REFRIGERATOR

Abstract

A refrigerator including a main body; a storage room inside the main body; a thermoelectric module including a module plate including an element mounting portion, a heat dissipation sink on a first side of the module plate, a cooling sink on a second side of the module plate, and a thermoelectric element positioned in the element mounting portion such that a first surface of the thermoelectric element contacts the heat dissipation sink and a second surface of the thermoelectric element contacts the cooling sink; and a coupling member penetrating the module plate of the thermoelectric module to couple the thermoelectric module to an upper surface of the main body.

Description

TECHNICAL FIELD

The present disclosure relates to a refrigerator, and more particularly, to a refrigerator having a thermoelectric module for cooling a storage room.

BACKGROUND ART

A refrigerator is a home appliance that includes a main body having a storage room, and a cool air supplier for supplying cool air to the storage room to keep foods fresh.

As the cool air supplier of the refrigerator, a thermoelectric module that causes heating and cooling actions through the Peltier effect of a thermoelectric element is used. The thermoelectric element includes a heating part formed on one side and a heat absorbing part formed on the opposite side, and while current is applied to the thermoelectric element, heat generation occurs in the heating part and heat absorption occurs in the heat absorbing part.

The thermoelectric module includes a heat dissipation sink that is in contact with the heating part, a cooling sink that is in contact with the heat absorbing part, and a module plate that supports the heat dissipation sink and the cooling sink.

DISCLOSURE

Technical Problem

An aspect of the disclosure discloses a refrigerator having a thermoelectric module stably and firmly coupled to an upper portion of a main body.

An aspect of the disclosure discloses a refrigerator with improved efficiency of cooling through a thermoelectric module.

An aspect of the disclosure discloses a refrigerator which a thermoelectric module is easily assembled into and separated from.

Technical objects that can be achieved by the disclosure are not limited to the above-mentioned those, and other technical objects not mentioned may be clearly understood by one of ordinary skill in the technical art to which the disclosure belongs from the following description.

Technical Solution

Aspects of embodiments of the disclosure will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.

According to an embodiment of the disclosure, a refrigerator includes a main body; a storage room inside the main body; a thermoelectric module including a module plate including an element mounting portion, a heat dissipation sink on a first side of the module plate, a cooling sink on a second side of the module plate, and a thermoelectric element positioned in the element mounting portion such that a first surface of the thermoelectric element contacts the heat dissipation sink and a second surface of the thermoelectric element contacts the cooling sink; and a coupling member penetrating the module plate of the thermoelectric module to couple the thermoelectric module to an upper surface of the main body.

According to an embodiment of the disclosure, the main body may include an inner case, an outer case coupled to an outer side of the inner case, and a connecting frame between the inner case and the outer case.

According to an embodiment of the disclosure, the coupling member may be coupled to the connecting frame of the main body.

According to an embodiment of the disclosure, the coupling member may penetrate the outer case to be coupled to the connecting frame.

According to an embodiment of the disclosure, the connecting frame may include an installation opening connecting the storage room to outside of the main body.

According to an embodiment of the disclosure, at least one portion of the thermoelectric module may be positioned inside the installation opening.

According to an embodiment of the disclosure, the module plate may include a wing portion supported on the upper surface of the main body.

According to an embodiment of the disclosure, the module plate may include a plate base configured to support the heat dissipation sink.

According to an embodiment of the disclosure, the wing portion may be stepped relative to the plate base, and the module plate may include a connecting portion connecting the plate base to the wing portion.

According to an embodiment of the disclosure, the main body may include an inner case, an outer case coupled to an outer side of the inner case, and a connecting frame between the inner case and the outer case, and the connecting frame may include a middle support protruding to support an end of the plate base of the module plate.

According to an embodiment of the disclosure, the main body may include an inner case, an outer case coupled to an outer side of the inner case, and a connecting frame between the inner case and the outer case, and the connecting frame may include a sink end support protruding to support an end of the cooling sink.

According to an embodiment of the disclosure, the thermoelectric module may include a coupling member penetrating the heat dissipation sink, the module plate, and the cooling sink to couple the heat dissipation sink and the cooling sink to the module plate.

According to an embodiment of the disclosure, the thermoelectric module may include a sink insulator between the module plate and the cooling sink.

According to an embodiment of the disclosure, the refrigerator may further include a heat dissipation duct coupled to the thermoelectric module and configured to dissipate heat from the heat dissipation sink.

According to an embodiment of the disclosure, the heat dissipation duct may be coupled to the thermoelectric module by the coupling member of the refrigerator.

In another aspect, according to an embodiment of the disclosure, a refrigerator may include: a main body; a storage room formed inside the main body; and a thermoelectric module including a module plate having an element mounting portion, a heat dissipation sink positioned on one side of the module plate, a cooling sink positioned on another side of the module plate, and a thermoelectric element positioned in the element mounting portion of the module plate such that one surface of the thermoelectric element is in contact with the heat dissipation sink and another surface of the thermoelectric element is in contact with the cooling sink, wherein an installation opening is formed in an upper wall of the main body, at least one portion of the thermoelectric module is positioned inside the installation opening, and the module plate of the thermoelectric module includes a wing portion supported on an upper surface of the main body.

The module plate may include a plate base configured to support the heat dissipation sink.

The wining portion may be formed to have a step with respect to the plate base, and the module plate may include a connecting portion connecting the plate base to the wing portion.

The thermoelectric module may include a coupling member coupled to the main body by penetrating the module plate.

The main body may include: an inner case; an outer case coupled to an outer side of the inner case, and a connecting frame provided between the inner case and the outer case, and the coupling member may be coupled to the connecting frame of the main body.

Advantageous Effects

According to an embodiment of the disclosure, a thermoelectric module may be stably and firmly coupled to an upper portion of a main body.

According to an embodiment of the disclosure, because a heat dissipation sink and a cooling sink are in close contact with a thermoelectric element, efficiency of cooling through the thermoelectric element may increase.

According to an embodiment of the disclosure, assembly and separation of a thermoelectric module may be easy.

Effects that may be achieved according to the disclosure are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by one of ordinary skill in the technical field to which the disclosure belongs from the following descriptions.

DESCRIPTION OF DRAWINGS

These and/or other aspects of the disclosure will become apparent and more readily appreciated from the following description of embodiments, taken in conjunction with the accompanying drawings listed below.

FIG. 1 shows a refrigerator according to an embodiment of the disclosure.

FIG. 2 shows a refrigerator according to an embodiment of the disclosure when the doors are open.

FIG. 3 shows a storage room of a refrigerator according to an embodiment of the disclosure.

FIG. 4 is a schematic side cross-sectional view of a refrigerator according to an embodiment of the disclosure.

FIG. 5 is a cross-sectional view taken along line I-I of FIG. 2.

FIG. 6 shows a top cover and a thermoelectric module assembly according to an embodiment of the disclosure, separated from a main body of a refrigerator.

FIG. 7 shows a heat dissipation duct cover, a heat dissipation duct body, an extension duct, and a thermoelectric module, according to an embodiment of the disclosure.

FIG. 8 is a bottom perspective view showing a heat dissipation duct cover, a heat dissipation body, and a thermoelectric module, according to an embodiment of the disclosure.

FIG. 9 is an exploded perspective view of a thermoelectric module according to an embodiment of the disclosure.

FIG. 10 is an exploded bottom perspective view of a thermoelectric module according to an embodiment of the disclosure.

FIG. 11 is a perspective view of a module plate according to an embodiment of the disclosure.

FIG. 12 is a bottom perspective view of a module plate according to an embodiment of the disclosure.

