port 751, to the fan accommodating space 762. For example, the heat dissipation duct body 720 may include the intake duct portion 750. The intake duct portion 750 may extend forward from the fan accommodating portion 760. The outside air intake port 751 may be formed on the upper surface of the intake duct portion 750.
An intake space 752 may be formed on the upper surface of the heat dissipation duct body 720. An upper side of the intake space 752 may be formed to be open, and the open upper side of the intake space 752 may be covered by the heat dissipation duct cover 710. The intake space 752 may be formed on the upstream side of the fan accommodating space 762. The intake space 752 may be connected to the fan accommodating space 762 through the fan inlet 761.
The heat dissipation duct 700 may include a first discharge duct portion 780 provided to guide air, which exchanges heat with the heat dissipation sink 520, to the first outside air discharge port 782. For example, the heat dissipation duct body 720 may include the first discharge duct portion 780. The first discharge duct portion 780 may extend from the sink accommodating portion 770. For example, the first discharge duct portion 780 may be formed to extend by a predetermined length diagonally from the sink accommodating portion 770 toward one front corner of the main body 100 and then extend forward.
A first discharge space 781 may be formed on the upper surface of the heat dissipation duct body 720. An upper side of the first discharge space 781 may be open, and the open upper side of the first discharge space may be covered by the heat dissipation duct cover 710. The first discharge space 781 may be formed on the downstream side of the sink accommodating space 771.
The heat dissipation duct 700 may include a second discharge duct portion 790 provided to guide air, which exchanges heat with the heat dissipation sink 520, to the second outside air discharge port 794. For example, the heat dissipation duct body 720 may include the second discharge duct portion 790. The second discharge duct portion 790 may branch from the first discharge duct portion 780 and extend forward.
A second discharge space 791 may be formed on an upper surface of the second discharge duct portion 790. An upper side of the second discharge space 791 may be open, and the open upper side of the second discharge space 791 may be covered by the heat dissipation duct cover 710. The second discharge space 791 may be formed on the downstream side of the sink accommodating space 771.
As mentioned above, the second discharge duct portion 790 may be formed by branching from the first discharge duct portion 780. Alternatively, the first discharge duct portion 780 and the second discharge duct portion 790 may be formed independently of each other.
Referring to
The blocking portion 590 may be adjacent to the thermoelectric element 530. For example, the blocking portion 590 may be adjacent to the heating portion 531. For example, the blocking portion 590 may be disposed between the plurality of heat dissipation fins 525. The first insulating member 593 may be formed of an elastic material, and the blocking portion 590 may be fixed by the first insulating member 593. The first insulating member 593 may press the blocking portion 590 from the upper side of the blocking portion 590. The blocking portion 590 may be disposed between the first insulating member 593 and the heat dissipation sink base 521. The blocking portion 590 may be fixed by the first insulating member 593 and may not rotate. In addition, the blocking portion 590 may be prevented from being separated in a direction in which the cable 595 is connected.
However, the position of the blocking portion 590 is not limited to the above-described example. The blocking portion 590 may be disposed at various positions along the Z direction of the heat dissipation fin 525. For example, the blocking portion 590 may be disposed at the upper portion of the heat dissipation fin 525 or at a position between the upper end of the heat dissipation fin 525 and the heat dissipation sink base 521. For example, the blocking portion 590 may be positioned at a middle position of the heat dissipation fin 525.
The blocking portion 590 may include a blocking portion base 590a. The blocking portion base 590a may be in contact with the heat dissipation sink 520. For example, the blocking portion base 590a may be in contact with the heat dissipation sink base 521 to receive heat from the heat dissipation sink 520. Accordingly, heat may be transferred from the heat dissipation sink base 521 to the blocking portion 590, and thus the blocking portion 590 may block a current supplied to the thermoelectric element 530 based on the temperature of the heat dissipation sink 520.
The blocking portion 590 may further include a protrusion 590b. The protrusion 590b may protrude from the blocking portion base 590a. For example, the protrusion 590b may protrude upward from the blocking portion base 590a. The protrusion 590b may be coupled to the first insulating member 593. For example, the protrusion 590b may be hook-coupled to a hook 593b of the first insulating member 593. The protrusion 590b may be in contact with the insulating members 593 and 594.