FIG. 13 is a cross-sectional view of a heat dissipation duct and a thermoelectric module according to an embodiment of the disclosure.

FIG. 14 is an exploded view of an inner case, an outer case, and a connecting frame, according to an embodiment of the disclosure.

FIG. 15 shows a connecting frame according to an embodiment of the disclosure.

FIG. 16 is a cross-sectional view of an upper wall of a main body according to an embodiment of the disclosure.

FIG. 17 is a cross-sectional view showing a state in which a heat dissipation duct and a thermoelectric module are coupled to an upper wall of a main body according to an embodiment of the disclosure.

FIG. 18 is an enlarged view of a concave portion of FIG. 17.

FIG. 19 is a cross-sectional view showing a state in which a heat dissipation duct and a thermoelectric module are coupled to an upper wall of a main body according to an embodiment of the disclosure.

FIG. 20 is a cross-sectional view showing a state in which a heat dissipation duct and a thermoelectric module are coupled to an upper wall of a main body according to an embodiment of the disclosure.

MODES OF THE INVENTION

Various embodiments of the disclosure and terms used herein are not intended to limit the technical features described herein to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the corresponding embodiments.

In describing of the drawings, similar reference numerals may be used for similar or related elements.

The singular form of a noun corresponding to an item may include one or more of the items unless clearly indicated otherwise in a related context.

In the disclosure, phrases, such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together in the corresponding phrase among the phrases.

As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

Terms such as “1st”, “2nd”, “primary”, or “secondary” may be used simply to distinguish an element from other elements, without limiting the element in other aspects (e.g., importance or order).

Further, as used in the disclosure, the terms “front”, “rear”, “top”, “bottom”, “side”, “left”, “right”, “upper”, “lower”, and the like are defined with reference to the drawings, and are not intended to limit the shape and position of any element.

It will be understood that when the terms “includes”, “comprises”, “including”, and/or “comprising” are used in the disclosure, they specify the presence of the specified features, figures, steps, operations, components, members, or combinations thereof, but do not preclude the presence or addition of one or more other features, figures, steps, operations, components, members, or combinations thereof.

When a given element is referred to as being “connected to”, “coupled to”, “supported by” or “in contact with” another element, it is to be understood that it may be directly or indirectly connected to, coupled to, supported by, or in contact with the other element. When a given element is indirectly connected to, coupled to, supported by, or in contact with another element, it is to be understood that it may be connected to, coupled to, supported by, or in contact with the other element through a third element.

It will also be understood that when an element is referred to as being “on” another element, it may be directly on the other element or intervening elements may also be present.

A refrigerator according to an embodiment of the disclosure may include a main body.

The “main body” may include an inner case, an outer case positioned outside the inner case, and an insulation provided between the inner case and the outer case.

The “inner case” may include a case, a plate, a panel, or a liner forming a storage compartment (also referred to as a storage room). The inner case may be formed as one body, or may be formed by assembling a plurality of plates together. The “outer case” may form an appearance of the main body, and be coupled to an outer side of the inner case such that the insulation is positioned between the inner case and the outer case.

The “insulation” may insulate an inside of the storage compartment from an outside of the storage compartment to maintain inside temperature of the storage compartment at appropriate temperature without being influenced by an external environment of the storage compartment. According to an embodiment of the disclosure, the insulation may include a foaming insulation. The foaming insulation may be molded by fixing the inner case and the outer case with jigs, etc. and then injecting and foaming urethane foam as a mixture of polyurethane and a foaming agent between the inner case and the outer case.

According to an embodiment of the disclosure, the insulation may include a vacuum insulation in addition to a foaming insulation, or may be configured only with a vacuum insulation instead of a forming insulation. The vacuum insulation may include a core material and a cladding material accommodating the core material and sealing the inside with vacuum or pressure close to vacuum. However, the insulation is not limited to the above-mentioned foaming insulation or vacuum insulation, and may include various materials capable of being used for insulation.

The “storage compartment” may include a space defined by the inner case. The storage compartment may further include the inner case defining the space corresponding to the storage compartment. The storage compartment may store a variety of items, such as food, medicines, cosmetics, and the like, and the storage compartment may be configured to be open on at least one side for insertion and removal of the items.

The refrigerator may include one or more storage compartments. In a case in which two or more storage compartments are formed in the refrigerator, the respective storage compartments may have different purposes of use, and may be maintained at different temperatures. To this end, the respective storage compartments may be partitioned by a partition wall including an insulation.

The storage compartment may be maintained within an appropriate temperature range according to a purpose of use, and may include a “refrigerating compartment”, a “freezing compartment”, and a “temperature conversion compartment” according to purposes of use and/or temperature ranges. The refrigerating compartment may be maintained at an appropriate temperature to keep food refrigerated, and the freezing compartment may be maintained at an appropriate temperature to keep food frozen. The “refrigerating” may be keeping food cold without freezing the food, and for example, the refrigerating compartment may be maintained within a range of 0 degrees Celsius to 7 degrees Celsius. The “freezing” may be freezing food or keeping food frozen, and for example, the freezing compartment may be maintained within a range of −20 degrees Celsius to −1 degrees Celsius. The temperature conversion compartment may be used as either a refrigerating compartment or a freezing compartment according to or regardless of a user's selection.

The storage compartment may also be referred to by various terms, such as “vegetable compartment”, “freshness compartment”, “cooling compartment”, and “ice-making compartment”, in addition to “refrigerating compartment”, “freezing compartment”, and “temperature conversion compartment”, and the terms, such as “refrigerating compartment”, “freezing compartment”, “temperature conversion compartment”, etc., as used below are to be understood as representing storage compartments having the corresponding purposes of use and the corresponding temperature ranges.

The refrigerator according to an embodiment of the disclosure may include at least one door configured to open or close the open side of the storage compartment. The respective doors may be provided to open and close one or more storage compartments, or a single door may be provided to open and close a plurality of storage compartments. The door may be rotatably or slidably mounted to the front of the main body.

The “door” may seal the storage compartment in a closed state. The door, like the main body, may include an insulation to insulate the storage compartment in a closed state.

According to an embodiment, the door may include an outer door plate forming the front surface of the door, an inner door plate forming the rear surface of the door and facing the storage compartment, an upper cap, a lower cap, and a door insulation provided therein.

A gasket may be provided on the edge of the inner door plate to seal the storage compartment by coming into close contact with the front surface of the main body when the door is closed. The inner door plate may include a dyke that protrudes rearward to allow a door basket for storing items to be fitted.

According to an embodiment, the door may include a door body and a front panel that is detachably coupled to the front of the door body and forming the front surface of the door. The door body may include an outer door plate forming the front surface of the door body, an inner door plate forming the rear surface of the door body and facing the storage compartment, an upper cap, a lower cap, and a door insulator provided therein.

The refrigerator may be classified as French Door Type, Side-by-side Type, Bottom Mounted Freezer (BMF), Top Mounted Freezer (TMF), or Single Door Refrigerator according to the arrangement of the doors and the storage compartments.

The refrigerator according to an embodiment of the disclosure may include a cold air supply device for supplying cold air to the storage compartment.

The “cold air supply device” may include a machine, an apparatus, an electronic device, and/or a combination system thereof, capable of generating cold air and guiding the cold air to cool the storage compartment.

According to an embodiment of the disclosure, the cold air supply device may generate cold air through a cooling cycle including compression, condensation, expansion, and evaporation processes of refrigerants. To this end, the cold air supply device may include a refrigeration cycle device having a compressor, a condenser, an expander, and an evaporator to drive the refrigeration cycle. According to an embodiment of the disclosure, the cold air supply device may include a semiconductor, such as a thermoelectric element. The thermoelectric element may cool the storage compartment by heating and cooling actions through the Peltier effect.