The blocking portion 590 may be disposed between the first insulating member 593 and the heat dissipation sink 520, and the protrusion 590b may be locked to the hook 593b. Accordingly, the blocking portion 590 may be fixed. For example, the blocking portion 590 may be prevented from being separated in the direction in which the cable 595 is connected.
The first insulating member 593 may include an insulating member body 593a and the hook 593b. The insulating member body 593a may surround the fastening member 596. The insulating member body 593a may be in contact with the blocking portion 590. The hook 593b may be provided at one end of the insulating member body 593a. The hook 593b may protrude downward. The hook 593b may be locked to the protrusion 590b of the blocking portion 590. The hook 593b may prevent the separation of the blocking portion. The first insulating member 593 and the blocking portion 590 may be coupled to each other as the hook 593b is coupled to the protrusion 590b.
Referring to
Referring to
Referring to
The user interface 1300 may provide a user interface for interaction between a user and the refrigerator 1.
The user interface 1300 may include at least one input interface 1310 and at least one output interface 1320.
The at least one input interface 1310 may convert sensory information received from a user into an electrical signal.
The at least one input interface 1310 may include a power button, an operation button, and a course selection dial (or a course selection button). The at least one input interface 1310 may include a tact switch, a push switch, a slide switch, a toggle switch, a micro switch, a touch switch, a touch pad, a touch screen, a jog dial, and/or a microphone.
The at least one output interface 1320 may transmit various data related to the operation of the refrigerator 1 to a user by generating sensory information.
For example, the at least one output interface 1320 may transmit information related to an operation time of the refrigerator, whether the thermoelectric element 530 operates or not, and the setting of the thermoelectric element 530 to a user. The information related to the operation of the refrigerator 1 may be output by a screen, an indicator, a voice, etc. The at least one output interface 1320 may include a liquid crystal display (LCD) panel, a light emitting diode (LED) panel, a speaker, etc.
The controller 1000 may control various elements of the refrigerator 1 (e.g., the thermoelectric element 530, the temperature sensors 591 and 592, and/or the user interface 1300). The controller 1000 may control various elements of the refrigerator 1 to supply a current to the thermoelectric element 530 in order to drive the thermoelectric element 530 according to the user input.
For example, the controller 1000 may receive information about the temperature of the thermoelectric element 530 from the temperature sensors 591 and 592 and control the amount of current supplied to the thermoelectric element 530. In addition, for example, the controller 1000 may display information, which is about the current being blocked to the thermoelectric element 530, on the output interface 1320.
The controller 1000 may include hardware such as a CPU, Mi-com, or memory, and software such as a control program. For example, the controller 1000 may include at least one memory 1200 provided to store data in the form of a program, an algorithm for controlling the operation of elements in the refrigerator 1, and at least one processor 1100 configured to perform the operations described above and operations to be described below using the data stored in the at least one memory 1200. The memory 1200 and the processor 1100 may each be implemented as separate chips. The processor 1100 may include one or more processor chips or one or more processing cores. The memory 1200 may include one or more memory chips or one or more memory blocks. In addition, the memory 1200 and the processor 1100 may be implemented as a single chip.
For example, the processor 1100 may control the thermoelectric element 530, the temperature sensors 591 and 592, and/or the user interface 1300. The processor 1100 may supply a current to the thermoelectric element 530 to drive the thermoelectric element 530 according to a user input. For example, the processor 1100 may receive information about the temperature of the thermoelectric element 530 from the temperature sensors 591 and 592 and control the amount of current supplied to the thermoelectric element 530. In addition, the processor 1100 may display which is about the current being blocked to the thermoelectric element 530, on the output interface 1320, based on the current being blocked to the thermoelectric element 530. For example, the processor 1100 may output whether the thermoelectric element 530 fails or not to the output interface 1320 based on the absence of temperature change in the temperature sensors 591 and 592.
For example, the memory may store an algorithm that causes the processor 1100 to display relevant information on the output interface 1320 based on the current being blocked to the thermoelectric element 530.
Referring to
Based on the heat dissipation sink 520 exceeding the predetermined temperature of the heat dissipation sink 520, the blocking portion 590 may block the current flowing to the thermoelectric element 530 (2520). For example, in response to the temperature of the heat dissipation sink 520, which receives heat from the thermoelectric element 530, exceeding the predetermined temperature, the temperature of the fuse 590 may rise and the fuse 590 may be short-circuited. Because the fuse 590 is electrically connected to the thermoelectric element 530, the thermoelectric element 530 may be turned off in response to the fuse 590 being short-circuited.
Referring to
The control method of the refrigerator 1 according to one embodiment of the present disclosure may further include detecting a temperature of the thermoelectric element 530 by the temperature sensors 591 and 592 (2620). For example, the second temperature sensor 592 disposed on the side of the heat absorbing sink 570 may detect the temperature of the heat absorbing sink 570 and/or the heat absorbing portion 532. The second temperature sensor 592 may transmit information about the temperature of the heat absorbing sink 570 to the controller 1000.
The control method of the refrigerator 1 according to one embodiment of the present disclosure may further include determining whether the temperature detected by the temperature sensor 591 or 592 exceeds a predetermined temperature (2630). For example, the controller 1000 may receive information about the temperature of the heat absorbing sink 570 from the second temperature sensor 592. Based on the temperature, which is detected by the second temperature sensor 592, exceeding the predetermined temperature, the processor 1100 may determine whether to block the current supplied to the thermoelectric element 530 before the blocking portion 590 operates.
The control method of the refrigerator 1 according to one embodiment of the present disclosure may further include blocking the current to the thermoelectric element 530 based on the temperature, which is detected by the second temperature sensor 592, exceeding the predetermined temperature (2640). For example, when the blocking portion 590 is a fuse, the processor 1100 may prevent the fuse 590 from being short-circuited by preemptively blocking the current supplied to the thermoelectric element 530.
Further, the processor 1100 of the refrigerator may allow a current to continuously supply to the thermoelectric element 530 based on the temperature, which is detected by the second temperature sensor 592, not exceeding the predetermined temperature.
Referring to
The control method of the refrigerator 1 according to one embodiment of the present disclosure may further include detecting a temperature of the thermoelectric element 530 by the temperature sensors 591 and 592 (2720). For example, the second temperature sensor 592 disposed on the side of the heat absorbing sink 570 may detect the temperature of the heat absorbing sink 570 and/or the heat absorbing portion 532. The second temperature sensor 592 may transmit information about the temperature of the heat absorbing sink 570 to the controller 1000.
The control method of the refrigerator 1 according to one embodiment of the present disclosure may further include determining whether the temperature detected by the temperature sensor 591 or 592 changes (2730). For example, the controller 1000 may receive information about the temperature of the heat absorbing sink 570 from the second temperature sensor 592, and the processor 1100 may determine whether the temperature of the heat absorbing sink 570 detected by the second temperature sensor 592 changes.
The control method of the refrigerator 1 according to one embodiment of the present disclosure may further include displaying whether the thermoelectric element 530 is abnormal or not, on the user interface 1300 based on the temperature, which is detected by the second temperature sensor 592, not changing (2740). For example, a user can check whether the thermoelectric element 530 is abnormal or not through the output interface 1320 and contact a service center to repair the refrigerator 1 having the thermoelectric element 530. For example, because the thermoelectric element 530 does not operate as the blocking portion 590 blocks the current supplied to the thermoelectric element 530, the absence of the temperature change in the second temperature sensor 592 may correspond to a fact that the thermoelectric element 530 and the heat absorbing portion 532 do not operate.
Further, the control method of the refrigerator 1 according to one embodiment of the present disclosure may include increasing the operating rate of the compressor 2 based on the temperature, which is detected by the second temperature sensor 592, not changing (2750). The refrigerator according to one embodiment may cool the storage compartments 11, 12 and 13 by operating the refrigeration cycle device including the compressor 2, and operating the thermoelectric cooling device 400 including the thermoelectric element 530. Therefore, the processor 1100 may determine that the thermoelectric element 530 does not operate, and may increase the operating rate of the compressor 2. Increasing the operating rate of the compressor 2 may include increasing RPM of the compressor 2. Based on the increasing operating rate of the compressor 2, the refrigeration cycle device may generate greater cooling power, and the evaporator 3 may generate more cold air.
Further, the processor 1100 of the refrigerator may allow the current to continuously supply to the thermoelectric element 530 based on the change in temperature detected by the second temperature sensor 592.
As is apparent from the above description, a thermoelectric cooling device including a temperature sensor or the like may be prevented from being damaged by preventing a thermoelectric element from being overheated.
Additional aspects of the disclosure will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosure.