The refrigerator according to an embodiment of the disclosure may include a machine compartment in which at least some components belonging to the cold air supply device are installed.

The “machine compartment” may be partitioned and insulated from the storage compartment to prevent heat generated by the components installed in the machine compartment from being transferred to the storage compartment. To dissipate heat from the components installed in the machine compartment, the machine compartment may communicate with outside of the main body.

The refrigerator according to an embodiment of the disclosure may include a dispenser provided on the door to provide water and/or ice. The dispenser may be provided on the door to allow access by the user without opening the door.

The refrigerator according to an embodiment of the disclosure may include an ice-making device that produces ice. The ice-making device may include an ice-making tray that stores water, an ice-moving device that separates ice from the ice-making tray, and an ice-bucket that stores ice produced in the ice-making tray.

The refrigerator according to an embodiment of the disclosure may include a controller for controlling the refrigerator.

The “controller” may include a memory for storing and/or recording data and/or programs for controlling the refrigerator, and a processor for outputting control signals for controlling the cold air supply device, etc. in accordance with the programs and/or data stored in the memory.

The memory may store or record various information, data, instructions, programs, and the like necessary for operation of the refrigerator. The memory may store temporary data generated while generating control signals for controlling components included in the refrigerator. The memory may include at least one of a volatile memory or a non-volatile memory, or a combination thereof.

The processor may control the overall operation of the refrigerator. The processor may control the components of the refrigerator by executing programs stored in memory. The processor may include a separate neural processing unit (NPU) that performs an artificial intelligence (AI) model operation. In addition, the processor may include a central processing unit (CPU), a graphics processor (GPU), and the like. The processor may generate a control signal to control the operation of the cold air supply device. For example, the processor may receive temperature information of the storage compartment from a temperature sensor and generate a cooling control signal to control an operation of the cold air supply device based on the temperature information of the storage compartment.

Furthermore, the processor may process a user input of a user interface and control an operation of the user interface in accordance with the programs and/or data memorized/stored in the memory. The user interface may be provided with an input interface and an output interface. The processor may receive the user input from the user interface. In addition, the processor may transmit a display control signal and image data for displaying an image on the user interface to the user interface in response to the user input.

The processor and memory may be provided integrally or may be provided separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one sub-processor. The memory may include one or more memories.

The refrigerator according to an embodiment of the disclosure may include a processor and a memory for controlling all of the components included in the refrigerator, and may include a plurality of processors and a plurality of memories for individually controlling the components of the refrigerator. For example, the refrigerator may include a processor and a memory for controlling the operation of the cold air supply device in accordance with to an output of the temperature sensor. In addition, the refrigerator may be separately provided with a processor and a memory for controlling the operation of the user interface in accordance with the user input.

A communication module may communicate with external devices, such as servers, mobile devices, and other home appliances via a nearby access point (AP). The AP may connect a local area network (LAN) to which a refrigerator or a user device is connected to a wide area network (WAN) to which a server is connected. The refrigerator or the user device may be connected to the server via the WAN.

The input interface may include keys, a touch screen, a microphone, and the like. The input interface may receive the user input and pass the received user input to the processor.

The output interface may include a display, a speaker, and the like. The output interface may output various notifications, messages, information, and the like generated by the processor.

Hereinafter, a preferred embodiment of the disclosure will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a refrigerator according to an embodiment of the disclosure. FIG. 2 shows a refrigerator according to an embodiment of the disclosure when doors open. FIG. 3 shows a storage room of a refrigerator according to an embodiment of the disclosure. FIG. 4 is a schematic side cross-sectional view of a refrigerator according to an embodiment of the disclosure. FIG. 5 is a cross-sectional view taken along line I-I of FIG. 2. FIG. 6 shows a top cover and a thermoelectric module according to an embodiment of the disclosure, separated from a main body of a refrigerator. FIG. 7 shows a heat dissipation duct cover, a heat dissipation duct body, an extension duct, and a thermoelectric module, according to an embodiment of the disclosure. FIG. 8 is a bottom perspective view showing a heat dissipation duct cover, a heat dissipation body, and a thermoelectric module, according to an embodiment of the disclosure.

Referring to FIGS. 1 to 8, a refrigerator 1 may include a main body 100, storage rooms 11, 12, and 13 formed inside the main body 100, and doors 21, 22, 23, and 24 provided to open or close the storage rooms 11, 12, and 13.

The main body 100 may include an inner case 170, an outer case 180 coupled to an outer side of the inner case 170, and an insulation 190 provided between the inner case 170 and the outer case 180. The inner case 170 may form the storage rooms 11, 12, and 13, and the outer case 180 may form an appearance of the main body 100. The insulation 190 may be a urethane foam insulation.

In another aspect, the main body 100 may include an upper wall 110, a lower wall 120, a left wall 130, a right wall 140, and a rear wall 150. The upper wall 110, the lower wall 120, the left wall 130, the right wall 140, and the rear wall 150 may respectively form an upper surface 111, a lower surface, a left surface, a right side, and a rear wall of the main body 100 of the main body 100.

Each of the upper wall 110, the lower wall 120, the left wall 130, the right wall 140, and the rear wall 150 may be composed of the inner case 170, the outer case 180, and the insulation 190. For example, the upper surface 111 of the upper wall 110 may be formed by the outer case 180, a lower surface of the upper wall 110 may be formed by the inner case 170, and the insulation 190 may be provided inside the upper wall 110.

The upper wall 110 may include an installation opening 115 (see FIG. 6). The storage room 11 may be connected to outside of the main body 100 through the installation opening 115. At least one portion of a thermoelectric module 500 which will be described below may be positioned inside the installation opening 115. The thermoelectric module 500 may penetrate the installation opening 115. The installation opening 115 may be formed at a location spaced from a center 112 in left-right direction X and front-rear direction Y of the upper surface 111 of the main body 100. The installation opening 115 may be located behind the center 112. The installation opening 115 may be formed at a location spaced from the center 112 in the left-right direction X.

The storage rooms 11, 12, and 13 may accommodate items. The storage rooms 11, 12, and 13 may open at the front sides to enable a user to put/take items in/out. The main body 100 may include a horizontal partition wall 160 that partitions the storage rooms 11, 12, and 13 into a first storage room 11 located at an upper position and storage rooms 12 and 13 located at lower positions, and a vertical partition wall 161 that partitions the lower storage rooms 12 and 13 into a second storage room 12 and a third storage room 13. The first storage room 11 may be a refrigerating room, the second storage room 12 may be a freezing room, and the third storage room 13 may be a temperature conversion room.

The doors 21, 22, 23, and 24 may open or close the storage rooms 11, 12, and 13. A first door 21 and a second door 22 may open or close the first storage room 11, a third door 23 may open or close the second storage room 12, and a fourth door 24 may open or close the third storage room 13. The doors 21, 22, 23, and 24 may be rotatably coupled to the main body 100.

The doors 21, 22, 23, and 24 may be rotatably coupled to the main body 100 by a hinge. For example, each of the first door 21 and the second door 22 may be rotatably coupled to the main body 100 by a hinge 31 provided in an upper portion of the main body 100 and a hinge provided in a middle portion of the main body 100. The hinge 31 may include a hinge pin protruding in a vertical direction to form a rotating shaft of the corresponding door. The hinge 31 may be covered by a top cover 300 provided to cover a front portion of the upper surface 111 of the main body 100.