The refrigerator according to one embodiment may include the main body 100, the storage compartments 11, 12 and 13 formed inside the main body, the thermoelectric module 500 including the thermoelectric element 530 including the heating portion 531 configured to emit heat and the heat absorbing portion 532 configured to absorb heat, the thermoelectric module including the heat dissipation sink 520 configured to absorb heat from the heating portion and emit the absorbed heat, and the blocking portion 590 disposed in the heat dissipation sink to block a current supplied to the thermoelectric element based on a temperature of the heat dissipation sink 520 exceeding a predetermined temperature of the heat dissipation sink 520.
The heat dissipation sink may include the heat dissipation sink base 521 in contact with the heating portion, and the plurality of heat dissipation fins 525 protruding from the heat dissipation sink base to the outside of the main body. The blocking portion may be disposed between the plurality of heat dissipation fins.
The refrigerator may further include the heat absorbing sink 570 configured to receive heat from the storage compartment and transmit the received heat to the heat absorbing portion, and including the heat absorbing sink base 571 in contact with the heat absorbing portion and the plurality of cooling fins 575 protruding from the heat absorbing sink base to the storage compartment, the fastening member 596 provided to penetrate the heat dissipation sink base and the heat absorbing sink base so as to couple the heat dissipation sink and the heat absorbing sink, and the insulating member 593 disposed between the plurality of heat dissipation fins and configured to fix the fastening member.
The blocking portion may be disposed between the heat dissipation sink base and the insulating member so as to be fixed to the thermoelectric element.
The blocking portion may include the blocking portion base 590a, and the protrusion 590b protruding upward from the blocking portion base. The insulating material may include the insulating member base 593a, and the hook 593b protruding downward from the insulating member base so as to be fixed to the protrusion.
The blocking portion may be configured to block the current supplied to the thermoelectric element based on the temperature of the heat dissipation sink exceeding 150° C.
The refrigerator may further include the heat exchanger 3 arranged on the rear side of the storage compartment. The thermoelectric element may be configured to cool air within the storage compartment while the heat exchanger cools air within the storage compartment.
The refrigerator may further include the temperature sensor 591 disposed on the outside of the heat dissipation fin 525a disposed at the outermost side among the plurality of heat dissipation fins.
The heat dissipation sink may include the heat dissipation sink base 521 in contact with the heating portion, and the plurality of heat dissipation fins 525 protruding from the heat dissipation sink base to the outside of the main body. The blocking portion may be disposed on the outside of the heat dissipation fin 525a disposed at the outermost side among the plurality of heat dissipation fins.
The refrigerator may further include the at least one temperature sensor 591 and 592 configured to detect the temperature of the thermoelectric module 500, and the processor 1000 configured to block the current supplied to the thermoelectric element based on the thermoelectric module 500 being overheated and/or the temperature of the thermoelectric module 500, which is detected by the at least one temperature sensor, exceeding a predetermined temperature of the thermoelectric module 500.
The thermoelectric module may include the heat absorbing sink 570 configured to receive heat from the storage compartment and transmit the received heat to the heat absorbing portion. The at least one temperature sensor may include the first temperature sensor 591 configured to detect the temperature of the heat dissipation sink, and the second temperature sensor 592 configured to detect the temperature of the heat absorbing sink. The processor may be configured to block the current supplied to the thermoelectric element based on the temperature of the heat absorbing sink 570, which is detected by the second temperature sensor, exceeding the predetermined temperature of the heat absorbing sink 570.
The refrigerator may further include the user interface 1300. The processor may be configured to output whether the thermoelectric element fails or not, to the user interface based on the blocking portion blocking the current supplied to the thermoelectric element.
The processor may be configured to output whether the thermoelectric element fails or not, to the user interface based on the absence of a change in the temperature detected by the at least one temperature sensor.
The thermoelectric module may include the heat absorbing sink 570 configured to receive heat from the storage compartment and transmit the received heat to the heat absorbing portion. The at least one temperature sensor may include the first temperature sensor 591 configured to detect the temperature of the heat dissipation sink, and the second temperature sensor 592 configured to detect the temperature of the heat absorbing sink. The processor may be configured to output whether the thermoelectric element fails or not, to the user interface based on the absence of a change in the temperature detected by the second temperature sensor.