In any one of the first door 21 and the second door 22, a rotating bar 40 for covering a gap formed between the first door 21 and the second door 22 while the first door 21 and the second door 22 are closed may be provided. The rotating bar 40 may be rotatably provided in any one of the first door 21 and the second door 22. The rotating bar 40 may have a bar shape extending in the vertical direction. The rotating bar 40 may be referred to as a pillar, a mullion, etc.

At an upper end of the rotating bar 40, a guide protrusion 46 may be provided, and a rotation guide 119 for guiding a rotation of the guide protrusion 46 may be provided at the upper portion of the main body 100.

Each of the doors 21, 22, 23, and 34 may include a gasket 51. The gasket 51 may be provided on a rear surface of each of the doors 21, 22, 23, and 24. The gasket 51 may be in close contact with a front surface of the main body 100 while each of the doors 21, 22, 23, and 24 is closed. Each of the doors 21, 22, 23, and 24 may include a dike protruding in a rear direction. On the dike 52, a door shelf 53 for storing items may be installed. The rotating bar 40 may be rotatably installed on the dike 52.

So far, the number and arrangement of the storage rooms and the number and arrangement of the doors have been described. However, the number and arrangement of the storage rooms and the number and arrangement of the doors of the refrigerator according to an embodiment of the disclosure are not limited thereto.

The refrigerator 1 may include a thermoelectric cooling device 400 for cooling the storage room 11.

The thermoelectric cooling device 400 may be provided in an upper side of the storage room 11 to cool the storage room 11. That is, the thermoelectric cooling device 400 may be provided in the upper wall 110 of the main body 100.

The thermoelectric cooling device 400 may include a thermoelectric module assembly 450. The thermoelectric module assembly 450 may include the thermoelectric module 500 and a heat dissipation duct 700. The thermoelectric module 500 and the heat dissipation duct 700 may be assembled with each other to form the thermoelectric module assembly 450.

The thermoelectric module assembly 450 may be coupled to the upper wall 110 of the main body 100 from above to below. After the thermoelectric module assembly 450 is coupled to the upper wall 110 of the main body 100 from above to below, a cooling duct 900 which will be described below may be coupled to the lower surface of the upper wall 110 of the main body 100 from below to above.

The thermoelectric module assembly 450 may be coupled to the upper wall 110 of the main body 100 by at least a coupling member S2 (see FIG. 6). The at least one coupling member S2 may be a mechanical element for coupling, such as a screw, a bolt, or the like.

The thermoelectric module 500 may include a thermoelectric element 530, a heat sink, and a module plate 550. The heat sink may include a heat dissipation sink 520 and a cooling sink 570.

The thermoelectric element 530 may be a semiconductor element that converts thermal energy into electrical energy using a thermoelectric effect, and may also be referred to as a thermoelectric semiconductor element, a Peltier element, etc.

The thermoelectric element 530 may include a heating part 531 and a heat absorbing part 532. While current is applied to the thermoelectric element 530, a heating action may occur in the heating part 531 and a heat absorbing action may occur in the heat absorbing part 532. The thermoelectric element 530 may have a thin hexahedral shape. The heating part 531 may be provided on one surface of the thermoelectric element 530, and the heat absorbing part 532 may be provided on the opposite surface.

The thermoelectric element 530 may be provided in the upper wall 110 such that the heating part 531 is positioned above the thermoelectric element 530 and the heat absorbing part 532 is positioned below the thermoelectric element 530. That is, the heating part 531 may face the outside of the main body 100 and the heat absorbing part 532 may face the inside of the storage room 11 through the installation opening 115 of the upper wall 110. Accordingly, air warmed by heat exchange with the heating part 531 may be discharged to the outside of the main body 100, and air cooled by heat exchange with the heat absorbing part 532 may be supplied to the storage room 11 to cool the storage room 11.

The heat dissipation sink 520 may absorb heat from the heating part 531 by contacting the heating part 531 and release the heat to the outside of the main body 100. The heat dissipation sink 520 may also be referred to as a hot sink, a heat dissipation sink, a hot heat sink, etc.

The heat dissipation sink 520 may be formed of a metal material having excellent thermal conductivity. For example, the heat dissipation sink 520 may be formed of aluminum or copper.

The heat dissipation sink 520 may include a heat dissipation sink base 521 that is in contact with the heating part 531 and a plurality of heat dissipation fins 525 that protrude from the heat dissipation sink base 521 to expand a heat transfer area. The heat dissipation sink base 521 may be positioned horizontally, and the plurality of heat dissipation fins 525 may protrude upward from the heat dissipation sink base 521. The heat dissipation sink base 521 and the plurality of heat dissipation fins 525 may be integrated into one body.

The cooling sink 570 may cool the storage room 11 by taking away heat of the storage room 11 and transferring the heat to the heat absorbing part 532. The cooling sink 570 may also be referred to as a cold sink, a cooling sink, a cooling heat sink, a cold heat sink, a cooling heat sink, etc.

The cooling sink 570 may be formed of a metal material having excellent thermal conductivity. For example, the cooling sink 570 may be formed of aluminum or copper.

The cooling sink 570 may include a cooling sink base 571 that is in contact with the heat absorbing part 532 and a plurality of cooling fins 575 that protrude from the cooling sink base 571 to expand a heat transfer area. The cooling sink base 571 may be positioned horizontally, and the plurality of cooling fins 525 may protrude downward from the cooling sink base 571. The cooling sink base 571 and the plurality of cooling fins 575 may be integrated into one body.

The module plate 550 may support the heat dissipation sink 520 and the cooling sink 570. The heat dissipation sink 520 may be positioned on one side of the module plate 550 and the cooling sink 570 may be positioned on another side of the module plate 550. That is, the heat dissipation sink 520 may be positioned on an upper side of the module plate 550 and the cooling sink 570 may be positioned on a lower side of the module plate 550.

The thermoelectric module 500 may include a heat dissipation fan 600 that moves air to efficiently exchange heat between the heat dissipation sink 520 and air outside the main body 100. The heat dissipation fan 600 may blow air toward the heat dissipation sink 520. The heat dissipation fan 600 may be positioned in a horizontal direction from the heat dissipation sink 520.

The heat dissipation fan 600 may be a centrifugal fan that intakes air in an axial direction and discharges the air in radial directions. The centrifugal fan may include a blower fan. A rotational shaft 610 of the heat dissipation fan 600 may be positioned vertically. The heat dissipation fan 600 may be installed in a fan case 650. The fan case 650 and the module plate 550 may be integrated into one body. However, unlike the current embodiment, the fan case 650 and the module plate 550 may be formed separately.

The heat dissipation duct 700 may guide air outside the main body 100 to exchange heat with the heat dissipation sink 520, and guide air that has exchanged heat with the heat dissipation sink 520 to be discharged back to the outside of the main body 100.

The heat dissipation duct 700 may be coupled to an upper side of the thermoelectric module 500. A duct coupling part 722 may be provided in a heat dissipation duct body 720, and a module coupling part 651 may be provided in the thermoelectric module 500. The module coupling part 651 may be coupled to the duct coupling part 722 in a hook or fitting manner. In FIGS. 7 and 8, the module coupling part 651 is shown as being provided in the fan case 650, but the module coupling part 651 may be provided in the module plate 550.

The heat dissipation duct 700 may include the heat dissipation duct body 720, a heat dissipation duct cover 710, and an extension duct 740.

The heat dissipation duct cover 710 may be coupled to an upper portion of the heat dissipation duct body 720 to cover an upper side of the heat dissipation duct body 720. A duct cover coupling part 711 may be provided in the heat dissipation duct cover 710, and a duct body coupling part 721 that is coupled to the duct cover coupling part 711 may be provided in the heat dissipation duct body 720. The duct body coupling part 721 may be coupled to the duct cover coupling part 711 in a hook or fitting manner.

The extension duct 740 may be provided in front of the heat dissipation duct body 720 and connected to the heat dissipation duct body 720. The extension duct 740 may be formed separately from the heat dissipation duct body 720. However, unlike this, the extension duct 740 may be integrated into the heat dissipation duct body 720.

The extension duct 740 may be positioned below the top cover 300 and may be coupled to a lower portion of the top cover 300. To this end, the extension duct 740 may be provided with an extension duct coupling part 745 coupled to the top cover 300.

The heat dissipation duct body 720 may be provided above the thermoelectric module 500 to cover the heat dissipation fan 600 and the heat dissipation sink 520. An outside air inlet 751 may be formed in an upper part of a front portion of the heat dissipation duct body 720, and the outside air inlet 751 may be covered by the top cover 300 which will be described later.

The heat dissipation duct 700 may include outside air outlets 782 and 794 that discharge air that has exchanged heat with the heat dissipation sink 520 to the outside of the main body 100. The outside air outlets 782 and 794 may include a first outside air outlet 782 that discharges warm air that has exchanged heat with the heat dissipation sink 520 to the outside of the main body 100, and a second outside air outlet 794 that discharges the warm air toward the rotating bar 40.

The heat dissipation duct body 720 may include the first outside air outlet 782. The first outside air outlet 782 may include a connection port 784 provided to guide air inside the heat dissipation duct 700 to the inside of the top cover 300, and an external discharge port 783 partitioned from the connection port 784 to discharge air of the heat dissipation duct 700 to the outside of the top cover 300.

High-temperature air guided into the inside of the top cover 300 through the connection port 784 may heat the upper surface 111 of the main body 100 while passing through the inside of the top cover 300. Accordingly, condensation on an upper front surface of the main body 100 may be prevented.

In the external discharge port 783, a grille may be formed to prevent foreign materials from entering the inside of the heat dissipation duct 700 through the external discharge port 783.

The extension duct 740 may include the second outside air outlet 794. High-temperature air discharged toward the rotating bar 40 through the second outside air outlet 794 may heat the rotating bar 40. Accordingly, condensation on the rotating bar 40 may be prevented.

However, the heat dissipation duct 700 may not include both the first outside air outlet 782 and the second outside air outlet 794, and according to some embodiments, the second outside air outlet 794 may be omitted.

Also, the first outside air outlet 782 of the heat dissipation duct 700 may not include both the connection port 784 and the external discharge port 783, and according to some embodiments, the connection port 784 may be omitted.

The heat dissipation duct body 720 may include a fan accommodation space 762 that accommodates the heat dissipation fan 600. The fan accommodation space 762 may be formed on a lower surface of the heat dissipation duct body 720. The heat dissipation duct body 720 may include a fan inlet 761 through which air flows into the fan accommodation space 762.

The heat dissipation duct body 720 may include a sink accommodation space 771 formed to a downstream side of the fan accommodation space 762 to accommodate the heat dissipation sink 520.

The heat dissipation duct body 720 may include an intake space 752 formed in the upper portion of the heat dissipation duct body 720 to guide air received through the outside air inlet 751 to the fan accommodation space 762. An upper side of the intake space 752 may open, and the open upper side of the intake space 752 may be covered by the heat dissipation duct cover 710. The intake space 752 may be formed to an upstream side of the fan accommodation space 762. The intake space 752 may be connected to the fan accommodation space 762 through the fan inlet 761.

The heat dissipation duct body 720 may include a first discharge space 781 formed in the upper surface of the heat dissipation duct body 720 to guide air that has exchanged heat with the heat dissipation sink 520 to the first outside air outlet 782. An upper side of the first discharge space 781 may open, and the open upper side of the first discharge space 781 may be covered by the heat dissipation duct cover 710. The first discharge space 781 may be formed to a downstream side of the sink accommodation space 771.

The heat dissipation duct body 720 may include a second discharge space 791 formed in the upper surface of the heat dissipation duct body 720 to guide air that has exchanged heat with the heat dissipation sink 520 to the second outside air outlet 794. An upper side of the second discharge space 791 may open, and the open upper side of the second discharge space 791 may be covered by the heat dissipation duct cover 710. The second discharge space 791 may be formed to the downstream side of the sink accommodation space 771.

The extension duct 740 may include an extension discharge space 746 connected to the second discharge space 791 of the heat dissipation duct body 720. Air inside the second discharge space 791 may be guided to the second outside air outlet 794 through the extension discharge space 746.

The refrigerator 1 may include the top cover 300 coupled to a front part of the upper surface 111 of the main body 100 to cover a plurality of hinges 31. The thermoelectric module assembly 450 may be coupled to the upper wall 110 of the main body 100 and then the top cover 300 may be coupled to the upper wall 110 of the main body 100. According to coupling of the top cover 300 to the upper wall 110 of the main body 100, the top cover 300 may press a front end of the thermoelectric module assembly 450 downward. Accordingly, the thermoelectric module assembly 450 may be more stably coupled to the upper wall 110. The top cover 300 may be coupled to the upper wall 110 of the main body 100 through at least one coupling member S3.

The thermoelectric cooling device 400 may include a dust filter 390 for filtering out foreign materials from air flowed into the outside air inlet 751. The dust filter 390 may be installed in the top cover 300 in such a way as to be slidable in the front-rear direction.

The top cover 300 may include an intake grille part 350 formed in an upper portion 310 of the top cover 300. The intake grille part 350 may be located above the dust filter 390. The intake grille part 350 may primarily block foreign materials from entering the inside of the heat dissipation duct 700 before the dust filter 390. The intake grille part 350 may protect the dust filter 390 by preventing an external force from being applied to the dust filter 390.

The top cover 300 may include front protrusions 313 protruding forward from both ends of the top cover 300 to cover the plurality of hinges 31. A top cover outlet 340 through which air inside the top cover 300 is discharged to the outside of the top cover 300 may be formed in each of the front protrusions 313.

Air of the heat dissipation duct 700 may flow into the inside of the top cover 300 through the connection port 784. The air flowed into the inside of the top cover 300 may heat the upper surface 111 of the main body 100 and be discharged to the outside of the top cover 300 through the top cover outlet 340.

The thermoelectric cooling device 400 may include a cooling fan 800 for moving air such that heat exchange between the cooling sink 570 and air inside the storage room 11 efficiently occurs.

The cooling fan 800 may blow air toward the cooling sink 570. The cooling fan 800 may be positioned in the horizontal direction from the cooling sink 570. The cooling fan 800 may be positioned inside the storage room 11. The cooling fan 800 may be positioned below the upper wall 110.

The cooling fan 800 may be a centrifugal fan that intakes air in an axial direction and discharges the air in radial directions. A rotating shaft 810 of the cooling fan 800 may be positioned perpendicular to the lower surface of the upper wall 110.

The thermoelectric cooling device 400 may include the cooling duct 900 for guiding air moving by the cooling fan 800. The cooling duct 900 may guide air inside the storage room 11 to exchange heat with the cooling sink 570, and guide air that has exchanged heat with the cooling sink 570 to be discharged to the inside of the storage room 11.

The cooling fan 800 may be positioned inside the cooling duct 900. The cooling sink 570 may be positioned inside the cooling duct 900 by penetrating an upper portion of the cooling duct 900. The cooling duct 900 may be coupled to the lower surface of the upper wall 110.

The cooling duct 900 may include an inside air inlet 991 through which air inside the storage room 11 enters the cooling duct 900, and an inside air outlet 992 through which air that has exchanged heat with the cooling sink 570 is discharged to the inside of the storage room 11.