The refrigerator may further include the heat exchanger 3 configured to cool the air within the storage compartment, and the compressor 2 connected to the heat exchanger. The processor may be configured to increase RPM of the compressor based on the blocking portion blocking the current supplied to the thermoelectric element.
The refrigerator according to one embodiment may include the storage compartments 11, 12 and 13, the thermoelectric element 530 including the heating portion 531 and the heat absorbing portion 532, the thermoelectric element disposed in the storage compartment to discharge air, which is heated by the heating portion, to the outside of the storage compartment and to supply air, which is cooled by the heat absorbing portion, to the storage compartment, the at least one temperature sensor 591 and 592 configured to detect the temperature of the thermoelectric element, and the processor 1100 configured to block the current supplied to the thermoelectric element based on the temperature, which is detected by the at least one temperature sensor, exceeding the predetermined temperature.
The refrigerator may further include the heat dissipation sink 520 configured to absorb heat from the heating portion and emit the absorbed heat to the outside of the main body, and the heat absorbing sink 570 configured to receive heat from the storage compartment and transmit the received heat to the heat absorbing portion. The at least one temperature sensor may include the first temperature sensor 591 configured to detect the temperature of the heat dissipation sink, and the second temperature sensor 592 configured to detect the temperature of the heat absorbing sink. The processor may be configured to block the current supplied to the thermoelectric element based on the temperature, which is detected by the second temperature sensor, exceeding the predetermined temperature.
The refrigerator may further include the user interface 1300. The processor may be configured to output whether the thermoelectric element fails or not, to the user interface based on the blocking portion blocking the current supplied to the thermoelectric element.
The refrigerator may further include the heat exchanger 3 configured to cool the air within the storage compartment, and the compressor 2 connected to the heat exchanger. The processor may be configured to increase RPM of the compressor based on the blocking portion blocking the current supplied to the thermoelectric element.
The refrigerator according to one embodiment may include the main body 100, the storage compartments 11, 12 and 13 formed inside the main body, the heat exchanger 3 configured to evaporate a refrigerant to generate cold air, the thermoelectric cooling device 400 configured to cool air in the storage compartment while the heat exchanger cools air in the storage compartment, and including the thermoelectric element 530 including the heating portion 531 and the heat absorbing portion 532, the thermoelectric cooling device including the heat dissipation sink 520 configured to absorb heat from the heating portion and emit the absorbed heat to the outside of the main body, and the fuse 590 disposed in the heat dissipation sink 520 to block the current supplied to the thermoelectric element in response to the temperature of the heat dissipation sink exceeding the predetermined temperature.
The refrigerator according to one embodiment may include: a main body; a storage compartment inside the main body; a thermoelectric module configured to cool the storage compartment and including: a thermoelectric element including a heating portion and a heat absorbing portion, a heat dissipation sink, and a heat absorbing sink; and a blocking portion. The thermoelectric module may be configured so that, based on a current being supplied to the thermoelectric element, the heat absorbing portion absorbs heat from the heat absorbing sink to cool the heat absorbing sink, and heat generation occurs at the heating portion and the generated heat is transferred to the heat dissipation sink to be emitted by the heat dissipation sink to an outside of the thermoelectric module. The blocking portion may be configured to block the current from being supplied to the thermoelectric element based on at least one of a temperature of the thermoelectric module exceeding a predetermined temperature of the thermoelectric module, a temperature of the heat dissipation sink exceeding a predetermined temperature of the heat dissipation sink, a temperature of the heat absorbing sink exceeding a predetermined temperature of the heat absorbing sink, a temperature of the thermoelectric element exceeding a predetermined temperature of the thermoelectric element, and a temperature of the heating portion exceeding a predetermined temperature of the heating portion.
While the present disclosure has been particularly described with reference to exemplary embodiments, it should be understood by those of skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2024-0002504 | Jan 2024 | KR | national |
| 10-2024-0052278 | Apr 2024 | KR | national |
This is a continuation application, under 35 U.S.C. § 111(a), of International Application PCT/KR2024/018613, filed Nov. 22, 2024, which claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2024-0002504, filed Jan. 5, 2024 and Korean Patent Application No. 10-2024-0052278, filed Apr. 18, 2024, in the Korean Intellectual Property Office, the disclosures of which are incorporated herein in their entireties by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/KR2024/018613 | Nov 2024 | WO |
| Child | 18991945 | US |