The refrigerator 1 may include a freezing cycle device to cool the storage rooms 12 and 13 through a freezing cycle. The freezing cycle device may include a compressor 2, a condenser (not shown), an expansion device (not shown), and an evaporator 3. The evaporator 3 may be provided in the rear sides of the storage rooms 12 and 13.

The refrigerator 1 may include evaporator ducts 60 and 70 that guide cold air generated in the evaporator 3. A first evaporator duct 60 may be provided in the rear sides of the second storage room 12 and the third storage room 13. A second evaporator duct 70 may be provided in a rear side of the first storage room 11.

Cold air generated in the evaporator 3 may move into the first evaporator duct 60 by an evaporator fan 80. The cold air moved into the first evaporator duct 60 may be discharged to the second storage room 12 or the third storage room 13 through a cold air outlet (not shown) formed at a front portion of the first evaporator duct 60. In addition, the cold air moved into the first evaporator duct 60 may be guided to an internal flow path 78 of the second evaporator duct 70. A damper 61 may be provided in the first evaporator duct 60 to control supply of cold air inside the first evaporator duct 60 to the second evaporator duct 70. A connecting duct 90 may be provided between the first evaporator duct 60 and the second evaporator duct 70 to connect the first evaporator duct 60 and the second evaporator duct 70.

Cold air flowed into the internal flow path 78 of the second evaporator duct 70 may be supplied to the first storage room 11 through the cold air outlet 72 formed at the front portion of the second evaporator duct 70.

As such, according to an embodiment of the disclosure, the refrigerator 1 may include the thermoelectric cooling device 400 and the freezing cycle device, although not limited thereto. However, the refrigerator 1 may include only the thermoelectric cooling device 400.

FIG. 9 is an exploded perspective view of a thermoelectric module according to an embodiment of the disclosure. FIG. 10 is an exploded bottom perspective view of a thermoelectric module according to an embodiment of the disclosure. FIG. 11 is a perspective view of a module plate according to an embodiment of the disclosure. FIG. 12 is a bottom perspective view of a module plate according to an embodiment of the disclosure. FIG. 13 is a cross-sectional view of a heat dissipation duct and a thermoelectric module according to an embodiment of the disclosure.

Referring to FIGS. 9 to 13, the thermoelectric module 500 will be described in more detail.

The thermoelectric module 500 may include the thermoelectric element 530 having the heating part 531 and the heat absorbing part 532, the heat dissipation sink 520 that is in contact with the heating part 531 of the thermoelectric element 530, the cooling sink 570 that is in contact with the heat absorbing part 532 of the thermoelectric element 530, and the module plate 550 on which the thermoelectric element 530, the heat dissipation sink 520, and the cooling sink 570 are mounted.

The module plate 550 may serve as a frame of the thermoelectric module 500. The module plate 550 may be formed of a resin material having low thermal conductivity. The module plate 550 may support the heat dissipation sink 520 and the cooling sink 570. The module plate 550 may maintain a gap between the heat dissipation sink 520 and the cooling sink 570.

The module plate 550 may include a plate base 552. The plate base 552 may be positioned horizontally. The plate base 552 may support the heat dissipation sink 520. The plate base 552 may support the heat dissipation sink 520 by contacting a lower surface of the heat dissipation sink base 521. The plate base 552 may have a size and shape corresponding to the heat dissipation sink 520. The plate base 552 may have a quadrangular shape.

The module plate 550 may include a wing portion 557 supported on an upper surface of the main body 100. More specifically, the wing portion 557 may be supported on an upper surface of the upper wall 110 of the main body 100 around the installation opening 115.

The wing portion 557 may be formed horizontally. The wing portion 557 may be formed on an edge of the plate base 552. The wing portion 557 may be formed to have a step with respect to the plate base 552. That is, the wing portion 557 may be provided at a higher position than the plate base 552. Accordingly, while the wing portion 557 is supported on the upper surface of the main body 100 around the installation opening 115, the plate base 552 may be positioned inside the installation opening 115.

The module plate 550 may include a connecting portion 556 connecting the plate base 552 and the wing portion 557. The connecting portion 556 may be formed vertically. The heat dissipation sink 520 may be positioned in a space formed by the plate base 552 and the connecting portion 556. The plate base 552, the wing portion 557, and the connecting portion 556 may be integrated into one body.

The module plate 550 may include a module plate opening 551. The module plate 550 may include an element mounting portion 555 forming the module plate opening 551. The element mounting portion 555 may protrude from a lower surface of the plate base 552.

The thermoelectric element 530 may be positioned inside the module plate opening 551. A vertical length (that is, a vertical length of the element mounting portion 555) of the module plate opening 551 may be greater than a vertical length of the thermoelectric element 530, and the thermoelectric element 530 may be positioned close to an upper end of the module plate opening 551.

A reason why the thermoelectric element 530 is positioned at the upper end of the module plate opening 551 may be because a heat generation amount of the thermoelectric element 530 is generally higher than a heat absorption amount of the thermoelectric element 530, and positioning the thermoelectric element 530 at the upper end of the module plate opening 551 is advantageous for heat dissipation of the heating part 531, and overall operating efficiency of the thermoelectric element 530 may increase.

Because the thermoelectric element 530 is positioned at the upper end of the module plate opening 551, the cooling sink 570 may include a cooling conductive portion 574 protruding from the cooling sink base 571 to contact the heat absorbing part 532 of the thermoelectric element 530. The cooling conductive portion 574 may be formed integrally with the cooling sink base 571. The cooling conductive portion 574 may be inserted into the module plate opening 551 from below to above to contact the heat absorbing part 532 of the thermoelectric element 530.

The thermoelectric module 500 may include an element insulator 540 that insulates the module plate 550 and the thermoelectric element 530. The element insulator 540 may be positioned in the module plate opening 551 to prevent the thermoelectric element 530 from contacting the module plate 550. The element insulator 540 may surround side surfaces of the thermoelectric element 530. The element insulator 540 may include an element insulator body 543 and an element insulator cover 542 coupled to an upper side of the element insulator body 543. The element insulator 540 may be formed of a resin material having low thermal conductivity. For example, the element insulator 540 may be formed of a silicon material.

The module plate 550 may include an insulator fixing protrusion 555a formed on the element mounting portion 555 to fix the element insulator 540. The insulator fixing protrusion 555a may protrude from inner side surfaces of the element mounting portion 555 toward the module plate opening 551. The insulator fixing protrusion 555a may be inserted into sides of the element insulator body 543 to fix the element insulator body 543.

The thermoelectric module 500 may include a sink insulator 580 provided between the module plate 550 and the cooling sink 570. The sink insulator 580 may prevent heat from being transferred between the heat dissipation sink 520 and the cooling sink 570 through the module plate 550. The sink insulator 580 may include a sink insulator opening 581.

The sink insulator 580 may support an upper surface of the cooling sink 570. However, according to some embodiments, the sink insulator 580 may be omitted. In this case, the cooling sink 570 may be supported by contacting a lower surface of the module plate 550. Alternatively, the sink insulator 580 may be provided between the heat dissipation sink 520 and the module plate 550.

The heat dissipation sink 520 may include the heat dissipation sink base 521 and the plurality of heat sink fins 525 protruding from the heat dissipation sink base 521. The lower surface of the heat dissipation sink base 521 may be supported on the module plate 550.

The heat dissipation sink 520 and the cooling sink 570 may be coupled to the module plate 550 through a coupling member S1. The coupling member S1 may be a mechanical element for coupling, such as a screw or bolt.

In the heat dissipation sink 520, a heat sink through hole 523 which the coupling member S1 penetrates may be formed. In the module plate 550, a plate through hole 553 which the coupling member S1 penetrates may be formed. The plate through hole 553 may be formed adjacent to the element mounting portion 555. The plate through hole 553 may be formed in the plate base 552.

In the cooling sink 570, a cooling sink through hole 573 which the coupling member S1 penetrates may be formed.

The thermoelectric module 500 may include a washer member 510 supported between a head of the coupon member S1 and the heat dissipation sink 520. The washer member 510 may be provided between the head of the coupling member S1 and the heat dissipation sink 520 to prevent the coupling member S1 from contacting the heat dissipation sink 520 and reduce heat transfer of the heat dissipation sink 520 to the coupling member S1. A loosening prevention member 502 may be provided between the head of the fastening member S1 and the washer member 510 to prevent loosening of the coupling member S1.

The thermoelectric module 500 may include a nut member 590 coupled to another end of the coupling member S1, which is opposite to the head. The nut member 590 may be supported on the cooling sink 570. The nut member 590 may be provided between the other end of the coupling member S1, which is opposite to the head, and the cooling sink 570 to prevent the coupling member S1 from contacting the cooling sink 570 and reduce transfer of cold air of the cooling sink 570 through the coupling member S1.

Upon coupling of the heat dissipation sink 520 and the cooling sink 570 to the module plate 550 through the coupling member S1, the heat dissipation sink 520 and the cooling sink 570 may be coupled to the module plate 550 through the coupling member S1 after the element insulator 540 and the thermoelectric element 530 are positioned in the module plate opening 551 of the module plate 550. Accordingly, while the heat dissipation sink 520 and the cooling sink 570 are fixed to the module plate 550, the thermoelectric element 530 may also be fixed simultaneously.

The heating part 531 of the thermoelectric element 530 may be supported and fixed by the heat dissipation sink 520, the heat absorbing part 532 of the thermoelectric element 530 may be supported and fixed by the cooling sink 570, and a side connecting the heating part 531 and the heat absorbing part 532 of the thermoelectric element 530 may be supported and fixed by the inner surface of the element insulator 540.

As such, the heat dissipation sink 520 and the cooling sink 570 may be easily assembled with the module plate 550 by the coupling member S1. In addition, because the heat dissipation sink 520 is in close contact with the heating part 531 of the thermoelectric element 530 and the cooling sink 570 is in close contact with the heat absorbing part 532 of the thermoelectric element 530, heat exchange between the heat dissipation sink 520 and the heating part 531 of the thermoelectric element 530 and heat exchange between the cooling sink 570 and the heat absorbing part 532 of the thermoelectric element 530 may efficiently occur, which may increase efficiency of the thermoelectric module 500.

FIG. 14 is an exploded view of an inner case, an outer case, and a connection frame, according to an embodiment of the disclosure. FIG. 15 shows a connecting frame according to an embodiment of the disclosure. FIG. 16 is a cross-sectional view of an upper wall of a main body according to an embodiment of the disclosure. FIG. 17 is a cross-sectional view showing a state in which a heat dissipation duct and a thermoelectric module are coupled to an upper wall of a main body according to an embodiment of the disclosure. FIG. 18 is an enlarged view of a concave portion of FIG. 17.

Referring to FIGS. 14 to 18, the inner case 170 forming the upper wall 110 of the main body 100 may include an inner opening 171. The outer case 180 forming the upper wall 100 of the main body 100 may include an outer opening 181. The inner opening 171 may be larger than the outer opening 181. However, unlike the current embodiment, the inner opening 171 and the outer opening 181 may have the same size. In this case, a connecting frame 200 which will be described below may be composed of only a connecting body 270 without a connecting frame base 210.

The main body 100 may include the connecting frame 200 provided between the inner case 170 and the outer case 180 to connect the inner opening 171 and the outer opening 181. The connecting frame 200 may include the installation opening 115 described above. That is, the installation opening 115 of the upper wall 110 of the main body 100 may be formed by the connecting frame 200.

One surface of the connecting frame 200 may be supported on an inner surface (surface facing the insulation) of the inner case 170, and another surface of the connecting frame 200 may be supported on an inner surface (surface facing the insulation) of the outer case 180.

Because the connecting frame 200 is positioned between the inner case 170 and the outer case 180, an insulating space may be formed by the inner case 170, the outer case 180, and the connecting frame 200. By filling and foaming foamed insulation in the insulating space, the inner case 170, the outer case 180, and the connecting frame 200 may be coupled with each other. The connecting frame 200 may be formed of a material having low thermal conductivity. The connecting frame 200 may be formed of a resin material.

The connecting frame 200 may include the frame base 210 connected to the inner opening 171, and the frame body 270 protruding from an upper surface of the frame base 210 and connected to the outer opening 181.

The frame base 210 may have a size corresponding to the size of the inner opening 171. The frame base 210 may include a frame base opening 211.

The frame base 210 may include a sink end support 220 formed around the frame base opening 211. The sink end support 220 may protrude inward toward the frame base opening 211 to support an end 571a of the cooling sink 570.

The frame body 270 may have a quadrangular frame shape with a preset thickness. The frame body 270 may include a frame body opening 271. The frame body opening 271 may have a size corresponding to the outer opening 181. The frame base opening 211 and the frame body opening 271 may form the installation opening 115.

The frame body 270 may include a middle support 275 protruding to support an end of the plate base 552 of the module plate 550. The middle support 275 may protrude from an inner surface of the frame body 270 toward the frame body opening 271.

The frame base 210 and the frame body 270 may be provided separately and coupled to each other. The frame base 210 and the frame body 270 may be coupled to each other through a frame coupling member 201. To this end, a coupling hole 240 may be formed in the frame base 210 and a coupling hole 280 corresponding to the coupling hole 240 may be formed in the frame body 270. The frame coupling member 201 may be a mechanical element for coupling, such as a screw, a pin, a bolt, a rivet, etc.

However, according to an embodiment, the frame base 210 and the frame body 270 may be integrated into one body.

The thermoelectric module 500 may be coupled to the upper wall 110 through the at least one coupling member S2 (see FIGS. 6 and 18). That is, the at least one coupling member S2 may be coupled to the upper wall 110 of the main body 100 by penetrating the module plate 550 of the thermoelectric module 500 to couple the thermoelectric module 500 to the upper surface of the main body 100.

More specifically, the at least one coupling member S2 may be coupled to the thermoelectric module 500 and the connecting frame 200 by penetrating the outer case 180. However, according to some embodiments, the connecting frame 200 may be exposed to the outside of the outer case 180, and in this case, the coupling member S2 may be coupled to the connecting frame 200 without penetrating the outer case 180.

In the drawings, four coupling members S2 are shown. However, the number of the coupling members S2 is not limited thereto. The coupling member S2 (see FIGS. 6 and 18) for coupling the thermoelectric module 500 to the main body 100 may be distinguished from the coupling member S1 (see FIGS. 9, 10, 13, and 17) for assembling the thermoelectric module 500 itself described above.

A plate through hole 554 which the coupling member S2 penetrates may be formed in the module plate 550. The plate through hole 554 may be formed in the wing portion 557 of the module plate 550. The plate through hole 554 which the coupling member S2 penetrates may be distinguished from the aforementioned plate through hole 553 which the coupling member S1 penetrates, and may be spaced apart from the plate through hole 553.

An outer case through hole 182 which the coupling member S2 penetrates may be formed in the outer case 180. A coupling hole 290 to which the coupling member S2 is coupled may be formed in the frame body 270 of the connecting frame 200. Screw threads may be formed in an inner circumferential surface of the coupling hole 290 such that the coupling member S2 is screwed to the coupling hole 290.

The coupling member S2 may be coupled to the coupling hole 290 of the connecting frame 200 by penetrating the plate through hole 554 of the module plate 550 and the outer case through hole 182 of the outer case 180.

As described above, the thermoelectric module 500 may be firmly and stably fixed to the upper wall 110 by the coupling member S2. By coupling the coupling member S in a state of placing the wing portion 557 of the thermoelectric module 500 on the upper surface of the main body 100 around the installation opening 115, the thermoelectric module 500 may be easily installed, and also, by releasing the coupling member S1, the thermoelectric module 500 may be easily separated.

According to installing of the thermoelectric module in the upper wall 110 of the main body 100, the end 571a of the cooling sink base 570 may be supported by the sink end support 220 of the connecting frame 200. That is, the cooling sink 570 located below the thermoelectric module 500 may be supported by the connecting frame 200.

The heat dissipation sink 520, the thermoelectric element 530, and the cooling sink 570 may be vertically stacked, and while a downward force is applied to the heat dissipation sink 520, the thermoelectric element 530, and the cooling sink 570 by gravity, the cooling sink 571 located at a lowest position may be supported by the connecting frame 200, and as a result, the heat dissipation sink 520, the thermoelectric element 530, and the cooling sink 570 may be in close contact with each other.

That is, the heat dissipation sink 520 and the heating part 531 of the thermoelectric element 530 may be in close contact with each other, and the cooling sink 570 and the heat absorbing part 532 of the thermoelectric element 530 may be in close contact with each other. Accordingly, heat exchange between the heat dissipation sink 520 and the heating part 531 may efficiently occur, and heat exchange between the cooling sink 570 and the heat absorbing part 532 may efficiently occur. Accordingly, the storage room 11 may be efficiently cooled through the thermoelectric module 500.

A sealing member (not shown) may be provided between the module plate 550 and the outer case 180.

Also, the heat dissipation duct 700 may be coupled to the main body 100 through the coupling member S2. That is, the coupling member S2 may penetrate the heat dissipation duct 700 and the module plate 550 sequentially and be coupled to the connecting frame 200 of the main body 100. In other words, the coupling member S2 may penetrate the thermoelectric module assembly 450 and be coupled to the main body 100.

In the heat dissipation duct cover 710, a duct cover through hole 719 (see FIG. 8) may be formed, and a duct body through hole 729 (see FIG. 8) may be formed in the heat dissipation body 720. The coupling member S2 may penetrate the duct cover through hole 719, the duct body through hole 729, and the plate through hole 554 and be coupled to the connecting frame 200.

FIG. 19 is a cross-sectional view showing a state in which a heat dissipation duct and a thermoelectric module are coupled to an upper wall of a main body according to an embodiment of the disclosure. FIG. 20 is a cross-sectional view showing a state in which a heat dissipation duct and a thermoelectric module are coupled to an upper wall of a main body according to an embodiment of the disclosure.

As shown in FIG. 19, according to an embodiment, the coupling member S2 may penetrate the heat dissipation sink 520 of the thermoelectric module 500, instead of the module plate 550 of the thermoelectric module 500, to couple the thermoelectric module 500 to the main body 100.

The heat dissipation sink 520 may include a heat sink extension 524 extending horizontally from the heat dissipation sink base 521, and an extension through hole 524a which the coupling member S2 penetrates may be formed in the heat sink extension 524. The wing portion 557 of the module plate 550 may be omitted, and the heat sink extension 524, instead of the wing portion 557, may be supported on the upper surface of the main body 100 around the installation opening 115.

By passing the coupling member S2 through the heat dissipation sink 520 and coupling the coupling member S2 to the connecting frame 200 of the main body 100, the thermoelectric module 500 may be coupled to the main body 100.

As shown in FIG. 20, according to an embodiment, the thermoelectric module 500 may not be directly coupled to the main body 100. Instead, the thermoelectric module 500 may be indirectly coupled to the main body 100 by coupling the heat dissipation duct 700 to which the thermoelectric module 500 is coupled to the main body 100. That is, the thermoelectric module 500 may be coupled to the main body 100 in such a way that the thermoelectric module 500 hangs on the heat dissipation duct 700.

The thermoelectric module 500 may be coupled to the heat dissipation duct 700 through a coupling member S4. For example, the coupling member S4 may be coupled to the module plate 550 of the thermoelectric module 500 by penetrating the heat dissipation duct cover 710 and the heat dissipation duct body 720.

The heat dissipation duct 700 may be coupled to the main body 100 through a separate coupling member S5. For example, the coupling member S5 may be coupled to the connecting frame 200 of the main body 100 by penetrating the heat dissipation duct body 720.

So far, although the technical concept of the disclosure has been described based on specific embodiments, the scope of rights of the disclosure is not limited to these embodiments. It should be interpreted that various embodiments modified or changed by a person skilled in the art within a scope not deviating from the gist of the disclosure as the technical concept of the disclosure, which is defined in the claims, also belong to the scope of rights of the disclosure.

Claims

1. A refrigerator comprising: a main body;a storage room inside the main body;a thermoelectric module including: a module plate including an element mounting portion,a heat dissipation sink on a first side of the module plate,a cooling sink on a second side of the module plate, anda thermoelectric element positioned in the element mounting portion such that a first surface of the thermoelectric element contacts the heat dissipation sink and a second surface of the thermoelectric element contacts the cooling sink; anda coupling member penetrating the module plate of the thermoelectric module to couple the thermoelectric module to an upper surface of the main body.

2. The refrigerator of claim 1, wherein the main body includes: an inner case,an outer case coupled to an outer side of the inner case, anda connecting frame between the inner case and the outer case.

3. The refrigerator of claim 2, wherein the coupling member is coupled to the connecting frame.

4. The refrigerator of claim 3, wherein the coupling member penetrates the outer case to be coupled to the connecting frame.

5. The refrigerator of claim 2, wherein the connecting frame includes an installation opening connecting the storage room to outside of the main body.

6. The refrigerator of claim 5, wherein at least one portion of the thermoelectric module is positioned inside the installation opening.

7. The refrigerator of claim 1, wherein the module plate includes a wing portion supported on the upper surface of the main body.

8. The refrigerator of claim 7, wherein the module plate includes a plate base configured to support the heat dissipation sink.

9. The refrigerator of claim 8, wherein the wing portion is stepped relative to the plate base, andthe module plate includes a connecting portion connecting the plate base to the wing portion.

10. The refrigerator of claim 8, wherein the main body includes: an inner case,an outer case coupled to an outer side of the inner case, anda connecting frame between the inner case and the outer case, andthe connecting frame includes a middle support protruding to support an end of the plate base of the module plate.

11. The refrigerator of claim 1, wherein the main body includes: an inner case,an outer case coupled to an outer side of the inner case, anda connecting frame between the inner case and the outer case, andthe connecting frame comprises a sink end support protruding to support an end of the cooling sink.

12. The refrigerator of claim 1, wherein the thermoelectric module includes a coupling member penetrating the heat dissipation sink, the module plate, and the cooling sink to couple the heat dissipation sink and the cooling sink to the module plate.

13. The refrigerator of claim 1, wherein the thermoelectric module includes a sink insulator between the module plate and the cooling sink.

14. The refrigerator of claim 1, further comprising: a heat dissipation duct coupled to the thermoelectric module and configured to dissipate heat from the heat dissipation sink.

15. The refrigerator of claim 14, wherein the heat dissipation duct is coupled to the thermoelectric module by the coupling member.